JPH0551392B2 - - Google Patents
Info
- Publication number
- JPH0551392B2 JPH0551392B2 JP60025580A JP2558085A JPH0551392B2 JP H0551392 B2 JPH0551392 B2 JP H0551392B2 JP 60025580 A JP60025580 A JP 60025580A JP 2558085 A JP2558085 A JP 2558085A JP H0551392 B2 JPH0551392 B2 JP H0551392B2
- Authority
- JP
- Japan
- Prior art keywords
- flux
- wiring board
- liquid
- air
- flux liquid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 230000004907 flux Effects 0.000 claims description 87
- 239000007788 liquid Substances 0.000 claims description 44
- 239000007921 spray Substances 0.000 claims description 22
- 238000000034 method Methods 0.000 claims description 20
- 230000006698 induction Effects 0.000 claims description 8
- 239000007787 solid Substances 0.000 claims description 8
- 239000000758 substrate Substances 0.000 claims description 8
- 238000002347 injection Methods 0.000 claims description 7
- 239000007924 injection Substances 0.000 claims description 7
- 239000000843 powder Substances 0.000 claims description 7
- 239000003595 mist Substances 0.000 claims description 4
- 238000005507 spraying Methods 0.000 claims description 4
- 238000001704 evaporation Methods 0.000 claims description 3
- 239000002904 solvent Substances 0.000 description 17
- 238000005476 soldering Methods 0.000 description 13
- 238000005187 foaming Methods 0.000 description 10
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 6
- 239000011248 coating agent Substances 0.000 description 6
- 238000000576 coating method Methods 0.000 description 6
- 229910000679 solder Inorganic materials 0.000 description 6
- 239000007789 gas Substances 0.000 description 5
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 230000006866 deterioration Effects 0.000 description 3
- 239000000428 dust Substances 0.000 description 3
- 230000007246 mechanism Effects 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 2
- 238000007664 blowing Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 2
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 239000005456 alcohol based solvent Substances 0.000 description 1
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 239000006260 foam Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000000779 smoke Substances 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3489—Composition of fluxes; Methods of application thereof; Other methods of activating the contact surfaces
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2558085A JPS61186165A (ja) | 1985-02-13 | 1985-02-13 | フラツクスの塗布方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2558085A JPS61186165A (ja) | 1985-02-13 | 1985-02-13 | フラツクスの塗布方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS61186165A JPS61186165A (ja) | 1986-08-19 |
JPH0551392B2 true JPH0551392B2 (pt) | 1993-08-02 |
Family
ID=12169855
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2558085A Granted JPS61186165A (ja) | 1985-02-13 | 1985-02-13 | フラツクスの塗布方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS61186165A (pt) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4821948A (en) * | 1988-04-06 | 1989-04-18 | American Telephone And Telegraph Company | Method and apparatus for applying flux to a substrate |
JPH0376658U (pt) * | 1989-11-22 | 1991-07-31 | ||
JP2538702B2 (ja) * | 1990-06-28 | 1996-10-02 | 日本電気株式会社 | 噴霧式フラックス塗布装置 |
JPH0756121Y2 (ja) * | 1991-01-09 | 1995-12-25 | 権士 近藤 | フラクサ |
JP5910787B1 (ja) * | 2015-10-22 | 2016-04-27 | 千住金属工業株式会社 | フラックス回収装置 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS55147777U (pt) * | 1979-04-09 | 1980-10-23 |
-
1985
- 1985-02-13 JP JP2558085A patent/JPS61186165A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS61186165A (ja) | 1986-08-19 |
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