JPH0551392B2 - - Google Patents
Info
- Publication number
- JPH0551392B2 JPH0551392B2 JP60025580A JP2558085A JPH0551392B2 JP H0551392 B2 JPH0551392 B2 JP H0551392B2 JP 60025580 A JP60025580 A JP 60025580A JP 2558085 A JP2558085 A JP 2558085A JP H0551392 B2 JPH0551392 B2 JP H0551392B2
- Authority
- JP
- Japan
- Prior art keywords
- flux
- wiring board
- liquid
- air
- flux liquid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 230000004907 flux Effects 0.000 claims description 87
- 239000007788 liquid Substances 0.000 claims description 44
- 239000007921 spray Substances 0.000 claims description 22
- 238000000034 method Methods 0.000 claims description 20
- 230000006698 induction Effects 0.000 claims description 8
- 239000007787 solid Substances 0.000 claims description 8
- 239000000758 substrate Substances 0.000 claims description 8
- 238000002347 injection Methods 0.000 claims description 7
- 239000007924 injection Substances 0.000 claims description 7
- 239000000843 powder Substances 0.000 claims description 7
- 239000003595 mist Substances 0.000 claims description 4
- 238000005507 spraying Methods 0.000 claims description 4
- 238000001704 evaporation Methods 0.000 claims description 3
- 239000002904 solvent Substances 0.000 description 17
- 238000005476 soldering Methods 0.000 description 13
- 238000005187 foaming Methods 0.000 description 10
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 6
- 239000011248 coating agent Substances 0.000 description 6
- 238000000576 coating method Methods 0.000 description 6
- 229910000679 solder Inorganic materials 0.000 description 6
- 239000007789 gas Substances 0.000 description 5
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 230000006866 deterioration Effects 0.000 description 3
- 239000000428 dust Substances 0.000 description 3
- 230000007246 mechanism Effects 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 2
- 238000007664 blowing Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 2
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 239000005456 alcohol based solvent Substances 0.000 description 1
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 239000006260 foam Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000000779 smoke Substances 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3489—Composition of fluxes; Methods of application thereof; Other methods of activating the contact surfaces
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は、電子部品を取付けた配線基板を、自
動半田付装置で半田付けする工程におけるフラツ
クスの塗布方法に関するものである。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a method for applying flux in the process of soldering a wiring board to which electronic components are attached using an automatic soldering device.
（従来の技術）
一般にプリント基板の配線基板に電子部品を取
付けて半田付けする場合、フラツクス塗布装置
と、プリヒータよび半田槽とを一体に組込み、コ
ンベヤーチエーンで配線基板を自動的に搬送しな
がら半田付けする自動半田付装置が用いられてい
る。(Prior art) Generally, when electronic components are attached and soldered to the wiring board of a printed circuit board, a flux applicator, a preheater, and a solder bath are integrated into one unit, and the wiring board is automatically transported by a conveyor chain while soldering. An automatic soldering device is used.
従来、フラツクス塗布装置におけるフラツクス
の塗布方法としては、発泡式のものが多く用いら
れている。これはフラツクス槽の内部に発泡管を
取付け、空気を送つてフラツクス液を泡立てて発
泡したフラツクス液を、配線基板の下面に接触さ
せて塗布する方法である。 Conventionally, a foaming method is often used as a method for applying flux in a flux application device. This is a method in which a foaming tube is installed inside a flux tank, air is sent to foam the flux liquid, and the foamed flux liquid is applied in contact with the lower surface of the wiring board.
しかしながら、この発泡式の方法では、塗布膜
厚の調整が難しく、基板下面にフラツクスが厚く
不均一に塗布され、半田付け不良を招くとともに
フラツクス液の使用量も多くなり、しかも塗布面
がベタついているため、ゴミ等が付着するなどの
欠点がある。また最適な発泡状態を得るために
は、気温に応じて溶剤の配合量を調整してフラツ
クス液の濃度を調整する必要があり準備作業に手
間がかかる。 However, with this foaming method, it is difficult to adjust the thickness of the coating film, and the flux is coated thickly and unevenly on the bottom surface of the board, leading to poor soldering, requiring a large amount of flux liquid, and leaving the coated surface sticky. Because of this, there are drawbacks such as the adhesion of dust, etc. In addition, in order to obtain the optimum foaming state, it is necessary to adjust the concentration of the flux liquid by adjusting the amount of solvent blended depending on the temperature, which requires time and effort in preparation work.
また発泡のための圧縮空気に含まれる水分によ
り、フラツクス液が次第に劣化し、蒸発量も多
い。また発泡状態が激しいと、配線基板の上面に
までフラツクス液が廻り込んで部品が汚れ特にス
イツチにフラツクスが被ると、製品不良となる問
題があつた。 Furthermore, the flux liquid gradually deteriorates due to the moisture contained in the compressed air used for foaming, and the amount of evaporation increases. In addition, if the foaming state is severe, the flux liquid may penetrate to the upper surface of the wiring board, contaminating the parts, and in particular, if the switch is covered with flux, there is a problem that the product may be defective.
このため、フラツクス液を自動スプレーノズル
でスプレー噴射して塗布する方法が研究され例え
ば実開昭55−147777号にその基本的な考え方が提
案されている。 For this reason, research has been conducted on a method of applying the flux liquid by spraying it with an automatic spray nozzle, and the basic concept thereof has been proposed, for example, in Japanese Utility Model Application No. 147777/1983.
これはフラツクス液をノズルから霧状にして配
線基板の下面から噴射して、均一な塗布膜を形成
することができる利点がある。 This has the advantage that a uniform coating film can be formed by atomizing the flux liquid from a nozzle and spraying it from the bottom surface of the wiring board.
しかしながら、霧状のフラツクス液が配線基板
の上面に廻り込んで、部品の表面にフラツクスが
付着する問題が解決できず、また飛散したフラツ
クス液がフードに付着して汚れる上、ガスによる
作業環境の悪化など、実用化に至つていないのが
現状である。 However, this does not solve the problem of atomized flux liquid getting onto the top surface of the wiring board and causing flux to adhere to the surface of the parts.Furthermore, the scattered flux liquid adheres to the hood and makes it dirty, and the work environment is affected by gas. The current situation is that it has not been put into practical use due to problems such as deterioration.
（発明が解決しようとする問題点）
本発明は、スプレー噴射方式の問題点を解決す
べく、種々研究を行つた結果、フラツクスを被塗
布面に薄く均一に塗布し、フラツクスの試用量を
半減できると共に、基板上面へのフラツクスの被
りもなく、また基板上のゴミも同時に除去でき、
塗布面のベタツキもなく、製品歩留や作業性を向
上でき、しかもフラツクス液の劣化を促進する水
分の混入や蓄積がなく、揮発性ガスの拡散や装置
の汚れもなく、フラツクスを液体状で捕集するこ
とができるフラツクスの塗布方法を提供するもの
である。(Problems to be Solved by the Invention) As a result of various research conducted in order to solve the problems of the spray injection method, the present invention was developed by applying flux thinly and uniformly to the surface to be coated, and reducing the trial amount of flux by half. At the same time, there is no flux covering the top surface of the board, and dust on the board can be removed at the same time.
There is no stickiness on the applied surface, improving product yield and workability.Furthermore, there is no contamination or accumulation of moisture that promotes deterioration of the flux liquid, no diffusion of volatile gases, and no soiling of equipment, and the flux can be applied in liquid form. The present invention provides a method for applying flux that can be collected.
（問題点を解決するための手段） 以下本発明方法を図面を参照して説明する。(Means for solving problems) The method of the present invention will be explained below with reference to the drawings.
第１図は本発明方法に用いる自動半田付装置の
概略構成を示すもので、上面を開口した本体フレ
ーム１の内側にコンベヤーチエーン２が設けら
れ、ここに所定の間隔で複数の基板搬送キヤリヤ
ー３が取付けられ、矢印方向に連続的に移動する
ようになつている。 FIG. 1 shows a schematic configuration of an automatic soldering apparatus used in the method of the present invention, in which a conveyor chain 2 is provided inside a main body frame 1 with an open top surface, and a plurality of substrate conveyance carriers 3 are connected at predetermined intervals. is attached so that it can move continuously in the direction of the arrow.
４は自動スプレーノズルで、ボツクス５内に取
付けられ、前記自動スプレーノズル４は、フラツ
ク液６を入れたフラツクス槽７に接続されてい
る。８はプリヒータ、９は溶融半田を入れた静止
型半田槽で、これらは一連に本体フレーム１内に
取付けられている。 Reference numeral 4 denotes an automatic spray nozzle, which is installed in a box 5, and the automatic spray nozzle 4 is connected to a flux tank 7 containing a flux liquid 6. 8 is a preheater, and 9 is a stationary solder tank containing molten solder, which are installed in series within the main body frame 1.
また前記自動スプレーノズル４の上方に位置す
る本体フレーム１の上部にはフード１０が設けら
れ、更にこの上部に誘引フアン１１が取付けら
れ、これから引出されたダクトに図示しないフイ
ルターが設けられている。またこのフード１０
は、側面が開口したカバー１２内に取付けられ、
このカバー１２の静止型半田槽９の上方には排煙
ダクト１３が取付けられている。 Further, a hood 10 is provided on the upper part of the main body frame 1 located above the automatic spray nozzle 4, and an induction fan 11 is further attached to the upper part, and a filter (not shown) is provided in a duct drawn out from the hood 10. Also this food 10
is installed in a cover 12 with an open side surface,
A smoke exhaust duct 13 is attached above the stationary solder tank 9 of the cover 12.
なお図においては１４は駆動プーリー、１５は
スプロケツトホイール、１６はリミツトスイツチ
である。 In the figure, 14 is a drive pulley, 15 is a sprocket wheel, and 16 is a limit switch.
第２図はフラツクス塗布装置の構成を示すもの
で、自動スプレーノズル４は前述の如く、フラツ
クス槽７に液供給管１７で接続され、更に２本の
エアー配管１８Ａ，１８Ｂが、接続されている。 FIG. 2 shows the configuration of the flux coating device, in which the automatic spray nozzle 4 is connected to the flux tank 7 through the liquid supply pipe 17, and two air pipes 18A and 18B are further connected thereto. .
一方のエアー敗管１８Ａは、バルブ１９とエア
ーレギユレター２０および、エアーフイルター２
１が取付けられた吹き付け圧縮空気の供給管であ
る。 One air defeat pipe 18A includes a valve 19, an air regulator 20, and an air filter 2.
1 is the attached blowing compressed air supply pipe.
また他方のエアー配管１８は、バルブ１９とソ
レノイドバルブ２２を設けたノズル作動用の圧縮
空気を送る供給管である。 The other air pipe 18 is a supply pipe that is provided with a valve 19 and a solenoid valve 22 and sends compressed air for operating the nozzle.
第３図は、搬送機構の側面を示すもので、コン
ベヤーチエーン２に取付けられた基板搬送キヤリ
ヤー３に、電子部品２３を組込んだ配線基板２４
がセツトされている。２５はリミツトスイツチ１
６が当るリミツト作動ドツクである。 FIG. 3 shows a side view of the conveyance mechanism, in which a wiring board 24 with an electronic component 23 incorporated therein is mounted on a board conveyance carrier 3 attached to a conveyor chain 2.
is set. 25 is limit switch 1
It is a limit action dock that hits 6.
（作用）
次に上記構成をなす自動半田付装置においてフ
ラツクスを塗布する方法について説明する。(Function) Next, a method of applying flux in the automatic soldering apparatus having the above structure will be explained.
回動するコンベヤーチエーン２に取付けた基板
搬送キヤリヤー３が走行してきて、リミツト作動
ドツク２５がリミツトスイツチ１６に当ると、図
示しないタイマーを設けた制御機構により、ソレ
ノイドバルブ２２が開放してエアー配管１８Ｂか
ら作動用の圧縮空気が自動スプレーノズル４に送
られ、ノズルが開放する。この結果、他方のエア
ー配管１８Ａから供給された吹き付け用圧縮空気
とともに、フラツクス槽７内のフラツクス液６
が、基板下面の被塗布面２６にスプレー噴射され
る。 When the substrate conveyance carrier 3 attached to the rotating conveyor chain 2 runs and the limit actuation dock 25 hits the limit switch 16, the solenoid valve 22 is opened by a control mechanism equipped with a timer (not shown) and air is released from the air pipe 18B. Compressed air for operation is sent to the automatic spray nozzle 4, and the nozzle opens. As a result, together with the compressed air for blowing supplied from the other air pipe 18A, the flux liquid 6 in the flux tank 7
is sprayed onto the coated surface 26 on the lower surface of the substrate.
この場合、フラツクス液６は原液のまま、ある
いは溶剤で少し薄めたものをフラツクス槽７に入
れておく。このフラツクス液６としては例えばロ
ジン系のフラツクス剤を、イソプロパノール
（IPA）やエタノールなどのアルコール系溶剤や、
トルエン、キシレンなどの芳香族炭化水素系溶剤
などの溶剤で溶解したものである。またフラツク
ス液６は固形分となるフラツクス液の濃度が通常
市販されている。例えば10〜30重量％程度のもの
を用いる。 In this case, the flux liquid 6 is placed in the flux tank 7 either as an undiluted solution or slightly diluted with a solvent. As the flux liquid 6, for example, a rosin-based flux agent, an alcohol-based solvent such as isopropanol (IPA) or ethanol,
It is dissolved in a solvent such as an aromatic hydrocarbon solvent such as toluene or xylene. Further, the flux liquid 6 is commercially available with a concentration of solid content. For example, about 10 to 30% by weight is used.
また自動スプレーノズル４と、被塗布面２６と
の距離は、150〜300mm程度の間隔を保持し、自動
スプレーノズル４からのエアーの噴射量を50〜
250／分とし、フラツクス液６を40〜150c.c.／分
の割合で噴射する。 Further, the distance between the automatic spray nozzle 4 and the surface to be coated 26 is maintained at a distance of about 150 to 300 mm, and the amount of air jetted from the automatic spray nozzle 4 is set to 50 to 300 mm.
250/min, and the flux liquid 6 is injected at a rate of 40 to 150 c.c./min.
また同時に運転する誘引フアン１１は30〜60m3
／分程度の吸引量とし、カバー１２の開口部１
２ａから取り入れた空気とともに吸引するように
なつている。 In addition, the induction fan 11 that is operated at the same time is 30 to 60m 3
The suction amount is about /min, and the opening 1 of the cover 12 is
It is designed to be sucked together with the air taken in from 2a.
このように設定すると、自動スプレーノズル４
から噴射されたフラツクス液６は、霧状となつて
飛散し、配線基板２４の被塗布面２６の近傍では
溶剤の揮発分が一部蒸発して半固形化した状態と
なつて被塗布面２６に均一に塗布される。また被
塗布面２６に衝突して跳ね返つたものや、配線基
板２４に当らずに、その横を通過して上昇した霧
状のフラツクス液６は、基板鵜得面を通過した状
態で誘引フアン１１により取り入れられた大量の
空気と接触して溶剤揮発分は蒸発してフード１０
の入口に達するまでに完全に粉体化する。 With this setting, automatic spray nozzle 4
The flux liquid 6 sprayed from the wiring board 24 scatters in the form of a mist, and in the vicinity of the surface to be coated 26 of the wiring board 24, part of the volatile content of the solvent evaporates and becomes a semi-solid state. is applied evenly. In addition, the flux liquid 6 that collides with the surface to be coated and bounces off, or the atomized flux liquid 6 that passes past the wiring board 24 and rises without hitting the wiring board 24, is transferred to the attraction fan while passing through the surface of the wiring board 24. The volatile matter of the solvent evaporates on contact with the large amount of air taken in by hood 11.
Completely powderizes by the time it reaches the inlet.
またこの時に、配線基板２４の上に予めあつた
ゴミも一緒に吸引除去されるので、表面の洗浄化
も行われる。 Further, at this time, since the dust that has previously formed on the wiring board 24 is also suctioned and removed, the surface is also cleaned.
ここで噴霧されたフラツクス液６が半固形化し
た状態とは、霧状に細かく噴霧されたフラツクス
液６の溶剤が蒸発して、フラツクス固形分が45〜
60重量％程度になつたもので、配線基板２４の被
塗布面２６に当つて直に粉体化すると共に、該基
板２４の上面を通過したフラツクス液６がフード
１０の入口に達するまでの間に、仮に配線基板２
４の上面に廻り込んでも電子部品２３の表面に付
着しない程度に、完全に粉体化する状態を指すも
のである。 The state in which the sprayed flux liquid 6 has become semi-solid means that the solvent in the flux liquid 6 that has been finely sprayed into a mist has evaporated, and the flux solid content has become 45 to 50% solid.
The flux is approximately 60% by weight, and is immediately pulverized when it hits the surface to be coated 26 of the wiring board 24, and the flux liquid 6 that has passed through the top surface of the board 24 reaches the inlet of the hood 10. For example, if wiring board 2
This refers to a state in which the powder is completely pulverized to such an extent that it does not adhere to the surface of the electronic component 23 even if it gets around to the upper surface of the electronic component 23.
またフード１０に達したフラツクス液６は粉体
化しているので、フード１０の内面に付着して汚
すこともなく、更にフイルターによつて容易に捕
集され、揮発したガスも誘引フアン１１により外
部に排出されるので、作業環境も良好である。 Furthermore, since the flux liquid 6 that has reached the hood 10 is powdered, it does not adhere to the inner surface of the hood 10 and contaminate it, and is easily collected by the filter, and the volatilized gas is also removed from the outside by the induction fan 11. The working environment is also good.
このようにして、第２図に示すように、配線基
板２４がスプレーノズル４の上方を一定速度で走
行しながら、被塗布面２６の全面に亘つて順次フ
ラツクスを塗布し、基板長さの移動量に応じた時
間に設定されているタイマーにより噴射を停止す
る。 In this way, as shown in FIG. 2, while the wiring board 24 travels above the spray nozzle 4 at a constant speed, the flux is sequentially applied over the entire surface to be coated 26, and the length of the board is changed. The injection is stopped by a timer set at a time depending on the amount.
この後、第１図に示すようにプリヒータ８の上
を走行し、フラツクス塗布面を約80℃に加熱して
均一な液状膜とした後、乾燥し、更にこの後、静
止型半田槽９に、基板下面を浸漬して半田付けを
行うものである。 After that, as shown in FIG. 1, the flux runs over a preheater 8, heats the flux coated surface to about 80°C to form a uniform liquid film, and then dries. , soldering is performed by dipping the bottom surface of the board.
なお本発明において、自動スプレーノズル４
と、被塗布面２６との間隔を150〜300mmに限定し
た理由は、150mm未満の短い間隔では、噴射した
フラツクス液６が十分に広がらず大きな水滴状の
まま塗布されるので塗布ムラを生じ易くしかも、
溶剤の気化が不十分なため配線基板２４の上面を
通過してフード１０に達するまでに粉体化しない
恐れがある。 In addition, in the present invention, the automatic spray nozzle 4
The reason why the distance between the flux liquid 6 and the surface to be coated 26 is limited to 150 to 300 mm is that at a short distance of less than 150 mm, the injected flux liquid 6 does not spread sufficiently and is applied in the form of large droplets, which tends to cause uneven coating. Moreover,
Since the solvent is not sufficiently evaporated, there is a possibility that the solvent may not be turned into powder by the time it passes through the upper surface of the wiring board 24 and reaches the hood 10.
また間隔が300mmを超えて長いと、噴射したフ
ラツクス液６が広がり過ぎると共に、溶剤の揮発
分の蒸発量が多くなつて、塗布厚さが薄くなり作
業性が悪くなる上、被塗布面２６に当らずに上昇
して、そのまま誘引フアン１１に吸引されるフラ
ツクス量が多くなり不経済となるからである。 If the distance is longer than 300 mm, the injected flux liquid 6 will spread out too much, and the amount of volatile matter in the solvent will increase, resulting in a thin coating and poor workability. This is because the amount of flux that does not hit and rises and is sucked into the induction fan 11 increases, which becomes uneconomical.
また本発明において、自動スプレーノズル４か
らのエアーの噴射量を50〜250／分に限定した
理由は、50／分未満ではフラツクス液６が細か
くならず大きな水滴状のまま噴射され、また溶剤
の蒸発量も少ないのでフード１０の入口に達する
までに、粉体化せずフード１０の内壁に付着し
て、これが配線基板２４の上に落下する恐れがあ
るからである。 In addition, in the present invention, the reason why the air injection rate from the automatic spray nozzle 4 is limited to 50 to 250/min is that if it is less than 50/min, the flux liquid 6 will not be finely divided and will be injected in the form of large droplets, and the solvent will be This is because the amount of evaporation is small, so that by the time it reaches the entrance of the hood 10, it may not be pulverized and may adhere to the inner wall of the hood 10 and fall onto the wiring board 24.
また250／分を越えて多量に噴射すると、噴
射されたフラツクス液６が配線基板２４に到達す
る手前で粉体化してしまうため良好に付着せず、
しかも配線基板２４のスルーホール孔に挿着した
電子部品２３が噴射圧力によつて浮き上つてしま
うため、部品の取付位置がずれる恐れがある。 Furthermore, if a large amount of flux is injected at a rate exceeding 250/min, the injected flux liquid 6 will turn into powder before reaching the wiring board 24, so it will not adhere well.
Moreover, since the electronic component 23 inserted into the through-hole hole of the wiring board 24 is lifted up by the injection pressure, there is a risk that the mounting position of the component may be shifted.
また本発明においてフラツクス液６の噴射量を
40〜150c.c.／分に限定した理由は、40c.c.／分未満
では、被塗布面２６に短時間で十分な厚さのフラ
ツクス膜が形成できず、また150c.c.／分を超えて
多量に噴射すると、フラツクス液６の全部が細か
くならず大きな水滴状のものも含まれて、被塗布
面２６に達するまでに完全な半固形状にならない
からである。 In addition, in the present invention, the injection amount of the flux liquid 6 is
The reason for limiting the flux to 40 to 150c.c./min is that if it is less than 40c.c./min, a sufficiently thick flux film cannot be formed on the coated surface 26 in a short time, and if it is less than 150c.c./min. This is because if a large amount of flux is injected in excess of the above amount, not all of the flux liquid 6 will be finely divided, and some large droplets will be included, and the flux liquid 6 will not become completely semi-solid by the time it reaches the surface 26 to be coated.
また本発明において、フード１０に設けた誘引
フアン１１の吸引量を30〜60m3／分に限定した理
由は、吸引量が30m3／分未満であると配線基板２
４の上面を通過したフラツクス液６の粉体化が不
十分となる上、粉体化したフラツクスをフード内
に十分に吸引できなくなるからである。 Further, in the present invention, the reason why the suction amount of the attraction fan 11 provided in the hood 10 is limited to 30 to 60 m 3 /min is that if the suction amount is less than 30 m 3 /min, the wiring board 2
This is because the flux liquid 6 that has passed through the upper surface of the hood is not sufficiently pulverized, and the pulverized flux cannot be sufficiently sucked into the hood.
また誘引フアン１１の吸引量が60m3／分を超え
て大量に誘引すると、噴霧されたフラツクス液６
が配線基板２４の被塗布面２６より横方向から上
に向かつて吸引される量が多くなつて安定した厚
さに塗布できない。また配線基板２４に挿着した
電子部品２３が吸引力によつて浮き上がつてしま
い取付位置がずれる恐れがあり、しかも誘引フア
ン１１が大型化して設備費が高くなり不経済とな
るからである。 In addition, if the suction amount of the attraction fan 11 exceeds 60 m 3 /min and a large amount is attracted, the sprayed flux liquid 6
The amount of suction increases from the side to the top of the surface to be coated 26 of the wiring board 24, making it impossible to coat to a stable thickness. In addition, there is a risk that the electronic component 23 inserted into the wiring board 24 may be lifted up by the suction force and the mounting position may be shifted, and furthermore, the attraction fan 11 will become larger and the equipment cost will increase, making it uneconomical. .
なお本発明において、自動スプレーノズル４は
昇降装置に支持されて、配線基板２４との間隔を
調整できるようにしたものでも良く、また自動ス
プレーノズル４は基板走行方向と直交して複数本
並設してもよい。 In the present invention, the automatic spray nozzle 4 may be supported by a lifting device so that the distance from the wiring board 24 can be adjusted, and a plurality of automatic spray nozzles 4 may be arranged in parallel orthogonally to the board running direction. You may.
（実施例）
第１図に示す装置を用いて、プリント配線基板
２４の半田付けを行つた。プリント配線基板２４
は、大きさが長さ300mm、幅200mmのスルホール孔
の有るものを用いた。(Example) A printed wiring board 24 was soldered using the apparatus shown in FIG. Printed wiring board 24
The one with a through-hole having a length of 300 mm and a width of 200 mm was used.
またフラツクス液６はロジン系のフラツクスを
イソプロパノールを主成分とする溶剤で溶解した
濃度20重量％の原液のまま用い、自動スプレーノ
ズル４からの噴射量はエアー噴射量を100c.c.／分、
フラツクス液６を80c.c.／分とし、また誘引フアン
１１は50m3／分の吸引量の設定した。 The flux liquid 6 is a 20% by weight undiluted solution of rosin-based flux dissolved in a solvent containing isopropanol as the main component, and the amount of air sprayed from the automatic spray nozzle 4 is 100 c.c./min.
The flux liquid 6 was set at 80 c.c./min, and the attraction fan 11 was set at a suction amount of 50 m 3 /min.
また配線基板２４の走行速度は1.6ｍ／分とし
該基板２４と自動スプレーノズル４との間隔は
200mmとして自動半田付けを行つた。 The running speed of the wiring board 24 is 1.6 m/min, and the distance between the board 24 and the automatic spray nozzle 4 is
Automatic soldering was performed as 200mm.
この結果、フラツクス塗布膜はプリヒータ８を
通過後、厚さ0.02mmであり、従来の発泡式による
凹凸のある0.05〜0.3mmに比べて薄く、スルホー
ル孔を通した部品の棚は良好に半田付けされ、特
にスルホール孔を通しての半田上りは良好であつ
た。また基板上面にはフラツクスは全く付着せ
ず、製品歩留りは100％であつた。 As a result, the flux coating film has a thickness of 0.02 mm after passing through the preheater 8, which is thinner than the uneven 0.05 to 0.3 mm produced by the conventional foaming method, and the shelves of components passed through the through-holes can be soldered well. In particular, the solder flow through the through-holes was good. Furthermore, no flux adhered to the upper surface of the substrate, and the product yield was 100%.
またフラツクスの使用量は、従来の方法に比べ
て原液量で約半分に低減い、溶剤は不用でありコ
ストを大幅に削減できた。 In addition, the amount of flux used was reduced by approximately half compared to the conventional method, and no solvent was required, resulting in a significant cost reduction.
（発明の効果）
以上説明した如く、本発明に係るフラツクスの
塗布方法によれば次の効果が得られる。(Effects of the Invention) As explained above, the flux application method according to the present invention provides the following effects.
スプレー噴射方式であるので、フラツクスの
劣化がなく、しかも被塗布面に薄く均一にフラ
ツクス膜を形成でき、発泡式のように必要以上
に厚く形成せず、半田槽に入つたときの溶剤や
水分によるガス発生が少なく、ピンホールやブ
ローホールのない良好な半田付けが行える。 Since it is a spray injection method, there is no deterioration of the flux, and it can form a thin and uniform flux film on the surface to be coated. Unlike the foaming method, it does not form an unnecessarily thick film, and it is free from solvents and moisture when it enters the soldering bath. There is little gas generation caused by the soldering process, and good soldering can be achieved without pinholes or blowholes.
フラツクスは被塗布面に半固形の霧状で噴射
され、これに衝突して跳ね返つたものや被塗布
面に衝突しなかつた霧状のフラツクスは、大量
の空気と共に吸引されているので、基板上面を
通過してフードの入口に達するまでの間に溶剤
の揮発分が蒸発して固形化した粉体となり基板
上に落下することなく確実に吸引される。 Flux is sprayed in the form of a semi-solid mist onto the surface to be coated, and the flux that collides with the spray and bounces back, or the flux that does not collide with the surface to be coated, is sucked together with a large amount of air, so that it can cause damage to the substrate. While passing through the upper surface and reaching the entrance of the hood, the volatile content of the solvent evaporates and becomes a solidified powder, which is reliably sucked without falling onto the substrate.
この結果、割り基板のスリツトや部品取付孔
が開孔していても、基板上面にはフラツクスが
付着せず製品歩留りが向上するとともに、溶剤
の揮発ガスも同時に吸引されるため、作業環境
を良好にすることができる。 As a result, even if the slits or component mounting holes in the split board are open, flux will not adhere to the top surface of the board, improving product yield. At the same time, volatile gas from the solvent will also be sucked in, creating a better working environment. It can be done.
また基板上面を通過したフラツクスは、フー
ドの入口に達するまでに粉体化するので、フー
ドや誘引フアンの汚れがなく、フイルターで容
易に捕集することができる。また捕集したフラ
ツクスは粉体であるので、再利用することも可
能である。 Furthermore, since the flux that has passed through the top surface of the substrate is powdered before reaching the inlet of the hood, the hood and the induction fan are not contaminated and can be easily collected with a filter. Furthermore, since the collected flux is in the form of powder, it can be reused.
またフラツクス液は原液のままでも噴射でき
るので、従来の発泡式のように、溶剤比率の調
合など特別の知識を必要とせず作業が容易であ
る上、フラツクスの使用量を半減することもで
き、しかも消耗品である高価な発泡管を使用せ
ずコストも低減することができる。 In addition, since the flux liquid can be injected as an undiluted solution, unlike the conventional foaming method, it is easy to operate without requiring special knowledge such as mixing solvent ratios, and the amount of flux used can be halved. Furthermore, costs can be reduced without using expensive foaming tubes that are consumables.
第１図は、本発明方法による自動半田付装置の
概略構成を示す縦断正面図、第２図は自動スプレ
ーノズルの配管系を示す説明図、第３図はスプレ
ー噴射している状態を示す搬送機構の側面図であ
る。
２……コンベヤーチエーン、３……搬送キヤリ
ヤー、４……ノズル、６……フラツクス、８……
プリヒータ、９……半田槽、１１……誘引フア
ン、１７……液供給管、１８Ａ，１８Ｂ……エア
ー配管、２３……電子部品、２４……配線基板、
２６……被塗布面。
Fig. 1 is a longitudinal sectional front view showing the schematic configuration of an automatic soldering device according to the method of the present invention, Fig. 2 is an explanatory diagram showing the piping system of the automatic spray nozzle, and Fig. 3 is a conveyance diagram showing a state in which spraying is performed. FIG. 3 is a side view of the mechanism. 2... Conveyor chain, 3... Conveyance carrier, 4... Nozzle, 6... Flux, 8...
Preheater, 9...Solder tank, 11...Induction fan, 17...Liquid supply pipe, 18A, 18B...Air piping, 23...Electronic component, 24...Wiring board,
26...Surface to be coated.
Claims (1)
ノズルを配置し、このノズルからエアーの噴射量
を50〜250／分とし、フラツクス液を40〜150
c.c.／分の割合で噴射し、配線基板の上方に配置し
たフード内に設けられた誘引フアンの吸引量を30
〜60m3／分として、走行している配線基板の下方
から、前記ノズルでフラツクス液をエアースプレ
ー噴射しながら、同時に配線基板の上方に設けた
誘引フアンによりノズルからのエアー噴射量以上
の空気を引き込んで吸引して、霧状に噴射したフ
ラツクス液を前記基板の被塗布面に半固形化した
状態で塗布し、該基板の上面を通過したフラツク
ス液はフードの入口に達するまでに、溶剤の揮発
分を蒸発させて粉体化し、この粉体を吸引除去す
ることを特徴とするフラツクスの塗布方法。1 Place nozzles below the wiring board at intervals of 150 to 300 mm, and set the air injection rate from these nozzles to 50 to 250/min, and spray the flux liquid at 40 to 150 mm.
It sprays at a rate of cc/min, and the suction amount of the induction fan installed in the hood placed above the wiring board is 30%.
~60m 3 /min, while air spraying the flux liquid from below the running wiring board with the nozzle, at the same time, the induction fan installed above the wiring board pumps out more air than the amount of air sprayed from the nozzle. The flux liquid is drawn in and suctioned, and sprayed in the form of a mist, which is then applied in a semi-solid state to the surface of the substrate to be coated. A flux application method characterized by evaporating volatile content and turning it into powder, and removing this powder by suction.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2558085A JPS61186165A (en) | 1985-02-13 | 1985-02-13 | Coating method of flux |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2558085A JPS61186165A (en) | 1985-02-13 | 1985-02-13 | Coating method of flux |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61186165A JPS61186165A (en) | 1986-08-19 |
| JPH0551392B2 true JPH0551392B2 (en) | 1993-08-02 |
Family
ID=12169855
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2558085A Granted JPS61186165A (en) | 1985-02-13 | 1985-02-13 | Coating method of flux |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61186165A (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4821948A (en) * | 1988-04-06 | 1989-04-18 | American Telephone And Telegraph Company | Method and apparatus for applying flux to a substrate |
| JPH0376658U (en) * | 1989-11-22 | 1991-07-31 | ||
| JP2538702B2 (en) * | 1990-06-28 | 1996-10-02 | 日本電気株式会社 | Spray type flux applicator |
| JPH0756121Y2 (en) * | 1991-01-09 | 1995-12-25 | 権士 近藤 | Fracsa |
| JP5910787B1 (en) * | 2015-10-22 | 2016-04-27 | 千住金属工業株式会社 | Flux recovery device |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55147777U (en) * | 1979-04-09 | 1980-10-23 |
-
1985
- 1985-02-13 JP JP2558085A patent/JPS61186165A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61186165A (en) | 1986-08-19 |
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