CN218225226U - Solder resist preset device and welding system - Google Patents
Solder resist preset device and welding system Download PDFInfo
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- CN218225226U CN218225226U CN202222484608.9U CN202222484608U CN218225226U CN 218225226 U CN218225226 U CN 218225226U CN 202222484608 U CN202222484608 U CN 202222484608U CN 218225226 U CN218225226 U CN 218225226U
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- solder resist
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Abstract
The utility model provides a solder mask preset device and welding system relates to the welding technology field. The solder resist presetting device comprises a conveying mechanism, a sucker assembly, a spraying device and a control device. The sucker assembly is arranged on the conveying mechanism and is conveyed by the conveying mechanism along a preset direction. The sucking disc assembly is used for adsorbing a workpiece. The spraying device is provided with a nozzle arranged above the conveying mechanism; the spray coating device is used for storing the solder resist and spraying the solder resist through a nozzle. The control device is electrically connected with the conveying mechanism to control the conveying mechanism to convey the sucker assembly along a preset direction; and is electrically connected with the spraying device to control the spraying device to spray the solder resist from the nozzle when the nozzle is opposite to the sucker component. The utility model provides a welding system has adopted foretell solder resist to preset the device. The utility model provides a solder mask preset device and welding system can improve the manual work and apply paint the solder mask with a brush inhomogeneous, has the overflow, and then leads to the unstable problem that influences later stage product percent of pass of quality.
Description
Technical Field
The utility model relates to the field of welding technique, particularly, relate to a solder mask preset device and welding system.
Background
Before welding of part of workpieces, solder resist needs to be coated on the workpieces, so that part of the areas of the workpieces are prevented from being affected by welding, and the overall quality of the workpieces is ensured. In the prior art, most of the methods are carried out by manually coating solder resists.
However, the manual painting of the solder mask of the pre-welding part is not uniform, the overflow problem exists, the quality is unstable, and the qualification rate of the later-stage products is influenced.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing a solder mask preset device, it can improve among the prior art artifical solder mask inhomogeneous of applying paint with a brush, has the overflow, and then leads to the unstable problem that influences later stage product percent of pass of quality.
The utility model aims at still including, providing a welding system, it can improve among the prior art artifical solder mask inhomogeneous of applying paint with a brush, has the overflow, and then leads to the unstable problem that influences later stage product percent of pass of quality.
The embodiment of the utility model discloses a can realize like this:
an embodiment of the utility model provides a solder resist preset device for preset the solder resist on the work piece, the solder resist preset device includes:
a conveying mechanism;
the sucker assembly is arranged on the conveying mechanism and is conveyed by the conveying mechanism along a preset direction; the sucking disc assembly is used for sucking the workpiece;
the spraying device is provided with a nozzle arranged above the conveying mechanism; the spraying device is used for storing the solder resist and spraying the solder resist through the nozzle;
the control device is electrically connected with the conveying mechanism so as to control the conveying mechanism to convey the sucker assembly along a preset direction; and is electrically connected with the spraying device so as to control the spraying device to spray the solder resist from the nozzle when the nozzle is just opposite to the sucker component.
The utility model provides a solder mask preset device includes for prior art's beneficial effect:
among this solder resist preset device, can prevent the work piece on the sucking disc subassembly to adsorb the work piece through the sucking disc subassembly, thereby ensure the stability of work piece. Then, the sucker assembly is conveyed through the conveying mechanism, so that the sucker assembly moves along with the conveying mechanism until the sucker assembly is opposite to a nozzle of the spraying device, and the controller controls the spraying device to spray solder resist from the nozzle so as to spray the solder resist onto the workpiece. The spraying device is controlled by the controller to spray the solder resist, the amount of the solder resist sprayed from the nozzle by the spraying device is conveniently controlled by the controller, the pressure of the solder resist sprayed from the nozzle can be controlled, the solder resist can be stably coated on a workpiece, the uniformity of coating the solder resist on a plurality of workpieces is ensured, the uniform coating of the solder resist is ensured, the higher qualified rate of the later-stage production of products is ensured, the problem that the qualified rate of the later-stage products is influenced due to the fact that the solder resist is coated manually in the prior art is improved, overflow exists, and the quality is unstable is caused.
Optionally, the number of the sucker assemblies is multiple, and the plurality of sucker assemblies are arranged on the conveying mechanism at intervals.
Optionally, the conveying mechanism is provided with an annular conveying line, and a plurality of sucker assemblies are arranged on the conveying line at equal intervals.
Optionally, the conveying mechanism is a belt conveyor.
Optionally, the spraying device further comprises a powder feeding box and a powder feeding channel; the powder feeding box is used for storing solder resist, one end of the powder feeding channel is connected into the powder feeding box, and the other end of the powder feeding channel is connected to the nozzle; the powder feeding box is electrically connected with the control device, and the control device is used for controlling the powder feeding box to spray the solder resist from the nozzle through the powder feeding channel when the nozzle is right opposite to the sucker component.
Optionally, the spraying device further comprises an air draft channel and an air draft device; the air draft channel is close to the nozzle, the air draft device is connected to the air draft channel, and the air draft device is used for forming negative pressure in the air draft channel.
Optionally, the distance between the air draft channel and the sucker assembly is larger than the distance between the nozzle and the sucker assembly.
Optionally, the suction cup assembly comprises a suction cup main body, a negative pressure channel and a positive pressure channel; the sucker main body is arranged on the conveying mechanism, and an adsorption cavity is arranged at the top end of the sucker main body; the negative pressure channel and the positive pressure channel are both connected into the adsorption cavity; the negative pressure channel is used for forming negative pressure in the adsorption cavity to adsorb the workpiece; the positive pressure channel is used for leading in airflow to the adsorption cavity so as to remove adsorption on the workpiece.
Optionally, the solder resist presetting device further comprises a closed cover, the closed cover is arranged above the conveying mechanism, and the conveying mechanism is used for conveying the sucker assembly to pass through the closed cover from the inner side; the nozzle is arranged on the inner side of the closed cover.
A soldering system includes a solder resist presetting device. The solder resist presetting device includes:
a conveying mechanism;
the sucker assembly is arranged on the conveying mechanism and is conveyed by the conveying mechanism along a preset direction; the sucker component is used for adsorbing the workpiece;
the spraying device is provided with a nozzle arranged above the conveying mechanism; the spraying device is used for storing the solder resist and spraying the solder resist through the nozzle;
the control device is electrically connected with the conveying mechanism so as to control the conveying mechanism to convey the sucker assembly along a preset direction; and is electrically connected with the spraying device so as to control the spraying device to spray the solder resist from the nozzle when the nozzle is just opposite to the sucker component.
The utility model provides a welding system has adopted foretell solder resist preset device, and this welding system is the same for prior art's beneficial effect with the above-mentioned solder resist preset device that provides for prior art's beneficial effect for prior art, no longer gives unnecessary details here.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention, and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.
Fig. 1 is a schematic structural view of a solder resist presetting apparatus provided in a first embodiment of the present application;
FIG. 2 is a schematic diagram of a chuck assembly provided in a first embodiment of the present application.
An icon: 10-solder resist preset device; 11-a workpiece; 100-a conveying mechanism; 110-a conveying line; 200-a suction cup assembly; 210-a suction cup body; 211-an adsorption chamber; 220-a negative pressure channel; 230-a positive pressure channel; 300-a spraying device; 310-a nozzle; 320-powder feeding box; 330-powder feeding channel; 400-air draft channel; 500-closing the enclosure.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. The components of embodiments of the present invention, as generally described and illustrated in the figures herein, may be arranged and designed in a wide variety of different configurations.
Thus, the following detailed description of the embodiments of the invention, as presented in the figures, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. Based on the embodiments of the present invention, all other embodiments obtained by a person skilled in the art without making creative efforts belong to the protection scope of the present invention.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.
In the description of the present invention, it should be noted that, if the directions or positional relationships indicated by the terms "up", "down", "inside", "outside", etc. appear based on the directions or positional relationships shown in the drawings, or the directions or positional relationships that the products of the present invention are usually placed when used, it is only for convenience of describing the present invention and simplifying the description, but not for indicating or implying that the indicated device or element must have a specific direction, be constructed and operated in a specific direction, and therefore, should not be construed as limiting the present invention.
Furthermore, the appearances of the terms "first," "second," and the like, if any, are used solely to distinguish one from another and are not to be construed as indicating or implying relative importance.
It should be noted that the features of the embodiments of the present invention may be combined with each other without conflict.
First embodiment
Referring to fig. 1, the present embodiment provides a solder resist presetting device 10, where the solder resist presetting device 10 is used to apply a solder resist on a workpiece 11, so as to achieve the purpose of semi-automatically applying the solder resist on the workpiece 11, so as to solve the problems in the prior art that manual solder resist application is not uniform, overflow exists, and quality instability occurs, which affects the qualification rate of the later-stage products.
In the present embodiment, the solder resist presetting apparatus 10 includes a conveying mechanism 100, a suction cup assembly 200, a spray apparatus 300, and a control apparatus (not shown). The conveying mechanism 100 is electrically connected with a control device, and the control device can control the start and stop of the conveying mechanism 100, in other words, the control device can control the start and stop of the conveying mechanism 100; also, the control device may control the conveying speed of the conveying mechanism 100. The suction cup assembly 200 is disposed on the conveying mechanism 100 and conveyed by the conveying mechanism 100 along a predetermined direction. The chuck assembly 200 is used to adsorb the workpiece 11. The spray coating device 300 has a nozzle 310 provided above the conveyance mechanism 100. Further, the spray coating device 300 is used to store the solder resist and to spray the solder resist through the nozzle 310. The control device can control the conveying mechanism 100 to convey the sucker assembly 200 along a preset direction; and, the control device is also electrically connected to the spray device 300 to control the spray device 300 to spray the solder resist from the nozzle 310 when the nozzle 310 is directed to the chuck assembly 200.
Based on this, in the process of applying the solder resist to the workpiece 11, the operator can prevent the workpiece 11 from being placed on the chuck assembly 200, and the chuck assembly 200 adsorbs the workpiece 11 to ensure the stability of the workpiece 11. The control device controls the conveying mechanism 100 to convey the sucker assembly 200 along the preset direction, and when the sucker assembly 200 is conveyed to be opposite to the nozzle 310, the control device can control the spraying device 300 to spray the solder resist to the sucker assembly 200 through the nozzle 310, so that the solder resist can be coated on the workpiece 11, and the coating of the solder resist is completed.
As described above, in the solder resist presetting apparatus 10, the workpiece 11 can be prevented from being on the chuck assembly 200 to suck the workpiece 11 through the chuck assembly 200, thereby ensuring stability of the workpiece 11. Then, the chuck assembly 200 is transported by the transportation mechanism 100 such that the chuck assembly 200 follows the transportation mechanism 100 until the chuck assembly 200 is right opposite to the nozzle 310 of the spray apparatus 300, and the controller controls the spray apparatus 300 to spray the solder resist from the nozzle 310 to spray the solder resist onto the workpiece 11. The spraying device 300 is controlled by the controller to spray the solder resist, the amount of the solder resist sprayed from the nozzle 310 by the spraying device 300 is conveniently controlled by the controller, the pressure of the solder resist sprayed from the nozzle 310 can be controlled, the solder resist can be stably coated on the workpieces 11, the consistency of coating the solder resist on the workpieces 11 is ensured, the uniform coating of the solder resist is ensured, the higher qualification rate of the later-stage production of products is ensured, the problem that the quality is unstable and the qualification rate of the later-stage products is influenced is solved, and the problem that the manual coating of the solder resist in the prior art is uneven and overflow exists.
In order to improve the painting efficiency, optionally, the suction cup assembly 200 is plural, and the plural suction cup assemblies 200 are provided on the conveying mechanism 100 at intervals. By providing a plurality of chuck assemblies 200 on the transfer mechanism 100, solder resist coating of a plurality of workpieces 11 can be achieved simultaneously. That is, the plurality of workpieces 11 are placed on the plurality of chuck assemblies 200, respectively, and the plurality of chuck assemblies 200 are sequentially transferred to positions right opposite to the nozzles 310 as the transfer mechanism 100 is operated, so that the plurality of workpieces 11 can be continuously coated with the solder resist while the transfer mechanism 100 is continuously operated, whereby the efficiency of coating the solder resist on the workpieces 11 can be improved.
Further, the conveying mechanism 100 has a ring-shaped conveying line 110, and a plurality of chuck assemblies 200 are arranged on the conveying line 110 at equal intervals. In other words, any one of the chuck assemblies 200 passes through the position opposite to the nozzle 310 in a reciprocating manner during the transportation following the transportation mechanism 100, and based on this, after the solder resist is applied to the workpiece 11 on any one of the chuck assemblies 200, the workpiece 11 on which the solder resist has been applied is removed from the chuck assembly 200, and then an unprinted workpiece 11 is additionally placed on the chuck assembly 200 at the same time, thereby applying the solder resist to the workpiece 11 when the chuck assembly 200 passes through the position opposite to the nozzle 310 next time. This enables the solder resist to be applied to the plurality of workpieces 11 in a circulating manner. Based on this, the operator can only put the work piece 11 without solder resist on the suction cup assembly 200 and remove the work piece 11 with solder resist from the suction cup assembly 200. Thereby achieving semi-automation of solder resist application on the workpiece 11. Of course, in other embodiments, a robot or other mounting and dismounting system may be provided to detach and place the workpiece 11 from the chuck assembly 200, so as to fully automate the solder resist painting of the workpiece 11.
Optionally, in this embodiment, the conveying mechanism 100 is a belt conveyor. It should be understood that in other embodiments of the present application, a conveying structure such as a conveyor chain may be used instead of a belt conveyor. It is only necessary that the conveying mechanism 100 be able to form a circulating conveying line 110.
In this embodiment, the spraying device 300 further includes a powder feeding box 320 and a powder feeding passage 330; the powder feeding box 320 is used for storing solder resist, one end of the powder feeding channel 330 is connected to the powder feeding box 320, and the other end is connected to the nozzle 310; the powder feeding box 320 is electrically connected to a control device for controlling the powder feeding box 320 to spray the solder resist from the nozzle 310 through the powder feeding passage 330 when the nozzle 310 faces the chuck assembly 200.
It is noted that a means for pumping out solder resist may be provided in the powder feeding tank 320 to pump the solder resist in the powder feeding tank 320 from the powder feeding passage 330 to the nozzle 310 to be sprayed from the nozzle 310 for the application of the solder resist. In addition, an atomizer is provided at the nozzle 310 so that the solder resist can be atomized, thereby enabling the solder resist to be uniformly painted on the workpiece 11.
In addition, in the present embodiment, the spraying device 300 further includes an air draft channel 400 and an air draft device (not shown); air draft channel 400 is close to nozzle 310 and sets up, and updraft ventilator connects in air draft channel 400, and updraft ventilator is used for forming the negative pressure at air draft channel 400. The atomized solder resist is sprayed to the workpiece 11 at the nozzle 310, and a part of the atomized solder resist is scattered around the workpiece 11 under the influence of the air flow, and in order to prevent the solder resist from forming a solder resist layer at other positions of the workpiece 11, the solder resist scattered in the air is sucked away by the negative pressure formed by the suction channel 400, so that the solder resist can be prevented from being coated at other positions of the workpiece 11. In addition, the solder resist can be prevented from falling onto the conveying mechanism 100 or the sucker assembly 200 to influence the normal operation of the conveying mechanism 100 and the sucker assembly 200.
Of course, in other embodiments, after the solder resist is sucked by the air suction channel 400, the sucked solder resist can be collected together, so that the solder resist can be conveniently cleaned in a centralized manner, and the solder resist can be conveniently recycled.
To prevent the exhaust from impacting the nozzle 310, the exhaust channel 400 is optionally spaced further from the suction cup assembly 200 than the nozzle 310 is spaced from the suction cup assembly 200. Therefore, the influence of the negative pressure formed by the air draft channel 400 on the front side of the nozzle 310 can be reduced, and the influence on normal spraying and brushing on the front side of the nozzle 310 when the solder resist is extracted by the air draft channel 400 is further prevented. Meanwhile, the air draft device is arranged close to the nozzle 310, so that most of solder resist scattered in the air can be extracted by the air draft device, and the solder resist is prevented from falling to other places of the workpiece 11.
In the present embodiment, referring to fig. 2, the chuck assembly 200 includes a chuck main body 210, a negative pressure channel 220 and a positive pressure channel 230; the sucker main body 210 is arranged on the conveying mechanism 100, and the top end of the sucker main body 210 is provided with an adsorption cavity 211; the negative pressure channel 220 and the positive pressure channel 230 are both connected into the adsorption cavity 211; the negative pressure passage 220 is used for forming negative pressure in the adsorption cavity 211 to adsorb the workpiece 11; the positive pressure passage 230 is used to introduce a gas flow into the adsorption chamber 211 to desorb the workpiece 11. The negative pressure channel 220 extends from the inside of the suction cup main body 210 to the adsorption cavity 211 so as to conveniently extract the gas in the adsorption cavity 211, thereby forming negative pressure in the adsorption cavity 211 and facilitating the adsorption of the workpiece 11. The positive pressure passage 230 can also be connected to the suction cavity 211 to fill air into the suction cavity 211, so as to release the suction force applied by the suction cavity 211 to the workpiece 11, thereby facilitating the detachment of the workpiece 11 from the suction cup assembly 200.
In addition, in order to prevent the solder resist from being scattered too much to cause inhalation of an operator, optionally, the solder resist presetting device 10 further comprises a closed cover 500, the closed cover 500 is arranged above the conveying mechanism 100, and the conveying mechanism 100 is used for conveying the sucker assembly 200 to pass through the inner side of the closed cover 500; the nozzle 310 is provided inside the enclosure 500. After the nozzle 310 atomizes and sprays the solder resist, the atomized solder resist is sealed inside by the sealing cover 500, so that the solder resist can be prevented from flying; meanwhile, the solder resist is sealed inside through the sealing cover 500, so that the solder resist inside the sealing device can be taken away by the air draft device conveniently, and the solder resist can be recovered conveniently.
In summary, the solder resist presetting apparatus 10 provided in the present embodiment can prevent the workpiece 11 from being on the chuck assembly 200 to suck the workpiece 11 through the chuck assembly 200, thereby ensuring stability of the workpiece 11. Then, the chuck assembly 200 is transported by the transporting mechanism 100 such that the chuck assembly 200 follows the transporting mechanism 100 until the chuck assembly 200 is aligned with the nozzle 310 of the spray coating device 300, and the controller controls the spray coating device 300 to spray solder resist from the nozzle 310 to the workpiece 11. The controller is used for controlling the spraying device 300 to spray the solder resist, the controller is not only convenient to control the amount of the solder resist sprayed from the nozzle 310 by the spraying device 300, but also can control the pressure of the solder resist sprayed from the nozzle 310, so that the solder resist can be stably coated on the workpieces 11, the consistency of coating the solder resist on a plurality of workpieces 11 is ensured, the uniform coating of the solder resist is ensured, the higher qualified rate of the later-stage production of products is ensured, and the problems that the manual coating of the solder resist in the prior art is uneven, overflow exists, and further the quality is unstable and the qualified rate of the later-stage products is influenced are solved.
Second embodiment
The embodiment provides a welding system (not shown), which adopts the solder resist presetting device 10 in the first embodiment and can solve the problems that manual solder resist painting is not uniform, overflow exists, and quality is unstable to influence the qualification rate of products in the later period in the prior art.
The above description is only for the specific embodiments of the present invention, but the protection scope of the present invention is not limited thereto, and any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope of the present invention should be covered by the protection scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.
Claims (10)
1. A solder resist presetting device for presetting a solder resist on a workpiece, characterized by comprising:
a conveying mechanism;
the sucker assembly is arranged on the conveying mechanism and is conveyed by the conveying mechanism along a preset direction; the sucking disc assembly is used for sucking the workpiece;
the spraying device is provided with a nozzle arranged above the conveying mechanism; the spraying device is used for storing the solder resist and spraying the solder resist through the nozzle;
the control device is electrically connected with the conveying mechanism so as to control the conveying mechanism to convey the sucker component along a preset direction; and is electrically connected with the spraying device so as to control the spraying device to spray the solder resist from the nozzle when the nozzle is just opposite to the sucker component.
2. The solder resist presetting apparatus of claim 1, characterized in that the suction cup assembly is plural, and plural suction cup assemblies are provided on the conveying mechanism at intervals.
3. A solder resist presetting apparatus as defined in claim 2, characterized in that the conveying mechanism has a conveying line in an annular shape, and a plurality of the suction cup assemblies are provided on the conveying line at equal intervals.
4. A solder resist presetting apparatus as defined in claim 3, characterized in that the conveying mechanism is a belt conveyor.
5. A solder resist presetting device as defined in any one of claims 1-4, characterized in that the spraying device further comprises a powder feeding box and a powder feeding channel; the powder feeding channel is used for storing solder resist, one end of the powder feeding channel is connected into the powder feeding box, and the other end of the powder feeding channel is connected to the nozzle; the powder feeding box is electrically connected with the control device, and the control device is used for controlling the powder feeding box to spray the solder resist from the nozzle through the powder feeding channel when the nozzle is opposite to the sucker component.
6. A solder resist presetting device as defined in claim 5, characterized in that the spraying device further comprises an air draft channel and an air draft device; the air draft channel is close to the nozzle, the air draft device is connected to the air draft channel, and the air draft device is used for forming negative pressure on the air draft channel.
7. A solder resist presetting device as claimed in claim 6, characterized in that the distance of the air draft channel from the sucker component is greater than the distance of the nozzle from the sucker component.
8. A solder resist presetting device as defined in any one of claims 1-4, characterized in that the suction cup assembly comprises a suction cup body, a negative pressure channel and a positive pressure channel; the sucker main body is arranged on the conveying mechanism, and an adsorption cavity is formed in the top end of the sucker main body; the negative pressure channel and the positive pressure channel are both connected into the adsorption cavity; the negative pressure channel is used for forming negative pressure in the adsorption cavity to adsorb the workpiece; the positive pressure channel is used for introducing airflow into the adsorption cavity to remove adsorption on the workpiece.
9. A solder resist presetting device as defined in any one of claims 1-4, characterized in that the solder resist presetting device further comprises an enclosure, the enclosure is disposed above the conveying mechanism, the conveying mechanism is used for conveying the sucker assembly to pass through the inside of the enclosure; the nozzle is arranged on the inner side of the closed cover.
10. A soldering system, characterized by comprising the solder resist presetting apparatus as claimed in any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222484608.9U CN218225226U (en) | 2022-09-19 | 2022-09-19 | Solder resist preset device and welding system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222484608.9U CN218225226U (en) | 2022-09-19 | 2022-09-19 | Solder resist preset device and welding system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218225226U true CN218225226U (en) | 2023-01-06 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222484608.9U Active CN218225226U (en) | 2022-09-19 | 2022-09-19 | Solder resist preset device and welding system |
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| Country | Link |
|---|---|
| CN (1) | CN218225226U (en) |
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2022
- 2022-09-19 CN CN202222484608.9U patent/CN218225226U/en active Active
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