JPS5997761A - Automatic soldering device - Google Patents

Abstract

PURPOSE:To remove thoroughly the flux sticking on objects to be soldered by conveying the objects with a conveyor and subjecting the objects to flux coating, preheating, soldering, hot water washing and drying successively. CONSTITUTION:A flux is stuck in a flux coating unit 3 on objects to be soldered supplied from a feed section 2 into a conveyor 1. The excess flux is blown off by an air knife 4 and the objects are warmed in a preheating unit 5. A solder film is stuck thereon in a soldering unit 6 and thereafter the flux sticking on the objects is washed off by a hot water shower 21 from the top and air bubbled hot water from the bottom in hot water washing units 7-10. Air is ejected from above and below to blow off water drops from the objects in a rotary type air blow unit 13. The objects are then hot dried in a heating unit 14 and are cooled in a cooling fan unit 15, and thereafter the objects are taken out from a taking out section 12.

Description

[Detailed description of the invention] [Technical field of invention] The present invention relates to an automatic soldering device.

[Technical background of the invention and its problems]

Generally, integrated circuit (IC) lead frames etc.
The main component is copper, but it also contains large amounts of iron, nickel, and other elements, making it difficult to solder.

Therefore, pre-soldering to attach the solder film to the lead frame is done by using a water-soluble chlorine-based flux during soldering.
The metal oxide film (rust) on the surface of the lead frame is removed to make it easier for solder to adhere to the lead frame. However, if the chlorine-based flux remains on the lead frame, IC chip, etc. even after soldering, the lead frame, IC chip, etc. may be corroded by the action of chlorine.

In response to this, conventional automatic soldering equipment does not attempt to completely remove the flux that remains on ICs after soldering (although it is desired that automatic soldering lines be improved). .

[Purpose of the invention]

The present invention was developed in view of the above points, and has a line configuration that can completely remove the water-soluble flux that adheres to objects, etc., when the soldering is carried out incorrectly. This is what we are trying to provide.

[Summary of the invention]

The automatic soldering system of the present invention has a structure in which a fluxing unit, a preheating unit, a soldering unit, a plurality of hot water washing units, and a drying means are sequentially installed along the conveyor that conveys the soldered object. It is characterized by the fact that it has been provided.

[Embodiments of the invention]

Hereinafter, the present invention will be described with reference to embodiments illustrating the present invention. )
, a fluxing unit (3) consisting of a jet type flux tank containing water-soluble chlorine flux, an air knife (4) consisting of an air blowing nozzle for removing excess flux, and a preheating unit (5) consisting of a heater. ), soldering unit (6) consisting of a jet soldering bath, Habo 50
Multiple hot water cleaning units (7) that clean and remove residual flux from soldered objects with warm water at a temperature of ~80°.
(8) (9) (IQ+, drying means Uυ, and soldering objects are arranged sequentially with the object removal part 0z.

On the drying means side, there are two sets of rotary air blow units.
3), two sets of heating units I each consisting of a heater, and two sets of cooling fan units (151).

The conveyor (1) is covered all around with a 7-door ring, except for the intake section (where soldering is carried out) and the take-out section (12), so that the gas generated from flux and solder is emitted into the room. The gas is discharged outdoors from the duct αη.

The above conveyor (1), each unit, and other members are made of stainless steel or coated with acid-resistant paint.

In addition, as shown in Figures 2 and 3, the hot water cleaning unit (7) (8) (9) Ql) is connected to the conveyor (
1) An air bubbling hot water tank (a) is placed below the conveyor (1), and a hot water shower Cυ is provided above the conveyor (1).

The F-bubbling hot water tank (4) is installed inside an outer tank (221), and has an air blowing nozzle (c) and a heater (251 (shown in Figure 3) at the bottom).
The air blown into the nozzle (c) rises in the form of countless bubbles from the top opening of the nozzle (c), and the soldered material below the water surface collides with objects. At this time, the heater (A) in the water tank (A)
The hot water (goods) heated by the air bubbles (support) also form a high-speed upward flow, and the soldered object violently collides with the object. Water-soluble chlorine flux adhering to the surface can be easily washed away. Also hot shower Q11
For example, as shown in the figure, 3 on the bottom side of two rows of pipes
It has fountain holes at certain points. In addition, the hot water overflows from the air bubbling hot water tank (20), reaches the outer tank (2'IJ), and is further spouted from the fountain hole of the hot water shower I2v by means such as a pump (5) and a pipe (c). .

Further, as shown in Figure 3, the conveyor (1) includes a frame-shaped conveyance holder, an inner endless rail 0υ that supports the four wheels (301) of this conveyance holder, and an outer endless rail 021. Inner circumferential endless rail c11
), and the endless rail can is moved between a pair of guide rails, and is moved upwardly at predetermined intervals by a transport pin C (51). A bearing fitted to this bin holder (29) makes the movement of the bin C351 smooth. The endless rails 0υc33 on both sides are covered by removable waterproof covers (to) and waterproof sheets 01 on both sides.

In addition, as shown in Figure 31F4, a rotary air blower
Inside the tank, four support rods 03 are protruded upward and downward from the middle part, and these upper and lower support rods (43 connect the upper and lower rotation joints (44) through the support plate (44). The upper and lower rotating joints (c) support the rotating hollow shafts (47
) and the upper and lower F supply pipes (48), and connect the upper and lower swing pipes (A) K toward the rear slightly diagonally to the direction of rotation [
The upper and lower air nozzles (4!J) rotate the rotating vibrator by the reaction of the air jet while spouting air, and while rotating, the air jet is used to spray the conveyor holder and the soldered material. The attachment blows away water droplets adhering to objects, etc.The direction of rotation is set so that there is opposite pressure at the top and bottom.The tank (42 is a transparent vinyl chloride plate l51 except for the drain hole at the bottom), etc. 8521 is a waterproof sheet. Note that the rotating hollow shaft C of the air supply pipe (48) and the turning pipe (46)
4η may be integrated, and the air supply valve □Eve decoy may be forcibly rotated.

Then, the IC to be soldered is held by the jig 6ω supported by the holder (29), and a water-soluble chlorine-based flux is applied to the lead frame of C in the flux blind unit (3) □. Air knife (
In step 4), blow away excess flux, warm the CIC glue frame with preheating unit (5), leave soldering in unit (6), apply a solder film to the lead frame, and use warm water cleaning unit ( 7) (8)
(9) (In 10, the upper hot water shower (two swords,
At the same time, hot water is poured onto the holder @ and the jig 6, and a gas-liquid mixed phase upward flow is injected into the jig 69 and the IC from the lower air bubbling hot water tank.
1. The flux adhering to the IC is washed off, water droplets adhering to the holder, the jig 651, and the IC are blown away by air jetted from above and below in the rotary air blow unit a3, and the heat is heated in the heating unit a. dry,
cooling fan unit (151 for cooling, and finally,
For soldering, move jig 1 from holder (A) at object removal section a2.
Remove 551 and take it out.

In addition, warm water washing unit (7) (8) (9) (11
An ultrasonic cleaning device may be incorporated.

〔Effect of the invention〕

According to the present invention, since a plurality of hot water cleaning units are provided in the soldering line, water-soluble flux adhering to objects to be soldered can be completely washed away with warm water. In particular, depending on the type of water-soluble flux,
It may change into a substance that does not dissolve in cold water, but
Such substances can also be completely removed by multiple hot water washes.

In addition, by forming each of the above hot water cleaning units with an air bubbling hot water tank on the lower side and a hot water shower on the upper side, the liquid that rises with the bubbles, that is, the gas-liquid multiphase upward flow, collides with the object to be soldered to remove residual flux. Not only can you effectively wash with hot water, you can also use hot water to wash away flux attached to conveyors and other surfaces at the same time.

[Brief explanation of drawings]

The figures relate to one embodiment of the present invention, and Figure 1 is a plan view of the entire automatic soldering device, and Figure 2 is I-I of Figure 1.
A line sectional view, Figure 3 is a sectional view taken along line 1-1 of Figure 1, and Figure 4 is a sectional view taken along line W-4 of Figure 1. (1)-@Conveyor, (3)...Unit for fluxing, (5)...Preheating unit, (6)...Unit for soldering, (7)(8) (9)(11...Hot water Washing unit, aυ...drying means, ■-air bubbling hot water tank, (21)...hot shower.

Claims (2)

[Claims] (1) Automatic soldering characterized by sequentially applying a unit for fluxing, a preheating unit, a unit for soldering, multiple hot water cleaning units, and a drying means along the conveyor that conveys the objects to be soldered. is a device. (2) Automatic soldering according to claim t1, characterized in that the hot water cleaning unit is formed by providing an F-bubbling hot water tank below the conveyor and providing a hot water shower above the conveyor. is a device.