JPH0547485Y2 - - Google Patents
Info
- Publication number
- JPH0547485Y2 JPH0547485Y2 JP1988105577U JP10557788U JPH0547485Y2 JP H0547485 Y2 JPH0547485 Y2 JP H0547485Y2 JP 1988105577 U JP1988105577 U JP 1988105577U JP 10557788 U JP10557788 U JP 10557788U JP H0547485 Y2 JPH0547485 Y2 JP H0547485Y2
- Authority
- JP
- Japan
- Prior art keywords
- hole
- insulating substrate
- holes
- main surfaces
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title | 
|---|---|---|---|
| JP1988105577U JPH0547485Y2 (cs) | 1988-08-10 | 1988-08-10 | 
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title | 
|---|---|---|---|
| JP1988105577U JPH0547485Y2 (cs) | 1988-08-10 | 1988-08-10 | 
Publications (2)
| Publication Number | Publication Date | 
|---|---|
| JPH0227768U JPH0227768U (cs) | 1990-02-22 | 
| JPH0547485Y2 true JPH0547485Y2 (cs) | 1993-12-14 | 
Family
ID=31338318
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date | 
|---|---|---|---|
| JP1988105577U Expired - Lifetime JPH0547485Y2 (cs) | 1988-08-10 | 1988-08-10 | 
Country Status (1)
| Country | Link | 
|---|---|
| JP (1) | JPH0547485Y2 (cs) | 
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title | 
|---|---|---|---|---|
| KR101055516B1 (ko) * | 2003-04-02 | 2011-08-08 | 가부시기가이샤 후지고오키 | 전동 밸브 | 
| JP7027218B2 (ja) * | 2017-03-29 | 2022-03-01 | 京セラ株式会社 | 回路基板およびこれを備える電子装置 | 
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title | 
|---|---|---|---|---|
| JPS58219796A (ja) * | 1982-06-15 | 1983-12-21 | 松下電器産業株式会社 | 導体層接続装置 | 
| JPS60167489A (ja) * | 1984-02-10 | 1985-08-30 | 富士通株式会社 | セラミツク回路基板の製造方法 | 
| JPS627194A (ja) * | 1985-07-04 | 1987-01-14 | 旭化成株式会社 | スル−ホ−ル回路 | 
| JPS6265496A (ja) * | 1985-09-18 | 1987-03-24 | 日本シイエムケイ株式会社 | プリント配線板の製造法 | 
| JPH06101621B2 (ja) * | 1987-07-03 | 1994-12-12 | 北陸電気工業 株式会社 | 回路基板のスルーホール接続部の製造方法と装置 | 
| JPH0171465U (cs) * | 1987-10-30 | 1989-05-12 | 
- 
        1988
        - 1988-08-10 JP JP1988105577U patent/JPH0547485Y2/ja not_active Expired - Lifetime
 
Also Published As
| Publication number | Publication date | 
|---|---|
| JPH0227768U (cs) | 1990-02-22 | 
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