JPH0546117B2 - - Google Patents

Info

Publication number
JPH0546117B2
JPH0546117B2 JP27105291A JP27105291A JPH0546117B2 JP H0546117 B2 JPH0546117 B2 JP H0546117B2 JP 27105291 A JP27105291 A JP 27105291A JP 27105291 A JP27105291 A JP 27105291A JP H0546117 B2 JPH0546117 B2 JP H0546117B2
Authority
JP
Japan
Prior art keywords
printed resistor
insulating layer
resistor
soldering
buffer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP27105291A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0513914A (ja
Inventor
Shizuo Sakurai
Kazuhiro Shimada
Takaharu Makino
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hokuriku Electric Industry Co Ltd
Original Assignee
Hokuriku Electric Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hokuriku Electric Industry Co Ltd filed Critical Hokuriku Electric Industry Co Ltd
Priority to JP27105291A priority Critical patent/JPH0513914A/ja
Publication of JPH0513914A publication Critical patent/JPH0513914A/ja
Publication of JPH0546117B2 publication Critical patent/JPH0546117B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Parts Printed On Printed Circuit Boards (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
JP27105291A 1991-10-18 1991-10-18 印刷抵抗体付き回路基板 Granted JPH0513914A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP27105291A JPH0513914A (ja) 1991-10-18 1991-10-18 印刷抵抗体付き回路基板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP27105291A JPH0513914A (ja) 1991-10-18 1991-10-18 印刷抵抗体付き回路基板

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP60148265A Division JPS629689A (ja) 1985-07-08 1985-07-08 印刷抵抗体付き回路基板

Publications (2)

Publication Number Publication Date
JPH0513914A JPH0513914A (ja) 1993-01-22
JPH0546117B2 true JPH0546117B2 (enrdf_load_stackoverflow) 1993-07-13

Family

ID=17494737

Family Applications (1)

Application Number Title Priority Date Filing Date
JP27105291A Granted JPH0513914A (ja) 1991-10-18 1991-10-18 印刷抵抗体付き回路基板

Country Status (1)

Country Link
JP (1) JPH0513914A (enrdf_load_stackoverflow)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10042764A1 (de) * 2000-08-31 2002-03-14 Moeller Gmbh Verfahren zur Herstellung eines massereichen ohmschen Widerstands und elektronische Baueinheit

Also Published As

Publication number Publication date
JPH0513914A (ja) 1993-01-22

Similar Documents

Publication Publication Date Title
US4684916A (en) Chip resistor
KR860000188B1 (ko) 혼성집적회로 부품 및 그 부착 방법
JPH02198198A (ja) 電磁波シールド層を備えるプリント配線板
US5641995A (en) Attachment of ceramic chip carriers to printed circuit boards
JPS5868996A (ja) プリント板上のモジユ−ルおよび導体路の損傷防止装置
GB2238169A (en) Mounting and terminating a capacitor
JPH0546117B2 (enrdf_load_stackoverflow)
JPH0566036B2 (enrdf_load_stackoverflow)
JPS5814621Y2 (ja) プリント配線基板
JPH0220860Y2 (enrdf_load_stackoverflow)
JPH0735413Y2 (ja) 混成集積回路におけるチツプ電子部品の取付構造
JP2507572Y2 (ja) 厚膜セラミック基板
JPS6153852B2 (enrdf_load_stackoverflow)
JP2545602Y2 (ja) ジャンパチップ
JP2595516Y2 (ja) ハンダ付け用ランド
JP2603863B2 (ja) プリント配線板
JP3162177B2 (ja) チップ部品の実装方法および配線基板
JPS6231190A (ja) 電子回路基板及びその製造方法
JPH07105592B2 (ja) プリント配線板の製造方法
JPS6310592Y2 (enrdf_load_stackoverflow)
JPS62132396A (ja) チツプ部品の実装方法
JPH09107172A (ja) 印刷回路基板
JPH0918123A (ja) プリント基板と電子部品の実装方法及び実装構造
JPH0359591B2 (enrdf_load_stackoverflow)
JPS6130425B2 (enrdf_load_stackoverflow)

Legal Events

Date Code Title Description
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 19941025