JPH0544839B2 - - Google Patents
Info
- Publication number
- JPH0544839B2 JPH0544839B2 JP59031472A JP3147284A JPH0544839B2 JP H0544839 B2 JPH0544839 B2 JP H0544839B2 JP 59031472 A JP59031472 A JP 59031472A JP 3147284 A JP3147284 A JP 3147284A JP H0544839 B2 JPH0544839 B2 JP H0544839B2
- Authority
- JP
- Japan
- Prior art keywords
- tungsten
- alumina
- layer
- glass
- conductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59031472A JPS60176297A (ja) | 1984-02-23 | 1984-02-23 | ハイブリツドic用多層基板 |
| KR1019840005623A KR900004379B1 (ko) | 1983-09-16 | 1984-09-15 | 세라믹 다층기판 및 그 제조방법 |
| GB08423483A GB2149222B (en) | 1983-09-16 | 1984-09-17 | Multilatered ceramic substrate and method of making the same |
| DE19843434449 DE3434449A1 (de) | 1983-09-16 | 1984-09-17 | Keramisches mehrschichtsubstrat und verfahren zu seiner herstellung |
| US06/898,892 US4732798A (en) | 1983-09-16 | 1986-08-21 | Multilayer ceramic substrate and method of making the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59031472A JPS60176297A (ja) | 1984-02-23 | 1984-02-23 | ハイブリツドic用多層基板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60176297A JPS60176297A (ja) | 1985-09-10 |
| JPH0544839B2 true JPH0544839B2 (enrdf_load_html_response) | 1993-07-07 |
Family
ID=12332202
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59031472A Granted JPS60176297A (ja) | 1983-09-16 | 1984-02-23 | ハイブリツドic用多層基板 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60176297A (enrdf_load_html_response) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0714105B2 (ja) * | 1986-05-19 | 1995-02-15 | 日本電装株式会社 | 混成集積回路基板及びその製造方法 |
-
1984
- 1984-02-23 JP JP59031472A patent/JPS60176297A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60176297A (ja) | 1985-09-10 |
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