JPH0544616B2 - - Google Patents

Info

Publication number
JPH0544616B2
JPH0544616B2 JP58187044A JP18704483A JPH0544616B2 JP H0544616 B2 JPH0544616 B2 JP H0544616B2 JP 58187044 A JP58187044 A JP 58187044A JP 18704483 A JP18704483 A JP 18704483A JP H0544616 B2 JPH0544616 B2 JP H0544616B2
Authority
JP
Japan
Prior art keywords
thick film
film circuit
vacuum
metal
pressure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP58187044A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6079242A (ja
Inventor
Ryoichi Kobayashi
Terumi Nakazawa
Kaoru Uchama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP58187044A priority Critical patent/JPS6079242A/ja
Publication of JPS6079242A publication Critical patent/JPS6079242A/ja
Publication of JPH0544616B2 publication Critical patent/JPH0544616B2/ja
Granted legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/14—Housings
    • G01L19/141—Monolithic housings, e.g. molded or one-piece housings
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/0007—Fluidic connecting means
    • G01L19/003—Fluidic connecting means using a detachable interface or adapter between the process medium and the pressure gauge
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/0061—Electrical connection means
    • G01L19/0084—Electrical connection means to the outside of the housing
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/14—Housings
    • G01L19/148—Details about the circuit board integration, e.g. integrated with the diaphragm surface or encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Fluid Pressure (AREA)
JP58187044A 1983-10-07 1983-10-07 圧力変換器 Granted JPS6079242A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58187044A JPS6079242A (ja) 1983-10-07 1983-10-07 圧力変換器

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58187044A JPS6079242A (ja) 1983-10-07 1983-10-07 圧力変換器

Publications (2)

Publication Number Publication Date
JPS6079242A JPS6079242A (ja) 1985-05-07
JPH0544616B2 true JPH0544616B2 (ko) 1993-07-06

Family

ID=16199189

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58187044A Granted JPS6079242A (ja) 1983-10-07 1983-10-07 圧力変換器

Country Status (1)

Country Link
JP (1) JPS6079242A (ko)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0441644U (ko) * 1990-08-08 1992-04-08
JP2547950Y2 (ja) * 1990-08-24 1997-09-17 ナイルス部品株式会社 厚膜圧力センサ
DE19631742C2 (de) * 1996-08-06 2000-07-20 Siemens Ag Elektronisches Sensor-Bauelement
JP3764375B2 (ja) 2001-11-15 2006-04-05 三菱電機株式会社 同期誘導電動機の回転子及び電動機の回転子及び同期誘導電動機及び誘導電動機及び直流ブラシレスモータ及び密閉型圧縮機及び冷蔵庫及び空気調和機和機及び同期誘導電動機の回転子の製造方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55124035A (en) * 1979-03-09 1980-09-24 Thomson Csf Pressure detector
JPS5636109A (en) * 1979-08-31 1981-04-09 Matsushita Electric Works Ltd Monostable type polar electromagnet
JPS57186137A (en) * 1981-05-12 1982-11-16 Fuji Electric Corp Res & Dev Ltd Pressure sensor
JPS5823494A (ja) * 1981-08-05 1983-02-12 株式会社東芝 厚膜集積回路の製造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55124035A (en) * 1979-03-09 1980-09-24 Thomson Csf Pressure detector
JPS5636109A (en) * 1979-08-31 1981-04-09 Matsushita Electric Works Ltd Monostable type polar electromagnet
JPS57186137A (en) * 1981-05-12 1982-11-16 Fuji Electric Corp Res & Dev Ltd Pressure sensor
JPS5823494A (ja) * 1981-08-05 1983-02-12 株式会社東芝 厚膜集積回路の製造方法

Also Published As

Publication number Publication date
JPS6079242A (ja) 1985-05-07

Similar Documents

Publication Publication Date Title
JPS63149531A (ja) 静電容量式圧力センサ
JPH1130559A (ja) 圧力センサ
JP3915605B2 (ja) 圧力センサ装置
JPH0544616B2 (ko)
JPH11326088A (ja) 圧力センサとその製造方法
US4400682A (en) Pressure sensor
JP2782572B2 (ja) 圧力センサとその製造方法
JPH01169333A (ja) 半導体圧力変換器
JPH02196938A (ja) 圧力センサ
JPH04267566A (ja) 高圧用半導体圧力センサ
JPS63175482A (ja) 圧力センサ
JPH0654273B2 (ja) 圧力センサ
JPH08226861A (ja) 圧力センサ並びにその実装構造
JP4103227B2 (ja) 圧力センサ
JP3220346B2 (ja) 圧力センサ及びその製造方法
JPH0566979B2 (ko)
JP3375533B2 (ja) 半導体圧力変換器
JP3349489B2 (ja) 圧力センサとその製造方法
JPH04350530A (ja) 半導体圧力センサ
JP3285971B2 (ja) 半導体圧力センサ
JPS6316240A (ja) 圧力検出器
JP2583137B2 (ja) 半導体圧力センサ
JPH04267565A (ja) 高圧用半導体圧力センサ
JP2616952B2 (ja) 半導体圧力センサ
JPS61245036A (ja) 半導体圧力検出装置