JPH0543181B2 - - Google Patents
Info
- Publication number
- JPH0543181B2 JPH0543181B2 JP25255685A JP25255685A JPH0543181B2 JP H0543181 B2 JPH0543181 B2 JP H0543181B2 JP 25255685 A JP25255685 A JP 25255685A JP 25255685 A JP25255685 A JP 25255685A JP H0543181 B2 JPH0543181 B2 JP H0543181B2
- Authority
- JP
- Japan
- Prior art keywords
- die bonding
- lead frame
- cam
- pellets
- die
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 230000007246 mechanism Effects 0.000 claims description 44
- 238000000034 method Methods 0.000 abstract description 4
- 239000008188 pellet Substances 0.000 description 80
- 210000000078 claw Anatomy 0.000 description 67
- 239000011295 pitch Substances 0.000 description 47
- 238000010586 diagram Methods 0.000 description 19
- 239000000463 material Substances 0.000 description 10
- 239000004065 semiconductor Substances 0.000 description 9
- 238000006073 displacement reaction Methods 0.000 description 5
- 229910000831 Steel Inorganic materials 0.000 description 4
- 239000010959 steel Substances 0.000 description 4
- 235000012431 wafers Nutrition 0.000 description 4
- 230000008878 coupling Effects 0.000 description 3
- 238000010168 coupling process Methods 0.000 description 3
- 238000005859 coupling reaction Methods 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- OFLYIWITHZJFLS-UHFFFAOYSA-N [Si].[Au] Chemical compound [Si].[Au] OFLYIWITHZJFLS-UHFFFAOYSA-N 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25255685A JPS62112331A (ja) | 1985-11-11 | 1985-11-11 | ダイボンデイング装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25255685A JPS62112331A (ja) | 1985-11-11 | 1985-11-11 | ダイボンデイング装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62112331A JPS62112331A (ja) | 1987-05-23 |
| JPH0543181B2 true JPH0543181B2 (enrdf_load_stackoverflow) | 1993-06-30 |
Family
ID=17239011
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP25255685A Granted JPS62112331A (ja) | 1985-11-11 | 1985-11-11 | ダイボンデイング装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62112331A (enrdf_load_stackoverflow) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2512105B2 (ja) * | 1988-10-14 | 1996-07-03 | 松下電子工業株式会社 | チップボンダ |
| JP6105333B2 (ja) * | 2013-03-11 | 2017-03-29 | ファスフォードテクノロジ株式会社 | 複数ボンディングヘッド位置合わせ方法及びダイボンダ |
-
1985
- 1985-11-11 JP JP25255685A patent/JPS62112331A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62112331A (ja) | 1987-05-23 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH04105737A (ja) | ハイブリッドｉｃのリードカット装置 | |
| US5575610A (en) | Transport-by-suction type die | |
| US4750263A (en) | Method of and apparatus for supplying and transferring electronic components | |
| CN109132578A (zh) | 循环物料传送系统 | |
| JPH0543181B2 (enrdf_load_stackoverflow) | ||
| EP0655883B1 (en) | General-purpose lead working machine | |
| CN209804625U (zh) | 固晶装置 | |
| JPH1074777A (ja) | リードフレーム搬送方法及び搬送装置 | |
| US5823418A (en) | Die transporting device | |
| JPH06278857A (ja) | 搬送装置 | |
| JP2005136193A (ja) | 樹脂封止成形装置 | |
| JP2004140047A (ja) | 樹脂封止装置 | |
| JPH0815935B2 (ja) | 電子装置の製造工程における電子装置の整列移載装置 | |
| JP2897455B2 (ja) | 捺印装置 | |
| JPH032495Y2 (enrdf_load_stackoverflow) | ||
| JP3015243B2 (ja) | ２以上のボンディングヘッドを有するボンディング装置 | |
| JP2984381B2 (ja) | インナリードボンディング装置 | |
| JPS6386551A (ja) | バンプ形成方法 | |
| JP2888231B2 (ja) | 捺印機におけるｉｃパッケージ位置決め装置 | |
| KR200288233Y1 (ko) | 반도체 리드프레임 또는 이와 유사한 부품의 정위치로딩장치 | |
| JP2961584B2 (ja) | 電子部品のベース部押え装置 | |
| JPH08773Y2 (ja) | レーザダイオード用チップボンディング装置における位置決め機構 | |
| KR200270011Y1 (ko) | 반도체팩키지용 리드프레임 정렬장치 | |
| JPS6198000A (ja) | Ｉｃ插着装置 | |
| JPS59113632A (ja) | ワイヤボンダ− |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |