JPS62112331A - ダイボンデイング装置 - Google Patents
ダイボンデイング装置Info
- Publication number
- JPS62112331A JPS62112331A JP25255685A JP25255685A JPS62112331A JP S62112331 A JPS62112331 A JP S62112331A JP 25255685 A JP25255685 A JP 25255685A JP 25255685 A JP25255685 A JP 25255685A JP S62112331 A JPS62112331 A JP S62112331A
- Authority
- JP
- Japan
- Prior art keywords
- die bonding
- lead frame
- cam
- die
- claw
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000007246 mechanism Effects 0.000 claims description 38
- 238000000034 method Methods 0.000 abstract description 5
- 230000008569 process Effects 0.000 abstract description 2
- 210000000078 claw Anatomy 0.000 description 61
- 239000008188 pellet Substances 0.000 description 58
- 239000011295 pitch Substances 0.000 description 35
- 238000010586 diagram Methods 0.000 description 16
- 239000004065 semiconductor Substances 0.000 description 9
- 239000000463 material Substances 0.000 description 7
- 238000006073 displacement reaction Methods 0.000 description 5
- 229910000831 Steel Inorganic materials 0.000 description 3
- 230000008859 change Effects 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 239000010959 steel Substances 0.000 description 3
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 235000012431 wafers Nutrition 0.000 description 2
- 101000852483 Homo sapiens Interleukin-1 receptor-associated kinase 1 Proteins 0.000 description 1
- 102100036342 Interleukin-1 receptor-associated kinase 1 Human genes 0.000 description 1
- 244000131360 Morinda citrifolia Species 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 235000013405 beer Nutrition 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 230000002496 gastric effect Effects 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 235000017524 noni Nutrition 0.000 description 1
- 238000010899 nucleation Methods 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25255685A JPS62112331A (ja) | 1985-11-11 | 1985-11-11 | ダイボンデイング装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25255685A JPS62112331A (ja) | 1985-11-11 | 1985-11-11 | ダイボンデイング装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62112331A true JPS62112331A (ja) | 1987-05-23 |
| JPH0543181B2 JPH0543181B2 (enrdf_load_stackoverflow) | 1993-06-30 |
Family
ID=17239011
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP25255685A Granted JPS62112331A (ja) | 1985-11-11 | 1985-11-11 | ダイボンデイング装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62112331A (enrdf_load_stackoverflow) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02106046A (ja) * | 1988-10-14 | 1990-04-18 | Matsushita Electron Corp | チップボンダ |
| JP2014175546A (ja) * | 2013-03-11 | 2014-09-22 | Hitachi High-Tech Instruments Co Ltd | 複数ボンディングヘッド位置合わせ方法及びダイボンダ |
-
1985
- 1985-11-11 JP JP25255685A patent/JPS62112331A/ja active Granted
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02106046A (ja) * | 1988-10-14 | 1990-04-18 | Matsushita Electron Corp | チップボンダ |
| JP2014175546A (ja) * | 2013-03-11 | 2014-09-22 | Hitachi High-Tech Instruments Co Ltd | 複数ボンディングヘッド位置合わせ方法及びダイボンダ |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0543181B2 (enrdf_load_stackoverflow) | 1993-06-30 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |