JPS62112331A - Die bonding device - Google Patents

Abstract

PURPOSE:To improve the operational efficiency of die bonding process by a method wherein two each of die bonding heads are arranged at a specified interval along the carrier path of lead frames to properly adjust the feed of lead frames on the carrier path. CONSTITUTION:Die bonding heads DB1, DB2 are arranged at the specified interval along the carrier path 11 of lead frames 10. A projecting plate 31 projecting the frame 10 on the carrier path 11 is fixed on the upper path of a slider block 32. The frame 10 projected on the specified position of carrier path 11 is intermittently shifted by cam followers 20b, 20a and slide cams 25, 21 respectively at the piece arrayal pitch or double distance to be aligned by projecting an alignment pin on a notch 5 of frame 10. Besides, the feed of frame 10 between heads DB1, DB2 is adjusted by a transfer pawl holder 13. Through these procedures, the operational efficiency of die bonding can be improved.

Description

DETAILED DESCRIPTION OF THE INVENTION (Industrial Application Field) The present invention relates to a die bonding device for fixing a semiconductor pellet to a lead frame. The present invention relates to a die bonding apparatus that performs 3a die bonding of two different kinds of pellets, 21 of the same kind of pellets, and one pellet.

(Prior Art) In general, in semiconductor devices, even if the package shape is the same, there are various semiconductor pellets sealed therein. For example, within one package? 2PNP
There are some that house two different types of pellets, such as ) transistors and NPN) transistors. Also, two similar pellets (e.g. two PN
P-transistor) or one pellet (for example, one PNP l-transistor). Guihonding, which is one process of assembling such a semiconductor device, will be explained below.

As mentioned above, in semiconductor devices using the same package, lead frames are used in which each piece has the same arrangement strategy in order to share assembly equipment such as a molding die.

FIG. 1O is a partial view showing an example of a lead frame used in a semiconductor device in which two pellets are housed in a package. In FIG. 3A, a portion surrounded by a chain line constitutes one unit (one piece) of the lead frame. The lead frame is composed of 36 pieces, and the arrangement pitch of each piece is 3.9 mm. Two pellets of the same type or different types are die-bonded into one piece of this lead frame. As shown in FIG. 2B, five leads la to 1e are formed in one piece of this lead frame. The tips of the leads 1a and 1b bulge out to form die bonding regions 2a and 2b. The centers of the die bonding regions 2a and 2b are aligned with the center line in the piece mounting direction.
↑And each one is 0.775mmt', i. This Guipondi〉・y area 2a, 2h nibeshi・nt 3a,
3b are each die-bonded. .

Then, the bellets 3a, 3b and the tip portions of the REIT ICs to 1e are connected to each other by a gold wire shown by a broken line in the figure.

- On the other hand, as shown in FIG. 10(a), guide holes 4 are formed at equal intervals along one longitudinal side edge of the lead frame.
is formed. This guide hole 4 is located on the center line of each piece of the lead frame, and the alignment depth is the same as that of each piece. In addition, two ■-shaped notches 5 are formed in each piece in the stitching facing the side edge of the lead frame in which the guide hole 4 is formed. The center line of each notch 5 is 0.7 with respect to the center line of the piece.
It is off by 75mm.

FIG. 11 is a partial view showing an example of a lead frame used when one pellet is housed in one package. The arrangement pitch of the pieces constituting this lead frame is the same as that of the lead frame shown in FIG.

Further, the sizes and positions of the guide holes 4 and notches 5 formed in this lead frame are also the same as those of the lead frame shown in FIG. 10. Each piece of this lead frame is formed with three gates 1f to 1h. The tip of the lead bulges out to form a die bonding area 2C.The center of this die bonding area 2C is aligned with the center line of the piece in the lead direction.

A pellet 3C is die-bonded to this die-bonding region 2C. -t, Berrett 3C and lead Ig
, 1h should be connected with the gold wire shown as a broken line in the figure.

FIG. 12 is a block diagram schematically showing the configuration of a conventional die bonding apparatus.

The lead frames before die bonding are fed out one by one by the loading mechanism +10 and placed on the second side of the transport path 150. The sent-out lead frame moves on the conveyance path 150 and the preform is attached to the mechanism section 12.
Sent to 0. For pasting the brief frame, the mechanical unit 120 pastes all seven preform materials, such as recon tape pieces, onto the Guihonding area within the valley piece of the lead frame.

The lead frame to which the preform material is attached is transferred to the next die bonding head 130. The die bonding head 130 selects a good product from among the pellets placed at a predetermined position and chucks it with a collet. The chucked pellet is then pressed against the hill of the preform material in the heated die bonding area of the lead frame and fixed.

The die-bonded lead frame is transferred to the unloading mechanism section 140i and stored in a predetermined lead frame storage container.

A case will be described in which two pellets of the same type are die-bonded to the lead frame shown in FIG. 10 using such a die-bonding apparatus.

The lead frame taken out from the loading mechanism +10 is intermittently transported on the transport path +50 in the direction indicated by the arrow in FIG. 10 at a piece arrangement pitch of 3.9 mm. Such transfer of the lead frame is carried out by hooking a claw reciprocally driven by a cam device or the like into the guide hole 4 of the lead frame.

On the other hand, in association with the die bonding head 130, a positioning pin is provided that is pressed against the notch 5 of the lead frame. The lead frame transferred to a predetermined position of the die bonding head 13 is accurately positioned by this bin. When the positioning is completed, the pellet is die-bonded to the die-bonding area 2b.

When the first die bonding is completed, the bin is removed from the lead frame and the cam device is started. Then, when the lead frame has advanced by 1.55 mm, the cam device comes to an intermediate stop. Then, the die bonding areas 2a, 2b of this lead frame
Since the center distance is 1.55n+m, the next die bonding area 2a will stop at a predetermined die bonding position. At this position, the second Guihonding is performed in the same manner as described above. When the second die bonding is completed, the cam device is subsequently driven, and as a result, the lead frame stops F after advancing one pitch (3.9 mm) from the time of the first die bonding. Die bonding is performed on the die bonding area 2b of the next piece by earing.

Thereafter, by performing an intermediate stop using the cam device in the same manner as described above, the die bonding area 2a of each piece,
2b are die-bonded with pellets of the same type.

On the other hand, when die bonding two different types of pellets to the lead frame shown in Fig. 1O, two die bonding heads 130a are used as shown in Fig. @13.
, 130h may be used. The lead frame taken out from the loading mechanism section 110 is intermittently transported along the transport path 150 at a pitch of 3.9 mm. The preform is attached to the mechanism section 12.
At step 0a, a preform material is attached to the die bonding area 2b, and further, at the die bonding head 1.20a, one of the pellets is die bonded to the die bonding area to which the surface preform material is attached. Then, in the next preform pasting, the preform material is pasted to the die bonding area 2b in the mechanism section 120b, and furthermore, the other bullet is die bonded to the marking area 2b in the die bonding head 130b.

(Problems to be Solved by the Invention) However, since the die bonding apparatus shown in FIG. 12 is equipped with only one die bonding head, two different types of pellets are die bonded in one piece. The problem is that it cannot be done. Therefore, when die bonding two different types of pellets in one piece, two devices as described above are used.
Different pellets are bonded to the die bonding area 2a.

It is necessary to perform die bonding 1 on each of 2b.

Alternatively, in the case of using one apparatus, the pellet of the die bonding head must be replaced and die bonding must be performed by passing the lead frame through the conveyance path twice. Whichever method is taken, the shingles are time-consuming and seriously reduce the production efficiency of the semiconductor %a.

Further, the center position of the die bonding area 2c of the lead frame shown in FIG. 11 is different from the three center positions of the die bonding areas 2a and 2b of the lead frame shown in FIG. 1O. Therefore, in order to perform die bonding to this lead frame using the die bonding apparatus described above, it is necessary to not only move the position of the die bonding head, but also change the position of the feed claw of the lead frame driven by the cam device. . However, these operations are very troublesome, and therefore, they can reduce the hedge efficiency of semiconductor devices.If the position of the die bonding head or feeding claw is not changed correctly, the die will be damaged. The spirit of bonding! Since y decreases, the product yield decreases, and the reliability of the semiconductor device also decreases (↓).

By the way, when die bonding two pellets of the same type using the die bonding apparatus shown in FIG. 13, the following inconvenience occurs. That is, due to the design of electronic circuits, two pellets of the same type housed in an l package are required to have characteristic values as close as possible. For this purpose, it is desirable to use the two notebooks housed in the same package in the same web.

However, when the die bonding apparatus shown in FIG.
Die bonded into the piece. Therefore, the two pellets in one piece are made from different wafers, resulting in the problem that the above requirements cannot be met.

The present invention has been developed in order to solve these problems. -11 Gui-1'! By the second ding device), Rietfrey! , 2 homologous berets and 12 developed berets in 1 piece! (2) The purpose of the present invention is to provide a die bonding device that can efficiently die bond each throat of one skin.

Another object of the present invention is to provide a die bonding device that can make the characteristic values of both pellets the same when die bonding two pellets of the same type into one piece of a REET frame.

(Means for Solving the Problems) In order to achieve the above object, the present invention has the following features I).

That is, the die bonding apparatus according to the present invention includes two die bonding heads that are arranged at a predetermined interval along the conveyance path of the lead gnome.

Sending out the reef freight to this conveyance path 1. is performed by the loading mechanism section. This funnel/mechanism section is equipped with a mechanism that appropriately changes the initial position of the lead frame sent out to the conveyance path.

The lead frame sent out to the conveyance path is intermittently fed by the lead frame transfer means at a distance equal to or twice the piece arrangement pitch of the lead frame. Further, this lead frame transfer means includes an intermediate stop mechanism that stops the movement of the lead frame during the intermittent feeding of the lead frame. Furthermore, the lead frame transfer means is arranged between the two die bonding heads.
It is also equipped with a fully variable feed mechanism that changes the feed amount of the lead frame.

(Hereinafter, blank space) (Example) If the configuration of the die bonding apparatus according to this example is shown in a diagram, it will be the same as that shown in FIG. The mechanism part, the first preform pasting is machine +1 Terabe, the first die bonding head 0)Bl), the second preform pasting is the mechanism part, the second die bonding head (D B 2)
Consists of gz and unloading mechanism.

However, the features of this embodiment reside in the loading mechanism section 1 shown in FIGS. 1 to 3 and the loading mechanism section shown in FIG. 4. By this transport means, etc., the L of the transport path is
By appropriately controlling the feed of the lead frame, the same die bonding device can skillfully perform three types of die bonding: two different types of pellets, two similar types of pellets, and songle berets. The lead frame used in this embodiment is the same as that shown in FIGS. 1O and 11.

The transfer means of the die bonding apparatus according to this embodiment will be described below with reference to FIGS. 1 to 3.

FIG. 1 is a front view of the transfer means, particularly showing the case where two different types of pellets are die-bonded.

In the figure, reference numeral 11 denotes a conveyance path through which the lead frame is intermittently conveyed. The lead frame is transported along this transport path 11 in the longitudinal direction. 12a-12 "is a claw holder, 13
is a transfer holder. Claw holder +2a~
12 "and transfer nail holder 13": At the end,
A triangular claw 14 with a so-called latigote mechanism
is provided. The tip of this claw 14 is the 10th
It is inserted from below into the guide hole 4 of the lead frame shown in the figure. And, as each claw holder will be described later,
By being driven back and forth along the direction of the conveyance path 11,
The lead frame moves intermittently to the right on the transport path il. Note that the transfer claw holder 13 can move the claws of the transfer claw boulder 13 downward L independently from other claw holders. This movement of the horn in the 1-F direction is carried out by means of a lever (not shown in the figure) set in the transfer claw holder 13. , the claw holder +2a to 12c and the trans-2y claw holder 13 to Noyaf l-15a, claw holder y12d -12ri, t + 7 to 15 h+
, :S fq4'tt fixed, S set. Nyaf l15a
One end side of the connecting members 16a and +6b is inserted and fixed in the. In addition, a connecting member 16e is attached to the seven-way shaft 15b.
One end of the skin 16d is inserted and fixed. Connecting member +
63. A soyaft 17a is inserted and fixed on the other end side of +6b, and is also a connecting member! A shaft +7b is inserted and fixed to the other end sides of 6c and +6d.

18 is a cylinder fixedly attached to a structural vertical plate 19. The distal end portion of the movable rod of this cylinder 18 is attached to the connecting member 16a. 20a
and 20b are cam followers individually attached to the connecting members I6a and 16b, respectively.

21 is a slide cam provided opposite to the connecting member 16a. This slide cam 21 is a cam follower 2
The connecting member hit 0b and was driven rightward by the cylinder 18! 6a (that is, the rightward movement of the claw 14). The slide cam 21 is supported by a guide member 22 so as to be slidable in a downward direction, and is driven by a cylinder not shown in the figure.

Further, a base portion of a stay 23 that supports the stopper 2.1 is attached to the guide portion l1t22. Stopper 2
4 restricts the movement of the connecting member 16a driven leftward by the cylinder 18 (that is, the leftward movement of the claw 14).

On the other hand, a slide cam 25 is provided opposite the connecting member 16b. This slide cam 25 is a cam follower.
20b, the movement of the connecting member 16b (that is, the movement of the claw 4), which moves to the right together with the connecting member 16a, is restricted.

The slide cam 25 is supported by a guide member 26 so as to be slidable in the vertical direction, and is driven by a cylinder not shown in the figure.

Attach the connecting member 27 to the right end of the connector h17a! There are 1. A slide cam 28 is recessed in contact with the coupling member 27 so as to be slidable in the vertical direction. This slide cam 28 is attached to the left end of Noyaft +7b (
It is in contact with the cam polo '7-20c that has been rotated, and is driven by Norin Y, which is not shown in the figure.

In addition, in the same figure, Table 1. I) [11
and D B 2 indicate the respective positions of the first die bonding head and the second die bonding head described above. In addition, 10 in the figure is a plan view of the lead frame that is transferred through the conveyance path II, and is shown for reference in order to make it easy to understand the positional relationship between each die bonding head and the guide hole 4 of the lead frame. It is something. Between the loading mechanism and the die bonding head DBI, which are not shown in the figure, the die bonding head I) I3
1 and the die bonding head DB2, the mechanical parts are installed on each side. An unloading mechanism (not shown in the figure) is installed at the right end.

Next, the configuration of the loading mechanism section will be explained with reference to FIG. 4. In this figure, the same parts as in FIG. 4 are indicated by the same reference numerals.

Reference numeral 31 denotes an ejecting plate for ejecting the lead frame IO into the transport path II. This protruding plate 3!
is fixed to the top of the slide block 32. The slide block 32 has bearing plates 33a at both ends.
, 33b supported by slide blocks 34a, 34b.
It is inserted into the frame and can be moved horizontally. The slide block 32 is driven by a cylinder not shown in the figure.

Further, in the bearings 1i7J, a stopper shaft 35 is screwed below the plate 33a. A stopper holder 36 is attached to the bearing of this stop shaft 35 at the tip end on the plate 33b side. There are three stoppers 37 on the inner surface of this stopper holder 36 divided by 120 degrees.
is installed vertically (however, only one stopper is currently shown in the figure). The height of each stopper 37 is determined as appropriate depending on the protrusion of the lead frame 10. The amount of movement of the slide block 32 is limited by the end surface of the slide block 32 in the to direction coming into contact with the tip of the stopper 37.

As shown in FIG. 3(h), a concave portion 38 is formed at the tip of the shaft 35 divided by 120 degrees. The distal end of the stopper shaft 35, which is formed with four parts 38, is fitted into a hole 39 formed in a plate 33h with some play.

As shown in FIG. 3B, a small hole 40 is formed that penetrates the hole 39 from below the bearing 13 plate 33b. A steel ball 41 is loosely fitted into this small hole 40. When this steel ball 41 is pushed upward by a spring 42 whose lower part is supported by a spring plunger 43, the steel ball 41 and the recess 38 of the stopper shaft 35 engage with each other, and the position of the stopper 37 is locked. .

On the other hand, a stopper handle 411 is attached to the other end of the stopper shaft 35, and by rotating this stopper handle 44, the appropriate stopper 37 can be adjusted.
is now selected.

Next, the operation of the Guibondinge device having the configuration described above will be explained.

First, there are two different types of Pelle! on the lead frame shown in Figure 1O. The following describes the case of die bonding. .

As shown in FIG. 5(a), the die bonding head 1
) The separation distance between Bl and die bonding DB2, that is,
The collet distance (7) of each die bonding head is set to a distance 1.55Il+m shorter than an odd multiple of the piece arrangement pitch (3.9mm) of the lead frame, where L=3. 9X n-1,55(m
m). In this embodiment, n=179 is set. The separation distance of the die bonding head DBISDB2 is the same for the die bonding described in +iii (also 31I).

Part 1. Therefore, the position of each claw 14 shown in FIG.
The center of the die bonding area 2a (hereinafter referred to as area I3) is set to the die bonding head DBI, and the center of the die bonding area 2a (hereinafter referred to as area A) is set to be located at the die bonding head DB2.

Further, the positioning bin 45 provided in relation to each die bonding head is as shown in FIG.
It is located at the same position as each die bonding head. However, this positioning bin 15 is configured so that its position can be changed during the guihonding of the Nunguru Beret, as will be described later.

When performing die bonding of different types of pellets, the lead frame is intermittently transferred one bit (3.9 mm) at a time along the conveyance path +1. For this purpose, the slide cam 25 is driven upward as shown in FIG. As a result, the connecting member 16
The distance between the cam follower 20b attached to the slide cam 25 and the slide cam 25 is set to a distance (3.9 mm) equal to one pitch. In this case, the distance between the cam follower 203 attached to the connecting member 16a and the slide cam 21 is equal to or larger than the pitch. Therefore, since the movement of the connecting member 20b and the like driven rightward by the cylinder 18 is restricted by the slide cam 25, each claw of the claw holders 12a=12c and the transfer claw holder 13 can reciprocate by one pitch. become. At this time, the movement of the shaft 17a is caused by the movement of the coupling member 2.
7 and the slide cam 28 to the shaft 17b, each of the claws of the claw holders 12d to 12'' also performs the reciprocating movement of the l bitge together with the respective claws.

On the other hand, with respect to the loading mechanism shown in FIG. 4, when performing die bonding of different types of pellets, the operator rotates the stopper handle 44 to select the stopper 37 for die bonding of different types of pellets. The length of this stopper 37 is such that when the lead frame placed on the protrusion 2 plate 31 is protruded by a cylinder (not shown), the guide hole 4 of the lead frame is
It is set to be at the position of claw 14 of 2a, +.

Therefore, when the lead frame is pushed out from the loading mechanism section, the lead frame is caught by the claw of the claw holder +2a, and the lead frame is pushed out from the loading mechanism part to the first lead frame every pitch. They are sequentially transferred to the right in the figure. Thereafter, this lead frame is hooked with another claw and transported further to the right along the transport path 11.

When the first piece of the lead frame comes to the position of the die bonding head DBI, the positioning bin 45
The lead frame is positioned by protruding forward and inserting its tip into the notch 5 of the lead frame.

Then, a collet (not shown) of the die bonding head DBI chucks, for example, a PNI transistor and transfers it to area B of the lead frame under heating.
Die bonding is performed by pressing the When die bonding in area B is completed, the positioning bin 45 is moved back and the lead frame is transferred one pitch. Then, die bonding is performed on region B of the next piece in the same manner as described above.

The lead frame that has undergone die bonding in area B is further transported to the right along the transport path and reaches the die bonding head DB2. Then, as in the case of the surface die bonding head DBI, after the lead frame is positioned by the positioning pin 45, die bonding of, for example, an NPN transistor is performed in the area A.

The lead frame on which die bonding of the two different types of pellets has been completed is transferred to an unloading mechanism installed at the right end of the conveyance path 11, where it is stored in a predetermined container.

Note that the preform pasting mechanism section placed in front of each die bonding head is also installed in the same positional relationship as each die bonding head. therefore,
For preform pasting installed in front of die bonding head DB1, the mechanical part is placed in area B of the lead frame, and for preform pasting installed in front of die bonding head DB2, the mechanical part is placed in area B of the lead frame. Glue the briform material on each desk individually.

Next, a case in which a non-glue pellet is die-bonded will be described.

In this case, the lead frame shown in FIG. 11 is used.

In this case, the die bonding head l) II l is
Die bonding is performed on the odd numbered pieces of the lead frame, and die bonding is performed on the even numbered pieces of the Guihonding head I)B2. For this purpose, it is necessary to feed the lead frame two pitches.

In order to feed the lead frame two pitches, as shown in FIG. 2, the slide cam 21 is pushed down by a cylinder (not shown). As a result, the connecting member 16a
The distance between the cam follower 20a attached to the slide cam 21 and the slide cam 21 is a distance (7.8 mm) equal to two pitches of the lead frame.

Further, the slide cam 25 is pushed down.

As a result, the distance between the cam follower 20b and the slide cam 25 becomes longer than the distance of two lead frame pitches. 1. Therefore, since the movement of the cylinder 18 is limited by the slide cam 2I, at this time the claw 4
This results in a reciprocating motion equivalent to two pitches of the lead frame.

On the other hand, as can be seen by comparing FIG. 5(a) and FIG. 5(b), when die bonding a single pellet with the die bonding head DBI, the lead frame has a lower diameter than when die bonding a different type of pellet. .7
It must be 75mm to the right. For this purpose, as shown in FIG.
Add V by 0°775mm to the right of o. This moves the shaft 15a to the right, so each claw moves to the right.
．． Shift by 775mm.

When the claw I4 is moved to the right as described above, the initial position of the lead frame projected into the transport path 11 must also be changed accordingly. This is done by rotating the stopper handle 44 of the loading mechanism to select the single bullet stopper 37. That is,
The stopper 37 for the single bullet is 0.775 mm shorter than the stopper 37 for the IAI "I", so the protrusion Δ protrusion plate 3
This can be achieved by increasing the amount of protrusion of 1.

On the other hand, if we look at die bonding head DB2,
Compare Figure 5(a) and Figure 5(b) 1. As can be seen, in the case of a single pellet, it is necessary to shift the grain by 0.775 mm to the left than in the case of a seeding pellet. Moreover,
As mentioned above, in relation to the die bonding head D131, the lead frame is moved to the right by 0°775mm, so in the end, the die bonding head DBI
and DB2, use one lead frame instead of two pitches.
．． Only one short feed of 55+I1m has to be made. Such die bonding heads DBI and D
Adjustment of the transition distance of the lead frame between B2 and B2 is performed by the transfer claw holder 13, as will be described later.

A claw holder I2d related to the die bonding head DB2, which is significant even though the feed amount of the lead frame is shortened by 1.55 mm by the transfer claw holder 13.
, I 2e, 12r position 1 to the left
．． It is necessary to move it by 55mm. This can be achieved by pulling the slide cam 28 upward as shown in FIG. 2(b). That is, since the step of the slide cam 28 is set to 1.55 mm, when the slide cam 28 is pulled upward, the claws of the respective claw holders are shifted to the left by 1.55 mm.

1. When the position of each claw and the amount of protrusion of the lead frame are set as described above, the transport path 1 is
The lead frame protruding from 1 is the claw holder 12a.
Two pitches are intermittently transferred by each claw of -12c. Then, a PNP transistor, for example, is die-bonded to the odd-numbered piece by the die bonding head Dr31. die bonding head DBI
The lead frame that has undergone die bonding is
It is further transferred to the right by the claw 14 of the J. Lance Farme holder 13. Then, at the time of the final pitch feed of the lead frame, the transfer claw holder +
3, a cylinder (not shown) is driven to lower the claw 14 at a point shorter than 2 pitches by 1.55 mI+1. As a result, the lead frame is transferred only once between the die bonding head DBI and the die bonding head DB2 by a distance 61.55 mm shorter than two pitches.

After the transfer distance is adjusted between both die bonding heads in this way, the elevator frame is further transferred to the right side by the claws 14 of the claw holders 12d, 12e, and 1N. , die bonding head DB2
Die bonding is performed by.

(Hereinafter, blank space) Next, a case will be described in which two pellets of the same type are die-bonded using the lead frame shown in FIG. 1+.

In this case, the die bonding head DBI is in charge of die bonding of two pieces pere and soto of the odd numbered pieces of the lead frame, and the die bonding head DB2 is in charge of die bonding of the even numbered pieces. Therefore, the lead frame is fed 2 pitches, but because the same die bonding head is used to bond and ink two pellets in one piece, 1 pitch is better than 2 pitches.
An intermediate stop is made at a point shorter than 551nI11, die bonding is performed on area B of the lead frame, and then l
, 55a+ll, and die bonding of area A is performed.

FIG. 5(c-1) shows the intermediate stop state, and FIG. 5(c-2) shows the state when pitch feeding is completed.

As can be seen by comparing Figure 5(a) and Figure 5(c-2), in the case of die bonding with the same type of pellet, the lead frame is moved 1.5 to the right more than when using a different type of pellet.
5mm. It is necessary to shift the slider 29 by 1.55mm to the right as shown in Figure 3. is being changed.

In addition to changing the position of the claw 14 described above, the conveyance path 1
The initial position of the lead frame that is pushed out at point 1 is also to the right.
It must be shifted by 551.

This is done by rotating the stopper handle 44 of the loading mechanism to select the stopper 37 for the same type of pellet as described above. In other words, since the stopper 37 for the same type of beer is set to be 1.55 mm shorter than that for the gastric type, the ejector bottle of the ejector plate 31 is made that much longer.

On the other hand, the slide cam 21 is driven by a cylinder (not shown) and pulled upward. As a result, the distance between the cam follower 20a of the connecting member 16a and the slide cam 21 is set to a distance shorter than 2 pitches by 155 ml11. This state is the above-mentioned intermediate stop state. When the slide cam 21 is pulled down, the distance between the cam follower 20a and the slide cam 21 becomes a distance of two bibutu. Also, the slide cam 25 is pulled down and the distance between the cam follower 20b and the slide cam 25 is longer than the 2-bibutton distance.
Movement of the cylinder 18 is limited by the slide cam 21. In addition, as shown in the same figure, the slide cam 28
is pulled upwards.

When the feeding distance of the loading mechanism section and the position of each claw 14 are set in this way, the lead frame projected from the loading mechanism section is sequentially transferred to the right on the conveyance path 11. At this time, since the slide cam 21 is pulled upward during the first 2-pitch feed, the lead frame stops at a position 1.55 mm shorter than the 2-pitch feed. In this state, as shown in FIG. 5(e-1), die bonding of region B is performed by the die bonding head DBI. When this die bonding is completed, the slide cam 21 moves downward, and the lead frame is moved further to the right by 1.55 mm, completing the 2-pitch feed.
As shown in -2), die bonding of area A is performed.

In this way, when die bonding of two pellets of the same type is completed one piece at a time, the lead frame is further transferred to the right on the conveyance path 11. Then, between the die bonding throat DI 31 and the die bonding throat D 132, transfer is performed that is 1.55+nm shorter than 2 pitches, as in the case of the single pellet described above. After that, claw holder +2d~12
The lead frame is further moved to the right by each claw f, and two pellets of the same type are die-bonded to even-numbered pieces by the die bonding head DB2. In this case as well, of course the intermediate stop is performed as described above, and the lead frame is moved by 3 degrees by the slide cams 21 and 25 as explained in the previous embodiment. It is not limited to t) which limits the support of cylinder I8. For example, this can also be realized by driving the connecting member 163 with a cam. FIG. 6 shows an embodiment of a transfer means that changes the bit feed of the pawl 4 by such a cam drive. The same figure (a
) shows a plan view, and the same figure (b) shows a front view. In addition, in the same figure, the same parts as in FIGS. 1 to 3 are indicated by the same reference numerals.

Slide rails 51a are arranged opposite to both ends of the base plate 50.
, 51b are provided. This slide rail 51a
, 51b, a slide unit 52a152b is slidably attached. This slide unit 52
A slide base plate 53 is fixed to a and 52b.

Three feed cams 55a, 5 are attached to a shaft 54a whose both ends are rotatably supported by a slide base plate 53.
6a and 57a are inserted and fixed. These cams are
This is for driving the claws 14 of the claw holders l2a, l2b, l2c and the transfer claw boulder 13. Hereinafter, the cams 55a, 56a, and 57a will be referred to as L-side feed cams.

On the other hand, there is a shaft 54b in the direction of the above-mentioned Noyafu l-54aLm, and three feed cams 55b, 56b, and 57b are inserted and fixed into this glossy 7-tooth 54b as well.

These cams are the pawl holders 12d,! This is for driving each claw 14 of 2e and 12r. Hereinafter, these cams will be referred to as R-side feed cams.

A pulley 58a158 is provided on the shafts 54a, 54b.
b are attached to each. Also. both shafts 5
4a, 54b, there is a motor 60, and the pulleys 58c, 58 are attached to the rotating shaft of this motor 60;
Bells 1-59a and 59b are hooked between d and the front 5 pulleys 58a and 5811.

On the other hand, the lever brackets 6Ia and 61 are attached to the base plate 50.
b are provided facing each other. This lever bracket 6
Levers 62a and 62b whose bases are swingably supported are attached to La and 61b. lever 62a,
Cam followers 63a and 63b are individually attached to each tip portion of 62b. Cam follower 63a
is the shaft 1 supporting the claw holder 12a
It is in contact with a connecting member 64a attached to 5a.

Further, the cam follower 63b of the lever 62b is in contact with a connecting member 64b that supports the claw boulder 12d and the like.

In addition, the cam follower 65a installed in the middle of (shi) Moreover, the cam follower 65h attached to the middle of the lever 62b is in contact with one of the feed cams on the R side.

A long hole 66 is formed in the temporary sliding base 53. A switching follower 67 is loosely fitted into this elongated hole 66. This switching follower 67 is adapted to move in the Y direction shown in the figure in conjunction with a switching lever 68 that swings horizontally about a fulcrum A. The tip of the switching lever 68 is connected to the halt member 6 fixed to the base plate 50.
9 and is biased downward. Further, grooves 70 are formed at both ends of the inner hole of the holding member 69 and at the center 13I6. This concave groove 70 and the lever 68 are engaged to lower the lever 68 (the device).

In the above-mentioned practical example, operator Kashiku-68
If you move the slide base plate 53 in the left and right horizontal directions, the slide base plate 53
A force in the Y direction is applied to 7. Slide unit 52a, :'52b or slide rail 51a, 51b
move along. (1), the levers 62a, 62
The feed cams on the I side and the Il side that contact the cam followers 65a and 65b attached to the side b are switched.

When the motor 60 is rotationally driven, the feed cam rotates, and the lever 62 follows the cam curve by 1 degree.
By driving a and 62b, each claw I4 corresponds to the cam curve1. It will be reciprocated with a predetermined pinch. 1 Figures 7 to 9 show the cam diagrams of the I, side and R side feed cams, the solid line is the cam diagram of the L side feed cam, and the chain line is the cam diagram of the L side feed cam. are shown respectively.

FIG. 7 shows a cam diagram of feed cams 55a and 55b for dissimilar pellet die bonding.

When bonding different types of pellets, as mentioned above, between the die bonding heads DBI and DB2,
Since there is no need to adjust the feed rate of the lead frame, L
The cam diagrams for the side and R side are the same. DB indicated by an arrow in the same figure indicates the timing at which die bonding is performed.

The reason why the cam displacement in the feed section shown in the figure is longer than one pitch (3.9ml++) of the lead frame is due to the inclination of the claw 14, the clearance between the claw 14 and the guide hole 4 of the lead frame, etc. This is because it was taken into consideration. Also, the reason why the step of the cam in the return section is longer than the length of one pitch of the lead frame (3.9 mm) is because
When the ratchet mechanism pawl ■4 moves leftward ζ and returns twice? This hits the back side of the lead frame and tilts to the right, so if you just return it to the left by the pitch,
The tip of the lead frame is Kaij, Hole, 4i, -Human:
I don't know what to do.

The same can be said of the cam diagrams shown in FIGS. 8 and 9.

FIG. 8 shows a cam diagram of the feed cams 56a and 56b for single beret and l-toy pounding.1. ing. In this case, as explained in FIG.
．． Since it is protruded by 775mm more, the length is L by that much.
The cam displacement when the side advancing cam is at 0 degrees is made longer by the upward movement of a different type of pellet.

Further, in the case of non-gel die bonding, a difference of 1.55 nu++ is set in the cam displacement at 0 degrees between the die bonding head DBI and the die bonding head DB2 due to the transfer feed.

FIG. 9 shows a cam diagram of a feed cam for homogeneous pellet die bonding. In this case, as explained in Fig. 3, the protruding bottle of the lead frame is protruded 1°55 mm more than when using a different type of pellet, so that when the L side advance cam is at 0 degrees, The cam displacement is longer than when using a different type of pellet. Further, in this case, because of the transfer feed, a difference of 1.55 mm is provided between the cam displacements of both cams at 0 degrees.

It should be noted that the die bonding device described in the above embodiment is equipped with a mechanical section for attaching the preform, or the die bonding area of the lead frame is plated with gold in advance. (J mechanism part does not need to be installed.)

In addition, the unloading mechanism section for storing the lead frame in a container, which is installed in the apparatus of the embodiment (2), can perform the die bonding that is the object of the present invention even if it is not provided. shall not be an essential component of

Further, in the embodiment, the lead-frame transport means I
Although two examples are shown in -, the present invention is not limited to these, and it is natural that similar modifications can be made.

In addition, in the description of the embodiment, 1. 1 as shown in Figure 11 as a lead frame for y-ponding.
．． Use cod and noni. However, this reduced frame can be used, for example, as shown in FIG. 14. In this lead frame, the center of the die bonding region 2C and the center of the notch 5 are on the same line. Therefore, when this lead frame is used, there is no need to move the positioning bin 45 as described above, and work efficiency is further improved.

. (Effects) Since the present invention has the above-described configuration, there are two different kinds of berets and two same kind of berets! In addition, when performing the three types of die bonding, there is no need to change the position of the die bonding heel or the like when performing the three types of die bonding. According to the present invention, compared to the conventional device (7), it is easy to change the model of the 3/2 model. Significantly improves work efficiency
Furthermore, according to the Guibonde, I/'7, device according to the present invention, it is possible to feed the lead frame by 2 pitches and to make an intermediate stop on the way. Therefore, two similar pellets can be die-bonded into one piece of lead frame by the same die-bonding head. That is, two homogeneous pellets die-bonded into one piece,
This means that they can be taken out from within the same wafer.

Therefore, according to the present invention, it is possible to die bond two pellets of the same type having similar characteristic values.

[Brief explanation of drawings]

FIGS. 1 to 3 are block diagrams schematically showing the transfer means that are the main parts of the die bonding apparatus according to the embodiment, and FIG. 4 is a block diagram schematically showing the loading mechanism section of the die bonding apparatus according to the embodiment. , FIG. 5 is an explanatory diagram of the bit feeding of the lead frame of the above embodiment, FIG. 6 is a cam diagram of a die bonding apparatus and cam according to another embodiment, and FIGS. 10 and 11 are die bonding. An explanatory diagram of the lead frame, FIG. 12 and FIG. 13, is a diagram showing the configuration of the device in the Congo Song Dynasty. However, 1-1, Kizenshi 2)
The configuration of the die bonding apparatus according to the actual reverse example is also shown in the same manner as in FIG. 13. FIG. 14 is an explanatory view showing an embodiment of the lead 7 and the arm used for non-gel pellets.
3. Transfer claw holder, 14. claw, 15a,
15b...shaft, 16a-16d...connection part O, +7a, I7b=-shift Vft, l8□=
7 phosphorus 5', 2+. 25.28 ・Slide cam, 29 Slider, 31
・Extrusion plate, 32 ・Slide plate [knock, 5
3 Temporary slide base, 55a, 56a, 57a, 55
b, 56b, 57b...Feed cam.

Claims (1)

[Claims] (1) Two die bonding heads arranged at a predetermined distance apart along a lead frame transport path, feeding the lead frame onto the transport path, and an initial position of the lead frame sent out onto the transport path. a loading mechanism section that varies the lead frame sent out to a predetermined position on the conveyance path, a feeding mechanism that intermittently feeds the lead frame sent out to a predetermined position on the conveyance path at a distance equal to or twice the piece arrangement pitch of the lead frame; A die characterized by comprising: an intermediate stop mechanism for stopping the frame; and a feed rate variable mechanism for varying the feed rate of the lead frame between the two die bonding heads. bonding equipment.