JPH054294Y2 - - Google Patents
Info
- Publication number
- JPH054294Y2 JPH054294Y2 JP2139690U JP2139690U JPH054294Y2 JP H054294 Y2 JPH054294 Y2 JP H054294Y2 JP 2139690 U JP2139690 U JP 2139690U JP 2139690 U JP2139690 U JP 2139690U JP H054294 Y2 JPH054294 Y2 JP H054294Y2
- Authority
- JP
- Japan
- Prior art keywords
- display
- film
- printed wiring
- base film
- characters
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000010408 film Substances 0.000 claims description 26
- 239000012787 coverlay film Substances 0.000 claims description 24
- 239000004020 conductor Substances 0.000 claims description 10
- 239000010410 layer Substances 0.000 description 10
- 238000005553 drilling Methods 0.000 description 4
- 238000007689 inspection Methods 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000004891 communication Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 230000008034 disappearance Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 229920003055 poly(ester-imide) Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 238000007788 roughening Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Structure Of Printed Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2139690U JPH054294Y2 (US20110232667A1-20110929-C00004.png) | 1990-03-05 | 1990-03-05 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2139690U JPH054294Y2 (US20110232667A1-20110929-C00004.png) | 1990-03-05 | 1990-03-05 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03112963U JPH03112963U (US20110232667A1-20110929-C00004.png) | 1991-11-19 |
| JPH054294Y2 true JPH054294Y2 (US20110232667A1-20110929-C00004.png) | 1993-02-02 |
Family
ID=31524445
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2139690U Expired - Lifetime JPH054294Y2 (US20110232667A1-20110929-C00004.png) | 1990-03-05 | 1990-03-05 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH054294Y2 (US20110232667A1-20110929-C00004.png) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5163292B2 (ja) * | 2008-06-02 | 2013-03-13 | 日立電線株式会社 | プリント配線板用金属張基板およびプリント配線板ならびにその製造方法 |
| WO2011146258A2 (en) * | 2010-05-20 | 2011-11-24 | 3M Innovative Properties Company | Flexible circuit coverfilm adhesion enhancement |
-
1990
- 1990-03-05 JP JP2139690U patent/JPH054294Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH03112963U (US20110232667A1-20110929-C00004.png) | 1991-11-19 |
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