JPH0541704B2 - - Google Patents
Info
- Publication number
- JPH0541704B2 JPH0541704B2 JP1146280A JP14628089A JPH0541704B2 JP H0541704 B2 JPH0541704 B2 JP H0541704B2 JP 1146280 A JP1146280 A JP 1146280A JP 14628089 A JP14628089 A JP 14628089A JP H0541704 B2 JPH0541704 B2 JP H0541704B2
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- holder
- substrate holder
- groove
- present
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
- 
        - C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/50—Substrate holders
 
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
- Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title | 
|---|---|---|---|
| JP14628089A JPH0313577A (ja) | 1989-06-08 | 1989-06-08 | スパッタ装置の基板ホルダ | 
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title | 
|---|---|---|---|
| JP14628089A JPH0313577A (ja) | 1989-06-08 | 1989-06-08 | スパッタ装置の基板ホルダ | 
Publications (2)
| Publication Number | Publication Date | 
|---|---|
| JPH0313577A JPH0313577A (ja) | 1991-01-22 | 
| JPH0541704B2 true JPH0541704B2 (OSRAM) | 1993-06-24 | 
Family
ID=15404150
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date | 
|---|---|---|---|
| JP14628089A Granted JPH0313577A (ja) | 1989-06-08 | 1989-06-08 | スパッタ装置の基板ホルダ | 
Country Status (1)
| Country | Link | 
|---|---|
| JP (1) | JPH0313577A (OSRAM) | 
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title | 
|---|---|---|---|---|
| US5855687A (en) * | 1990-12-05 | 1999-01-05 | Applied Materials, Inc. | Substrate support shield in wafer processing reactors | 
| US5304248A (en) * | 1990-12-05 | 1994-04-19 | Applied Materials, Inc. | Passive shield for CVD wafer processing which provides frontside edge exclusion and prevents backside depositions | 
| CN104900567A (zh) * | 2014-03-04 | 2015-09-09 | 北京北方微电子基地设备工艺研究中心有限责任公司 | 一种托盘以及腔室 | 
| JP2017155282A (ja) * | 2016-03-01 | 2017-09-07 | 株式会社アルバック | 成膜装置、プラテンリング | 
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title | 
|---|---|---|---|---|
| JPS55121648A (en) * | 1979-03-14 | 1980-09-18 | Pioneer Electronic Corp | Cvd device | 
| JPS5842444Y2 (ja) * | 1980-06-30 | 1983-09-26 | 日本真空技術 株式会社 | ウエハの支承装置 | 
- 
        1989
        - 1989-06-08 JP JP14628089A patent/JPH0313577A/ja active Granted
 
Also Published As
| Publication number | Publication date | 
|---|---|
| JPH0313577A (ja) | 1991-01-22 | 
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Legal Events
| Date | Code | Title | Description | 
|---|---|---|---|
| EXPY | Cancellation because of completion of term |