JPH0537478Y2 - - Google Patents
Info
- Publication number
- JPH0537478Y2 JPH0537478Y2 JP1987182884U JP18288487U JPH0537478Y2 JP H0537478 Y2 JPH0537478 Y2 JP H0537478Y2 JP 1987182884 U JP1987182884 U JP 1987182884U JP 18288487 U JP18288487 U JP 18288487U JP H0537478 Y2 JPH0537478 Y2 JP H0537478Y2
- Authority
- JP
- Japan
- Prior art keywords
- chip
- resin
- electronic components
- glass substrate
- transparent substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000758 substrate Substances 0.000 claims description 35
- 239000011347 resin Substances 0.000 claims description 34
- 229920005989 resin Polymers 0.000 claims description 34
- 239000000463 material Substances 0.000 claims description 32
- 239000011521 glass Substances 0.000 description 22
- 239000004973 liquid crystal related substance Substances 0.000 description 15
- 239000003990 capacitor Substances 0.000 description 8
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 6
- 230000035939 shock Effects 0.000 description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 239000003566 sealing material Substances 0.000 description 2
- 238000003848 UV Light-Curing Methods 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000001723 curing Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229910003437 indium oxide Inorganic materials 0.000 description 1
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 1
- 229910001887 tin oxide Inorganic materials 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987182884U JPH0537478Y2 (th) | 1987-12-02 | 1987-12-02 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987182884U JPH0537478Y2 (th) | 1987-12-02 | 1987-12-02 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0187551U JPH0187551U (th) | 1989-06-09 |
| JPH0537478Y2 true JPH0537478Y2 (th) | 1993-09-22 |
Family
ID=31474325
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987182884U Expired - Lifetime JPH0537478Y2 (th) | 1987-12-02 | 1987-12-02 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0537478Y2 (th) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58139462A (ja) * | 1982-02-15 | 1983-08-18 | Hitachi Ltd | 固体撮像素子 |
| JPS62127788A (ja) * | 1985-11-28 | 1987-06-10 | 松下電器産業株式会社 | 電極接続方法 |
-
1987
- 1987-12-02 JP JP1987182884U patent/JPH0537478Y2/ja not_active Expired - Lifetime
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58139462A (ja) * | 1982-02-15 | 1983-08-18 | Hitachi Ltd | 固体撮像素子 |
| JPS62127788A (ja) * | 1985-11-28 | 1987-06-10 | 松下電器産業株式会社 | 電極接続方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0187551U (th) | 1989-06-09 |
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