JPH0537478Y2 - - Google Patents

Description

[Detailed description of the invention] [Technical field of the invention] This invention relates to a mounting structure for electronic components such as IC chips.

[Prior art and its problems] In recent years, liquid crystal display panels used in small electronic devices such as electronic watches have become increasingly difficult to display time and other information in response to demands for smaller devices, fewer parts, and lower costs. In addition to displaying information, it also serves as a circuit board on which electronic components such as IC chips are installed. That is,
As shown in FIG. 3, this type of liquid crystal display panel a has transparent glass substrates 1 and 2 of different sizes facing each other vertically, and transparent electrodes (not shown) are formed on the opposing surfaces. The display part b is constructed by sealing the liquid crystal 3 between the opposing sides through a frame-shaped sealing material 4, and electrodes are placed on the upper glass substrate 2 or on the protruding portion of the lower glass substrate 1 that protrudes laterally. A pattern 5 is formed, and various electronic components such as an IC chip 6 and a chip capacitor 7 are electrically connected and mounted on the electrode pattern 5, thereby forming a circuit board section c. In addition, IC
The chip 6 is sealed with a sealing resin 6a.

Electronic components mounted on the glass substrate 1 of such a liquid crystal display panel a, such as the chip capacitor 7, are bonded to the electrode pattern 5 with solder 8 as shown in FIG. 4A. A transparent conductive layer 5a is formed by vapor depositing ITO (a mixture of indium oxide and tin oxide) on the glass substrate 1 at the same time as the transparent electrode of the display part b, and this conductive layer 5a
It has a structure in which a nickel layer 5b and a gold layer 5c are laminated thereon by plating. Therefore, the adhesion of the plated parts of the nickel layer 5b and the gold layer 5c to the glass substrate 1 is weak, and when an impact is applied, cracks occur in the plated parts of the nickel layer 5b and the gold layer 5c, resulting in poor conductivity of electronic components. In the worst case, electronic components may fall off as shown in FIG. 4B.

In addition, in order to solve this problem, the fifth
As shown in the figure, the electrode pattern 5 on the glass substrate 1
After bonding electronic components such as a chip capacitor 7 on top with solder 8, the electronic components are bonded to a resin member 9 such as rubber.
The idea is to protect it by covering it with However, in this method, the resin member 9 must be manufactured separately, cover the electronic components, and be attached using an adhesive or the like, so the manufacturing and assembly operations are complicated and the productivity is extremely low.

[Purpose of the invention] This invention was made in view of the above-mentioned circumstances, and its purpose is to fix the IC chip easily and reliably, and to protect the IC from shocks.
It is an object of the present invention to provide a mounting structure for electronic components that can protect chips.

[Main points of the invention] In order to achieve the above-mentioned purpose, this invention forms an electrode pattern on a transparent substrate to which an IC chip is connected, and also forms a shielding pattern corresponding to the mounting position of the IC chip. was given
The IC chip is covered with a cushioning material with a recess formed to correspond to the IC chip, the recess of the cushioning material is filled with a photocurable resin material, and the photocurable resin material is irradiated with light through the transparent substrate. The key point is that the IC chip is sealed and the IC chip and cushioning material are fixed to the transparent substrate.

[Example] Hereinafter, an example in which this invention is applied to a liquid crystal display panel will be described with reference to FIGS. 1 and 2. In this case, the same parts as in the conventional example described above are given the same reference numerals, and the explanation thereof will be omitted.

The liquid crystal display panel a has a pair of upper and lower glass substrates 1 and 2 of different sizes facing each other, transparent electrodes are formed on the facing surfaces, and the liquid crystal 3 is placed between the facing surfaces by a frame-shaped sealing material 4. By sealing the IC with the electrode pattern 5 on the lower glass substrate 1 protruding laterally from the upper glass substrate 2, the display part b that displays information such as the time is formed.
Electronic components such as the chip 6 and the chip capacitor 7 are electrically connected by solder 8 and joined together.
These electronic components are made using ultraviolet curing resin (hereinafter referred to as UV curing resin).
A circuit board portion c is formed by covering the circuit board portion c with a resin (referred to as resin) 10 and a cushioning material 11. in this case,
The UV resin 10 solidifies when irradiated with ultraviolet rays, and covers all the electronic components to form the liquid crystal display panel a.
It is provided on the entire surface of the circuit board section c. Also,
The cushioning material 11 is made of a soft resin such as rubber, and is provided to cover the entire UV resin 10 so as to protect each electronic component. Note that a shielding pattern 12 is formed on the glass substrate 1 corresponding to the IC chip 6. This shielding pattern 12 is
This shields the chip 6 from being irradiated.

Next, referring to FIG. 2, the electronic components mounted on the liquid crystal display panel a as described above are
The case of covering with the buffer material 11 will be explained.

First, as shown in FIG. 2a, the cushioning material 11 is molded. In this case, recesses 11a are formed in portions corresponding to the electronic components. And Figure 2b
As shown in the figure, UV resin 10 is poured into each recess 11a of the buffer material 11 to fill it. After this,
As shown in FIG. 2c, the liquid crystal display panel a, in which electronic components such as an IC chip 6 and a chip capacitor 7 are electrically connected and mounted on the electrode pattern 5 of the glass substrate 1, is turned upside down and the from the side
Apply a cushioning material 11 filled with UV resin 10,
Each electronic component is made to correspond to each recess 11a of the cushioning material 11 and inserted therein. Then, the UV resin 10 flows out from within the recess 11a of the cushioning material 11 and covers all the electronic components such as the IC chip 6 and the chip capacitor 7. Then, the protective cover 13 is placed above the vertically inverted liquid crystal display panel a so as to cover the display section b, and in this state ultraviolet rays are irradiated from above. Then, glass substrate 1
The UV resin 10 is irradiated with ultraviolet rays through the UV resin 10, thereby solidifying the UV resin 10, covering all the electronic components and fixing the cushioning material 11 to the glass substrate 1. In this case, the IC chip 6 is connected to the glass substrate 1.
Since the shielding pattern 12 provided on the shielding pattern 12 prevents ultraviolet rays from being irradiated, the internal electronic circuits will not be destroyed. In addition, protective cover 1
3 is removed after the UV resin 10 is solidified.

However, according to the above-mentioned liquid crystal display panel a, electronic components such as the IC chip 6 and the chip capacitor 7 mounted on the electrode pattern 5 of the glass substrate 1 are covered with UV resin 10 that is solidified by ultraviolet irradiation. Since the UV resin 10 is sealed, the electronic components, the electrode pattern 5, and the glass substrate 1 in that area can be well protected, and the electronic components can be firmly fixed to the glass substrate 1. , it is possible to increase the strength against external impact. In particular, UV resin 1
0 is protected by the buffer material 11, the shock from the outside is absorbed to some extent by the buffer material 11, and this also protects the electronic components and the glass substrate 1.
can be well protected, and even higher impact resistance can be obtained. Moreover, this buffer material 11 also serves as a mold during the formation of the UV resin 10, and is fixed to the glass substrate 1 at the same time as the UV resin 10, so the work is extremely simple.

In addition, although the buffer material 11 was provided on the outside of the UV resin 10 in the above-mentioned embodiment, it is not necessarily necessary to provide the buffer material 11, and it is not always necessary to provide the buffer material 11 on the outside of the UV resin 10.
There is no need to use any resin, and any resin can be used as long as it hardens with light.

Further, this invention is not limited to the above-mentioned liquid crystal display panel a, but can be widely applied to devices in which electronic components are mounted on a transparent substrate such as a glass substrate.

[Effects of the invention] As explained in detail above, according to the electronic component mounting structure related to this invention, an electrode pattern to which an IC chip is connected to a transparent substrate is formed and
A shielding pattern is formed corresponding to the IC chip mounting position, and the IC chip mounted on the transparent substrate is
Cover the chip with a cushioning material having a recess formed therein, fill the recess of the cushioning material with a photocurable resin material, and solidify the photocurable resin material by irradiating it with light through a transparent substrate. Since the IC chip is sealed and the IC chip and cushioning material are fixed to the transparent substrate, the IC chip can be securely fixed with a simple configuration and operation. In particular, since the cushioning material serves as a frame for the uncured photocurable resin material, it not only prevents the uncured photocurable resin material from dripping, making light irradiation work easier, but also makes it easier to irradiate the IC chip on the transparent substrate. Since a corresponding shielding pattern is formed, it is possible to reliably prevent light from entering the IC chip during light irradiation, and the cushioning material can absorb some external shock, resulting in a product with high shock resistance. be able to.

[Brief explanation of the drawing]

1 and 2 show an example in which this invention is applied to a liquid crystal display panel, in which FIG. 1 is an enlarged sectional view, FIGS. 2 a to c are views showing the manufacturing process, and FIG. 5 shows a conventional example, FIG. 3 is a sectional view of a conventional liquid crystal display panel, and FIG. 4A,
B is an enlarged sectional view of the main part thereof, and FIG. 5 is a sectional view showing another conventional example. 1... Glass substrate, 5... Electrode pattern, 6...
...IC chip, 7... Chip capacitor, 10...
...UV resin.

Claims (1)

[Claims for Utility Model Registration] An IC chip, an electrode pattern to which the IC chip is mounted and electrically connected to the IC chip, and a shielding pattern corresponding to the mounting position of the IC chip to be formed. a transparent substrate, a cushioning material provided to cover an IC chip attached to the transparent substrate and having a recess formed therein corresponding to the IC chip; A mounting structure for an electronic component, comprising: a photocurable resin material that is hardened by light irradiated with the transparent substrate to seal the IC chip and fix the IC chip and the buffer material to the transparent substrate.