JP2005165368A - Method for manufacturing liquid crystal device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a liquid crystal device whose area for mounting a liquid crystal driving IC can be made small and which is highly reliable. <P>SOLUTION: The driving IC 1 is bonded facedown onto a substrate 2. The thickness T of the driving IC 1 is made thicker than the thickness (t) of a counter substrate 3 of a liquid crystal panel 50 to make the top surface 61 of the driving IC 1 higher than the top surface 63 of the counter substrate 3. While a tool 4 for correction is arranged overlapping a portion of the counter substrate 3 across a gasp and also overlapping the driving IC 1, pressure is applied to the top surface 61 of the driving IC 1. The driving IC 1 can sufficiently be pressed without making the tool 4 for connection abut against the counter substrate 3, and a connection with high connection reliability can be made. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a method for manufacturing a liquid crystal device, and more particularly to a method for manufacturing a liquid crystal device in which a semiconductor chip (hereinafter referred to as a driving IC) for driving liquid crystal is mounted on a liquid crystal panel by COG (Chip on Glass).

  In recent years, many liquid crystal devices have a COG structure in which a driving IC is mounted on a panel with higher definition and higher density.

  Such a COG structure is described in, for example, FIG. 1 of JP-A-4-319918. The conventional COG structure liquid crystal device will be described below with reference to FIG. The conventional liquid crystal device 300 includes a liquid crystal panel 350 having a substrate 31, a counter substrate 36, and a liquid crystal material 352 sandwiched between these substrates, and a driving IC 32. The driving IC 32 is connected to connection wirings 341 and 342 formed on the substrate 31 by bumps 33 to form a COG structure. The driving IC 32 is protected by the sealing resin 35.

  In this conventional liquid crystal device, the sealing resin 35 is higher than the upper surface 361 of the counter substrate 36 of the liquid crystal panel 350, but the upper surface 321 of the driving IC 32 is not higher than the upper surface 361 of the counter substrate 36.

  However, when the driving IC 32 is bonded, it is necessary to press the upper surface 321 of the driving IC 32 with the connecting tool 304 before the sealing resin 35 is provided. Since the connecting tool 304 is usually larger than the driving IC 32, the connecting tool 304 rides on the counter substrate 36 or contacts the edge of the counter substrate 36. As a result, the driving IC 32 cannot be sufficiently pressurized, and the bonding between the bump 33 and the connection wirings 341 and 342 is not successful, resulting in low reliability.

  Further, in order to prevent the connection tool 304 from running on the counter substrate 36 or to contact the edge of the counter substrate 36, the driving IC 32 is disposed at a position far from the counter substrate 36 of the liquid crystal panel 350. Accordingly, there is a problem in that the area for mounting the driving IC on the substrate 31 is increased correspondingly, and as a result, the liquid crystal device 300 is necessarily increased in size.

  In addition, an electronic device equipped with such a conventional liquid crystal device 300 has a problem that the liquid crystal device mounting portion becomes large, and the device cannot be reduced in size and weight.

  Therefore, a main object of the present invention is to provide a liquid crystal device and a method for manufacturing the same that can reduce the area for mounting a liquid crystal driving IC and that has high reliability.

  Another object of the present invention is to provide an electronic device equipped with a liquid crystal device, which is reduced in size and weight.

  The method for manufacturing a liquid crystal device according to the present invention opposes a first substrate having a first main surface and a second main surface facing each other, and a polarizing plate provided on the first main surface. The third main surface has a first main region and a fourth main surface, the third main surface has a first region and a second region, and the first region is the first substrate of the first substrate. A second substrate disposed facing the two main surfaces, a wiring provided on the third main surface, the second main surface of the first substrate, and the second substrate A step of preparing a liquid crystal panel comprising a liquid crystal substance disposed between the first region, a fifth main surface and a sixth main surface facing each other, and on the sixth main surface A drive element having a bump provided on the second substrate, the sixth main surface of the drive element facing the second region of the third main surface of the second substrate, and the drive In the state where a fixing member is interposed between the sixth main surface of the element for use and the third main surface of the second substrate, the driving tool is connected from the fifth main surface side by a connecting tool. Pressing the element to connect the bump and the wiring, and fixing the driving element to the second substrate by the fixing member, and the driving element includes the bump and the wiring When the driving element is mounted on the third main surface, the height of the fifth main surface from the third main surface is the first substrate side of the polarizing plate. The height of the side surface opposite to the third main surface is larger than the height of the third surface.

  In this manufacturing method, the upper surface (fifth main surface) of the driving element is made higher than the upper surface of the polarizing plate on the first substrate (the side surface opposite to the surface on the first substrate side). Since the driving element is pressed from the upper surface side by the first connecting tool, even if the space between the driving element and the first substrate is narrowed, the frame area is narrow on the second substrate of the compact liquid crystal panel. Even when the driving element is COG-mounted, the connection tool (bonding tool) that presses the driving element does not hit the polarizing plate on the first substrate. Therefore, face-down bonding can be performed using a large connection tool. As a result, the connecting tool can be easily maintained in parallel, and the heat capacity of the connecting tool is increased, so that face down bonding can be performed at a more uniform temperature by applying a more uniform load. Therefore, it is possible to manufacture a liquid crystal device that is small in size and highly reliable in which the bonding between the driving element and the panel wiring is sufficiently ensured.

  It is preferable that the drive element is pressed by the connection tool from the fifth main surface side so that the connection tool overlaps a part of the polarizing plate and the drive element.

  When the driving element connects the bump and the wiring and mounts the driving element on the third main surface, the height of the fifth main surface from the third main surface Preferably, the driving element is 0.08 mm or more larger than the height from the third main surface on the side surface opposite to the surface on the first substrate side of the polarizing plate.

  When the driving element connects the bump and the wiring and mounts the driving element on the third main surface, the height of the fifth main surface from the third main surface is high. It is preferable that the driving element has a height of 1.17 times or more the height from the third main surface on the side surface opposite to the surface on the first substrate side of the polarizing plate.

  When the driving element connects the bump and the wiring and mounts the driving element on the third main surface, the height of the fifth main surface from the third main surface is high. The driving element is preferably 4.7 times or less the height from the third main surface of the side surface opposite to the surface of the polarizing plate on the first substrate side.

  It is preferable that the distance between the edge of the first substrate and the driving element is 2 mm or less, and the driving element is fixed to the second substrate.

  The fixing member is preferably an adhesive. In this way, when an adhesive is used for the fixing member and the connection tool is pressed and connected, the bumps of the driving element are directly connected to the panel wiring, and only the adhesive exists between the bumps. The occurrence of short circuit between them is unlikely to occur, and it is possible to cope with a high-definition bump pitch. It is preferable that the method further includes a step of attaching a conductive paste to the bump, connecting the bump and the wiring via the conductive paste, and fixing the driving element to the second substrate with the adhesive. As described above, when the bump and the wiring are connected via the conductive paste, the variation in the thickness of the driving element and the flatness of the connecting tool can be reduced, and the yield of the COG process is improved. High reliability can be ensured. Note that a silver paste is preferably used as the conductive paste.

  The fixing member is preferably an anisotropic conductive film having an adhesive and conductive particles. In this way, the conductive particles are involved in the connection, so that variations in the thickness of the driving IC and the flatness of the connection tool can be alleviated, improving the yield of the COG process and high reliability. Securing of sex etc.

  It is preferable that the adhesive is a thermosetting adhesive and is heated while pressing the driving element with the connection tool, and the driving element is fixed to the second substrate with the adhesive. In the present invention, as described above, since the connecting tool that presses the driving element does not hit the first substrate, face down bonding can be performed using a large connecting tool. The heat capacity of the tool can be increased, and face-down bonding can be performed at a more uniform temperature. Thus, the present invention works particularly effectively when the drive element is heated by the connection tool.

  Preferably, the driving element is heated while being pressed by the connection tool, the driving element is bonded to the second substrate with a thermosetting adhesive, and then the connection tool is heated while continuing to be pressed by the connection tool. When the temperature is lowered, the viscosity (elastic modulus) increases and the drive element is securely fixed. The adhesive force by the adhesive is improved by the so-called hot cold effect that can be bonded.

  The adhesive is a thermosetting adhesive, and the adhesive is heated by irradiating the adhesive with light while pressing the driving element with the connection tool, and the adhesive is used for the driving. It is preferable that the element is fixed to the second substrate. Thus, the adhesive can be heated by light. In this case, it is preferable to use visible light or infrared light. In addition, it is preferable to use a substrate transparent to this light as the second substrate, and in that case, it is preferable to irradiate light from the fourth main surface side of the second substrate. In this case also, preferably, the thermosetting adhesive is heated with light while pressing the driving element with the connection tool, and the driving element is bonded to the second substrate with the adhesive, and then connected. If the heating by the light is stopped while cooling by the tool is continued and the temperature is cooled to a predetermined temperature, and then the pressing by the connecting tool is stopped, the adhesive force by the adhesive is improved by the hot cold effect.

  The adhesive is a photo-curable adhesive, and the adhesive is cured by irradiating the adhesive with light while pressing the driving element with the connection tool, and the adhesive is used for the driving. It is preferable that the element is fixed to the second substrate. If it does in this way, the temperature at the time of hardening connection of an adhesive agent can be held down, and the influence of the heat to a panel can be decreased. In this case, it is preferable to use visible light or ultraviolet light. In addition, it is preferable to use a substrate transparent to this light as the second substrate, and in that case, it is preferable to irradiate light from the fourth main surface side of the second substrate.

  Note that transparent glass is preferably used as the first substrate and the second substrate.

  Further, a transparent resin may be used as the first substrate and the second substrate.

  The method for manufacturing a liquid crystal device according to the present invention opposes a first substrate having a first main surface and a second main surface facing each other, and a polarizing plate provided on the first main surface. A second substrate having a third main surface and a fourth main surface and arranged so that the third main surface faces the second main surface; and a fifth main surface facing each other A driving element having a surface and a sixth main surface, wherein after the polarizing plate is provided on the first main surface, the sixth element of the driving element is provided. The main surface is made to face the third main surface of the first substrate, the driving element is pressed from the fifth main surface side by a connection tool, and the sixth main surface and the third main surface are pressed. A step of fixing the main surfaces to each other, wherein the driving element is formed when the sixth main surface and the third main surface are fixed to each other. The height of the fifth main surface from the third main surface is greater than the height from the third main surface of the side surface opposite to the surface of the polarizing plate on the first substrate side. It is characterized by being.

  In this manufacturing method, the upper surface (fifth main surface) of the driving element is made higher than the upper surface of the polarizing plate on the first substrate (the side surface opposite to the surface on the first substrate side). Since the driving element is pressed from the upper surface side by the first connecting tool, even if the space between the driving element and the first substrate is narrowed, the frame area is narrow on the second substrate of the compact liquid crystal panel. Even when the driving element is COG-mounted, the connection tool (bonding tool) that presses the driving element does not hit the polarizing plate on the first substrate. Therefore, face-down bonding can be performed using a large connection tool. As a result, the connecting tool can be easily maintained in parallel, and the heat capacity of the connecting tool is increased, so that face down bonding can be performed at a more uniform temperature by applying a more uniform load. Therefore, it is possible to manufacture a liquid crystal device that is small in size and highly reliable in which the bonding between the driving element and the panel wiring is sufficiently ensured.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

  FIG. 1 is a schematic perspective view for explaining liquid crystal devices according to first to eighth embodiments of the present invention.

  The liquid crystal device 100 of each of the above embodiments includes a liquid crystal panel 50 having a substrate 2, a counter substrate 3, and a liquid crystal material (not shown) sandwiched between these substrates, a driving IC 1, and a flexible printed circuit board. 45. On the substrate 2, connection wiring 41 to the output terminal of the driving IC 1 and connection wiring 42 to the input terminal of the driving IC 1 are provided, and the driving IC 1 is connected to these connection wirings 41 and 42. It is provided on the substrate 2. Further, the flexible printed circuit board 45 is connected to the connection wiring 42.

(First embodiment)
2 and 3 are cross-sectional views for explaining the liquid crystal device according to the first embodiment of the present invention.

  Referring to FIG. 2, the liquid crystal device 100 includes a liquid crystal panel 50 and a driving IC 1. A seal 51 is provided around the substrate 2 and the counter substrate 3, and a liquid crystal substance 52 is provided between the substrate 2 and the counter substrate 3 by being sealed with the seal 51. On the upper surface 62 of the substrate 2, connection wiring 41 to the output terminal of the driving IC 1 and connection wiring 42 to the input terminal of the driving IC 1 are provided. The driving IC 1 is connected to the connection wires 41 and 42 via the bumps 21 and is face-down bonded on the substrate 2. The driving IC 1 is bonded to the substrate 2 with an adhesive 7. The thickness T of the driving IC 1 is thicker than the thickness t of the counter substrate 3 of the liquid crystal panel 50, and the upper surface 61 of the driving IC 1 is higher than the upper surface 63 of the counter substrate 3 of the liquid crystal panel 50.

  Next, a method for manufacturing the liquid crystal device 100 will be described with reference to FIG.

  First, the liquid crystal panel 50 in which the liquid crystal material 52 is sealed between the substrate 2 and the counter substrate 3 by the seal 51 is prepared.

Next, the adhesive 7 is disposed on the substrate 2 of the liquid crystal panel 50, and the connection wirings 42 and 41 corresponding to the input / output bumps 21 of the driving IC 1 and the input / output bumps 21 of the driving IC 1 are positioned. After the alignment, the upper surface of the driving IC 1 is heated and pressed by the connection tool 4 to electrically and mechanically connect the input / output bumps 21 and the connection wirings 42 and 41 of the driving IC 1 and to bond them. The driving IC 1 is bonded to the upper surface 62 of the substrate 2 with the agent 7. The adhesive 7 is a thermosetting epoxy adhesive, and the connection conditions are a temperature of 220 ° C., a pressure of 5 gf / mm ² , and a time of 20 seconds. Thereafter, heating with the connection tool 4 was stopped while continuing to pressurize with the connection tool 4 and cooled to 150 ° C., and then pressurization with the connection tool 4 was stopped. If it does in this way, the adhesive force by the adhesive agent 7 will improve by the hot cold effect. Note that the cradle 5 is made of quartz glass so that the adhesive 7 can be irradiated with light through the substrate 2.

  In order to reduce the mounting area of the driving IC 1, it is necessary to reduce the distance between the driving IC 1 and the counter substrate 3 of the liquid crystal panel 50. This distance is conventionally 1 mm or more, usually 2 mm to 3 mm, but in recent years it has been required to be about 0.5 mm. Therefore, the smaller the distance is, the smaller the distance between the connection tool 4 used to connect the driving IC 1 and the counter substrate 3 is. As shown in FIG. 3, the external shape of the connection tool 4 is larger than that of the driving IC 1 to be connected in order to ensure the connection. In such a case, according to the conventional method, the connection tool 4 may interfere with the counter substrate 3, and a sufficient connection cannot be achieved.

  In this embodiment, the thickness T of the driving IC 1 is 0.56 mm, and the thickness t of the counter substrate 3 of the liquid crystal panel 50 is 0.4 mm (strictly speaking, the thickness t includes the cell thickness of the panel from 0.001 mm to About 0.02 mm is included). The height of the upper surface 61 of the driving IC 1 from the upper surface 62 of the substrate 2 is 0.56 mm, and the height of the upper surface 63 of the counter substrate 3 from the upper surface 62 of the substrate 2 is 0.4 mm. The material of the substrate 2 and the material of the counter substrate 3 are soda glass. Further, the distance between the driving IC 1 and the counter substrate 3 was 0.5 mm, the width W of the driving IC 1 was 2.02 mm, and the width w of the connection tool 4 was 4.0 mm.

  Here, the thickness T of the driving IC 1 is 1.4 times the thickness t of the counter substrate 3, and the gap between the connection tool 4 and the counter substrate 3 is 0.16 mm. Considering the variation from the result, it is considered that the same effect can be obtained if the minimum is about 0.08 mm. Therefore, the thickness T of the driving IC 1 may be 1.17 times or more, that is, about 1.2 times or more the thickness t of the counter substrate 3.

  In the present embodiment, since the driving IC 1 is thicker than the counter substrate 3 of the liquid crystal panel 50, the connection tool 4 is secured to the counter substrate 3 even when connected. Therefore, face-down bonding can be performed using a large connecting tool 4, and as a result, the connecting tool 4 can be easily kept parallel, and the heat capacity of the connecting tool 4 is increased, so that a more uniform load can be applied. The face-down bonding can be performed at a more uniform temperature. Therefore, the driving IC 1 can be sufficiently heated and pressed without the connection tool 4 hitting the counter substrate 3, and a connection with high connection reliability is possible. Further, the influence of heat from the connection tool 4 to the liquid crystal panel 50 could be suppressed to a minimum without damaging the counter substrate 3.

  In addition, when the adhesive 7 is used and the bump 21 of the driving IC 1 is directly connected to the connection wirings 41 and 42 as described above, only the adhesive 7 exists between the bumps 21 and a short circuit between the bumps 21 occurs. Is less likely to occur and can be used for high-definition bump pitches.

(Second Embodiment)
4 and 5 are cross-sectional views for explaining a liquid crystal device according to a second embodiment of the present invention.

  Referring to FIG. 4, the liquid crystal device 100 is different from the first embodiment in that the polarizing plate 11 is provided on the upper surface 63 of the counter substrate 3 and the polarizing plate 12 is provided on the lower surface of the substrate 2. It is different but the other points are the same. In addition, a reflection plate may be provided on the polarizing plate 12 on the lower surface of the substrate 2 so as to be a reflection type.

  In the present embodiment, the thickness T of the driving IC 1 is larger than the thickness t ′, which is the sum of the thickness of the counter substrate 3 of the liquid crystal panel 50 and the thickness of the polarizing plate 11, and the upper surface 61 of the driving IC 1 is the liquid crystal. It is higher than the upper surface 64 of the polarizing plate 11 provided on the counter substrate 3 of the panel 50.

  Next, a method for manufacturing the liquid crystal device 100 will be described with reference to FIG.

  In the present embodiment, the liquid crystal device 100 is manufactured in the same manner as in the first embodiment, but the thickness T of the driving IC 1 is 0.56 mm, and the thickness of the counter substrate 3 of the liquid crystal panel 50 ( 0.3 mm) and the thickness (0.18 mm) of the polarizing plate 11 is 0.48 mm (strictly, the thickness t ′ includes a panel cell thickness of about 0.001 mm to 0.02 mm. .) The height of the upper surface 61 of the driving IC 1 from the upper surface 62 of the substrate 2 is 0.56 mm, and the height of the upper surface 64 of the polarizing plate 11 on the counter substrate 3 from the upper surface 62 of the substrate 2 is 0.48 mm. It is. The distance between the driving IC 1 and the counter substrate 3 was 0.5 mm, the width W of the driving IC 1 was 2.02 mm, and the width w of the connection tool 4 was 4.0 mm.

  Here, the thickness T of the driving IC 1 is 1.17 times t ′, which is the sum of the thickness of the counter substrate 3 and the thickness of the polarizing plate 11, and a gap of 0.08 mm is secured between the tool 4 and the counter substrate 3. It was.

  In this embodiment, the driving IC 1 is thicker than the thickness t ′, which is the sum of the thickness of the counter substrate 3 of the liquid crystal panel 50 and the thickness of the polarizing plate 11, so that the connection tool 4 is connected to the polarizing plate 11. Even at times, distance is secured. Therefore, face-down bonding can be performed using a large connecting tool 4, and as a result, the connecting tool 4 can be easily kept parallel, and the heat capacity of the connecting tool 4 is increased, so that a more uniform load can be applied. The face-down bonding can be performed at a more uniform temperature. Therefore, the driving IC 1 can be sufficiently heated and pressed without the connection tool 4 hitting the polarizing plate 11, and connection with high connection reliability is possible. Further, the influence of heat from the connection tool 4 to the liquid crystal panel 50 could be suppressed to a minimum without damaging the counter substrate 3 and the polarizing plate 11.

(Third embodiment)
FIG. 6 is a cross-sectional view for explaining a liquid crystal device according to a third embodiment of the present invention.

  The liquid crystal device 100 of the present embodiment has the same structure as the liquid crystal device 100 of the first embodiment described with reference to FIG. As the adhesive 7, a thermosetting epoxy adhesive was used.

  Next, a manufacturing method of the liquid crystal device 100 will be described with reference to FIG.

  First, a liquid crystal panel 50 is prepared in which a liquid crystal substance 52 is provided between a substrate 2 and a counter substrate 3 by a seal 51.

Next, the adhesive 7 is disposed on the substrate 2 of the liquid crystal panel 50, and the connection wirings 42 and 41 corresponding to the input / output bumps 21 of the driving IC 1 and the input / output bumps 21 of the driving IC 1 are positioned. After the alignment, the near-infrared light and / or visible light 13 generated by the xenon lamp or the like from the lower side of the quartz glass cradle 5 is driven while the upper surface of the driving IC 1 is pressed by the connection tool 4. Irradiation is performed in the direction of the bonding surface of the IC 1, the driving IC 1, the connection wirings 41 and 42, the bumps 21 and the adhesive 7 are heated, and the input / output bumps 21 and the connection wirings 42 and 41 of the driving IC 1 are electrically connected, In addition to mechanical connection, the driving IC 1 is bonded to the upper surface 62 of the substrate 2 by the adhesive 7. The connection conditions are a temperature of 220 ° C., a pressure of 5 gf / mm ² , and a time of 20 seconds. The light irradiation amount and the applied pressure are set so as to satisfy these conditions. Thereafter, heating with the light 13 was stopped while continuing to pressurize with the connection tool 4 and cooled to 150 ° C., and then pressurization with the connection tool 4 was stopped. If it does in this way, the adhesive force by the adhesive agent 7 will improve by the hot cold effect.

  The connection tool 4 can be heated with a heater or the like, but in this case, the temperature of the connection tool 4 can be lowered by 30 ° C. to 200 ° C. as compared with the case of the first embodiment.

  In this embodiment, the thickness T of the driving IC 1 is 0.56 mm, and the thickness t of the counter substrate 3 of the liquid crystal panel 50 is 0.4 mm (strictly speaking, the thickness t includes the cell thickness of the panel from 0.001 mm to About 0.02 mm is included). The height of the upper surface 61 of the driving IC 1 from the upper surface 62 of the substrate 2 is 0.56 mm, and the height of the upper surface 63 of the counter substrate 3 from the upper surface 62 of the substrate 2 is 0.4 mm. The material of the substrate 2 and the material of the counter substrate 3 are soda glass. Further, the distance between the driving IC 1 and the counter substrate 3 was 0.5 mm, the width W of the driving IC 1 was 2.02 mm, and the width w of the connection tool 4 was 4.0 mm.

  Here, the thickness T of the driving IC 1 is 1.4 times the thickness t of the counter substrate 3, and the gap between the tool 4 and the counter substrate 3 is secured to 0.16 mm. Even in the case of heating with a xenon lamp from the lower side of the cradle 5 as in this embodiment, it is considered that the same effect can be obtained if the variation is taken into consideration from the result of the trial manufacturing if the minimum is about 0.08 mm. Therefore, the thickness T of the driving IC 1 may be 1.17 times or more, that is, about 1.2 times or more the thickness t of the counter substrate 3.

In the present embodiment, since the driving IC 1 is thicker than the counter substrate 3 of the liquid crystal panel 50, the connection tool 4 is secured to the counter substrate 3 even when connected. Therefore, face-down bonding can be performed using the large connection tool 4, and as a result, the connection tool 4 can be easily maintained in parallel, and more face-down bonding can be performed with a more uniform load.
Therefore, the driving IC 1 can be sufficiently pressurized without the connection tool 4 hitting the counter substrate 3 and damaging the counter substrate 3, and a connection with high connection reliability is possible. Furthermore, since light irradiation is used, the temperature of the connection tool 4 can be lowered, and the influence of heat on the liquid crystal panel 50 can be greatly reduced.

(Fourth embodiment)
7 and 8 are cross-sectional views for explaining a liquid crystal device according to a fourth embodiment of the present invention.

  Referring to FIG. 7, this liquid crystal device 100 is different from the first embodiment in that the bump 21 of the driving IC 1 is connected to the connection wirings 41 and 42 through the silver paste 8, respectively. The point is similar.

  In the present embodiment, the thickness T of the driving IC 1 is thicker than the thickness t of the counter substrate 3 of the liquid crystal panel 50, and the upper surface 61 of the driving IC 1 is larger than the upper surface 63 of the counter substrate 3 of the liquid crystal panel 50. It is high. Here, the thickness T of the driving IC 1 in the present embodiment strictly includes the thickness of the driving IC 1, the thickness of the bump 21, the thickness of the silver paste 8, and the thickness of the connection wirings 41 and 42.

  Next, a method for manufacturing the liquid crystal device 100 will be described with reference to FIG.

  First, the liquid crystal panel 50 in which the liquid crystal material 52 is sealed between the substrate 2 and the counter substrate 3 by the seal 51 is prepared.

  Next, the silver paste 8 is adhered to the input / output bumps 21 of the driving IC 1.

Next, the adhesive 7 is disposed on the substrate 2 of the liquid crystal panel 50, and the connection wirings 42 and 41 corresponding to the input / output bumps 21 of the driving IC 1 and the input / output bumps 21 of the driving IC 1 are positioned. After the alignment, the upper surface 61 of the driving IC 1 is heated and pressed by the connection tool 4, and the input / output bumps 21 and the connection wirings 42 and 41 of the driving IC 1 are electrically and mechanically connected via the silver paste 8, respectively. And the driving IC 1 is bonded to the upper surface 62 of the substrate 2 by the adhesive 7. The adhesive 7 is a thermosetting epoxy adhesive, and the connection conditions are a temperature of 220 ° C., a pressure of 5 gf / mm ² , and a time of 20 seconds. Thereafter, heating with the connection tool 4 was stopped while continuing to pressurize with the connection tool 4 and cooled to 150 ° C., and then pressurization with the connection tool 4 was stopped.

  In this embodiment, the thickness T of the driving IC 1 is 0.56 mm, and the thickness t of the counter substrate 3 of the liquid crystal panel 50 is 0.4 mm (strictly speaking, the thickness t includes the cell thickness of the panel from 0.001 mm to About 0.02 mm is included). The height of the upper surface 61 of the driving IC 1 from the upper surface 62 of the substrate 2 is 0.56 mm, and the height of the upper surface 63 of the counter substrate 3 from the upper surface 62 of the substrate 2 is 0.4 mm. Further, the distance between the driving IC 1 and the counter substrate 3 was 0.5 mm, the width W of the driving IC 1 was 2.02 mm, and the width w of the connection tool 4 was 4.0 mm.

  Here, the thickness T of the driving IC 1 is 1.4 times the thickness t of the counter substrate 3, and the gap between the connection tool 4 and the counter substrate 3 is 0.16 mm. As this gap, Even when the input / output bumps 21 of the driving IC 1 are connected to the connection wirings 41 and 42 via the silver paste 7 as in the present embodiment, a minimum of about 0.08 mm is considered in consideration of variations from the prototype results. If there is, it is thought that the same effect can be obtained. Therefore, the thickness T of the driving IC 1 may be 1.17 times or more, that is, about 1.2 times or more the thickness t of the counter substrate 3.

  In the present embodiment, since the input / output bumps 21 of the driving IC 1 are connected to the connection wirings 41 and 42 via the silver paste 7, the thickness of the driving IC 1, the thickness of the input / output bumps 21, and the connection are connected. The variation of the flatness of the tool 4 for use can be reduced.

(Fifth embodiment)
9 and 10 are cross-sectional views for explaining a liquid crystal device according to a fifth embodiment of the present invention.

  Referring to FIG. 9, the liquid crystal device 100 is different from the first embodiment in that the driving IC 1 is bonded to the upper surface 62 of the substrate 2 by the anisotropic conductive film 10, but the other points are the same. It is.

  The anisotropic conductive film 10 is obtained by dispersing conductive particles 9 in which a resin ball is gold-plated in an epoxy adhesive 7, and bumps 21 of the driving IC 1 are connected to the connection wirings 41 and 42 through the conductive particles 9, respectively. The driving IC 1 is bonded to the substrate 2 with an epoxy adhesive 7.

  Also in the present embodiment, the thickness T of the driving IC 1 is thicker than the thickness t of the counter substrate 3 of the liquid crystal panel 50, and the upper surface 61 of the driving IC 1 is more than the upper surface 63 of the counter substrate 3 of the liquid crystal panel 50. Is also high. Here, the thickness T of the driving IC 1 in the present embodiment strictly includes the thickness of the driving IC 1, the thickness of the bump 21, the thickness of the conductive particles 9, and the thickness of the connection wirings 41 and 42.

  Next, a method for manufacturing the liquid crystal device 100 will be described with reference to FIG.

  First, the liquid crystal panel 50 in which the liquid crystal material 52 is sealed between the substrate 2 and the counter substrate 3 by the seal 51 is prepared.

Next, the anisotropic conductive film 10 is disposed on the substrate 2 of the liquid crystal panel 50, and the connection wirings 42 and 41 respectively corresponding to the input / output bumps 21 of the driving IC 1 and the input / output bumps 21 of the driving IC 1 are provided. Then, the upper surface 61 of the driving IC 1 is heated and pressed by the connection tool 4 to electrically connect the input / output bumps 21 and the connection wirings 42 and 41 of the driving IC 1 through the conductive particles 9. The driving IC 1 is bonded to the upper surface 62 of the substrate 2 by the adhesive 7 of the anisotropic conductive film 10. The connection conditions are a temperature of 220 ° C., a pressure of 5 gf / mm ² , and a time of 20 seconds. Thereafter, heating with the connection tool 4 is stopped while continuing to pressurize with the connection tool 4, and the connection tool is cooled to 150 ° C. The pressurization by 4 was stopped.

  In this embodiment, the thickness T of the driving IC 1 is 0.56 mm, and the thickness t of the counter substrate 3 of the liquid crystal panel 50 is 0.4 mm (strictly speaking, the thickness t includes the cell thickness of the panel from 0.001 mm to About 0.02 mm is included). The height of the upper surface 61 of the driving IC 1 from the upper surface 62 of the substrate 2 is 0.56 mm, and the height of the upper surface 63 of the counter substrate 3 from the upper surface 62 of the substrate 2 is 0.4 mm. Further, the distance between the driving IC 1 and the counter substrate 3 was 0.5 mm, the width W of the driving IC 1 was 2.02 mm, and the width w of the connection tool 4 was 4.0 mm.

  Here, the thickness T of the driving IC 1 is 1.4 times the thickness t of the counter substrate 3, and the gap between the connection tool 4 and the counter substrate 3 is 0.16 mm. As this gap, Even when the input / output bumps 21 of the driving IC 1 are connected to the connection wirings 41 and 42 via the conductive particles 9 of the anisotropic conductive film 10 as in the present embodiment, variation is taken into account based on the prototype results. Then, if the minimum is about 0.08 mm, it is considered that the same effect can be obtained. Therefore, the thickness T of the driving IC 1 may be 1.17 times or more, that is, about 1.2 times or more the thickness t of the counter substrate 3.

  In this embodiment, since the input / output bumps 21 of the driving IC 1 are connected to the connection wirings 41 and 42 via the anisotropic conductive film 10, the conductive particles 9 of the anisotropic conductive film 10 are connected. Therefore, variations such as the thickness of the driving IC 1, the thickness of the input / output bumps 21, and the flatness of the connection tool 4 can be reduced.

(Sixth embodiment)
FIG. 11 is a cross-sectional view for explaining a liquid crystal device according to a sixth embodiment of the present invention.

  The liquid crystal device 100 of the present embodiment has the same structure as the liquid crystal device 100 of the fourth embodiment described with reference to FIG. As the adhesive 7, a thermosetting epoxy adhesive was used.

  Next, a method for manufacturing the liquid crystal device 100 will be described.

  First, a liquid crystal panel 50 is prepared in which a liquid crystal substance 52 is provided between a substrate 2 and a counter substrate 3 by a seal 51.

  Next, the silver paste 8 is adhered to the input / output bumps 21 of the driving IC 1.

Next, the adhesive 7 is disposed on the substrate 2 of the liquid crystal panel 50, and the connection wirings 42 and 41 corresponding to the input / output bumps 21 of the driving IC 1 and the input / output bumps 21 of the driving IC 1 are positioned. After the alignment, the near-infrared light and / or visible light 13 generated by a xenon lamp or the like is driven from the lower side of the quartz glass cradle 5 while pressing the upper surface 61 of the driving IC 1 with the connecting tool 4. Irradiation is performed in the direction of the bonding surface of the IC 1 for driving, the driving IC 1, the connection wirings 41 and 42, the bumps 21, the silver paste 8 and the adhesive 7 are heated, and the input / output bumps 21 and the connection wirings 42 and 41 Are electrically and mechanically connected via the silver paste 8, and the driving IC 1 is bonded to the upper surface 62 of the substrate 2 by the adhesive 7. The connection conditions are a temperature of 220 ° C., a pressure of 5 gf / mm ² , and a time of 20 seconds. The light irradiation amount and the applied pressure are set so as to satisfy these conditions. Thereafter, heating with the light 13 was stopped while continuing to pressurize with the connection tool 4 and cooled to 150 ° C., and then pressurization with the connection tool 4 was stopped.

  The connection tool 4 can be heated with a heater or the like, but in this case, the temperature of the connection tool 4 can be lowered by 30 ° C. to 200 ° C. compared to the case of the fourth embodiment.

  Also in this embodiment, the thickness T of the driving IC 1, the thickness t of the counter substrate 3 of the liquid crystal panel 50, the height of the upper surface 61 of the driving IC 1 from the upper surface 62 of the substrate 2, and the substrate of the upper surface 63 of the counter substrate 3. 2 from the upper surface 62, the distance between the driving IC 1 and the counter substrate 3, the width W of the driving IC 1 and the width w of the connection tool 4 are the same as those in the fourth embodiment. The gap of the counter substrate 3 may be about 0.08 mm at a minimum, and the thickness T of the driving IC 1 may be 1.17 times or more, that is, about 1.2 times or more of the thickness t of the counter substrate 3. The same.

(Seventh embodiment)
FIG. 12 is a cross-sectional view for explaining a liquid crystal device according to a seventh embodiment of the present invention.

  The liquid crystal device 100 of the present embodiment has the same structure as the liquid crystal device 100 of the fifth embodiment described with reference to FIG.

  Next, a method for manufacturing the liquid crystal device 100 will be described.

  First, a liquid crystal panel 50 is prepared in which a liquid crystal substance 52 is provided between a substrate 2 and a counter substrate 3 by a seal 51.

Next, the anisotropic conductive film 10 is disposed on the substrate 2 of the liquid crystal panel 50, and the connection wirings 42 and 41 respectively corresponding to the input / output bumps 21 of the driving IC 1 and the input / output bumps 21 of the driving IC 1 are provided. And the near-infrared light and / or visible light generated by a xenon lamp or the like from the lower side of the quartz glass cradle 5 while pressing the upper surface 61 of the driving IC 1 with the connecting tool 4. 13 is irradiated in the direction of the bonding surface of the driving IC 1, the driving IC 1, the connection wirings 41 and 42, the bumps 21 and the anisotropic conductive film 10 are heated, and the input / output bumps 21 and the connection wirings 42 of the driving IC 1 are connected. 41 are electrically and mechanically connected to each other through the conductive particles 9 of the anisotropic conductive film 10, and the driving IC 1 is bonded to the upper surface 62 of the substrate 2 by the adhesive 7 of the anisotropic conductive film 10. . The connection conditions are a temperature of 220 ° C., a pressure of 5 gf / mm ² , and a time of 20 seconds. The light irradiation amount and the applied pressure are set so as to satisfy these conditions. Thereafter, heating with the light 13 was stopped while continuing to pressurize with the connection tool 4 and cooled to 150 ° C., and then pressurization with the connection tool 4 was stopped.

  Note that the connection tool 4 can be heated with a heater or the like, but in this case, the temperature of the connection tool 4 can be lowered by 30 ° C. to 200 ° C. compared to the case of the fifth embodiment.

  Also in this embodiment, the thickness T of the driving IC 1, the thickness t of the counter substrate 3 of the liquid crystal panel 50, the height of the upper surface 61 of the driving IC 1 from the upper surface 62 of the substrate 2, and the substrate of the upper surface 63 of the counter substrate 3. 2 from the upper surface 62, the distance between the driving IC 1 and the counter substrate 3, the width W of the driving IC 1 and the width w of the connection tool 4 are the same as those in the fifth embodiment. The gap of the counter substrate 3 may be about 0.08 mm at a minimum, and the thickness T of the driving IC 1 may be 1.17 times or more, that is, about 1.2 times or more of the thickness t of the counter substrate 3. The same.

(Eighth embodiment)
A liquid crystal device according to an eighth embodiment of the present invention will be described with reference to FIGS. 2 and 3 again.

  In the present embodiment, a transparent resin based on polyethersulfone (PES) is used as the substrate 2 and the counter substrate 3, and an epoxy-based and styrene-butadiene-styrene (SBS) -based adhesive is used as the adhesive 7. The blend type adhesive in which the agent is mixed at a ratio of about 8: 2 is different from the first embodiment, but the other points are the same.

In the present embodiment, the connection conditions are a temperature of 130 ° C., a pressure of 4 gf / mm ² , and a time of 20 seconds. Thereafter, heating with the connection tool 4 is stopped while pressing with the connection tool 4 is continued to 100 ° C. After cooling, the pressurization by the connecting tool 4 was stopped.

  In this embodiment, the thickness T of the driving IC 1 is 0.56 mm, and the thickness t of the counter substrate 3 of the liquid crystal panel 50 is 0.12 mm (strictly speaking, the thickness t includes the cell thickness of the panel from 0.001 mm to About 0.02 mm is included). The height of the upper surface 61 of the driving IC 1 from the upper surface 62 of the substrate 2 is 0.56 mm, and the height of the upper surface 63 of the counter substrate 3 from the upper surface 62 of the substrate 2 is 0.12 mm. Further, the distance between the driving IC 1 and the counter substrate 3 was 0.5 mm, the width W of the driving IC 1 was 2.02 mm, and the width w of the connection tool 4 was 4.0 mm.

  Here, the thickness T of the driving IC 1 is 4.7 times the thickness t of the counter substrate 3, and the gap between the connection tool 4 and the counter substrate 3 is secured to 0.44 mm.

  In the present embodiment, since the thickness of the driving IC 1 is sufficiently thicker than the thickness of the counter substrate 3 of the liquid crystal panel 50, the connection tool 4 is secured to the counter substrate 3 at a distance even when connected. The driving IC 1 can be sufficiently heated and pressed without the tool 4 hitting the counter substrate 3, and connection with high connection reliability was possible. Further, the influence of heat from the connection tool 4 to the liquid crystal panel 50 could be suppressed to a minimum without damaging the counter substrate 3.

  In addition, the liquid crystal device 100 of each said embodiment is an illustration of a preferable aspect, and this invention is not limited to the liquid crystal device 100 of each said embodiment, or its manufacturing method.

  For example, the adhesive 7 is not limited to the one used in each of the above embodiments, and styrene butadiene styrene (SBS type), epoxy type, acrylic type, polyester type, urethane type or the like alone or some of them. Or a mixture of these. The same applies to the adhesive 7 of the anisotropic conductive film 10.

  In the third, sixth, and seventh embodiments, a thermosetting adhesive is used as the adhesive 7, and near infrared light and / or visible by a xenon lamp from the lower side of the cradle 5. Although heating was performed by irradiating light, a photo-curable adhesive can also be used as the adhesive 7. In this case, ultraviolet light is irradiated from the lower side of the cradle 5 with a mercury lamp and bonded. The agent is cured. In this way, since the temperature rise due to the irradiation light is small, it can be cured at a low temperature from room temperature to about 80 ° C. or less. In addition, as a photocurable adhesive agent, Preferably, an acryl-type photocurable resin can be used.

  Moreover, in order to protect exposed parts, such as the wiring part of a panel, from a moisture proof, dust proof, a contact, etc., you may coat | cover with a molding agent or a coating agent.

  Moreover, as the conductive particles 9 used for the anisotropic conductive film 10, solder particles, Ni, Au, Ag, Cu, Pb, Sn or the like alone or a mixture thereof, an alloy, or composite metal particles by plating, etc. Further, particles obtained by plating Ni, Co, Pd, Au, Ag, Cu, Fe, Sn, Pb or the like alone or some of them on plastic particles (polystyrene, polycarbonate, acrylic, etc.), carbon particles, or the like may be used.

  The materials of the substrates 2 and 3 of the liquid crystal panel are not limited to those used in the above embodiments, but are polycarbonate (PC), polyethylene terephthalate (PET), polyester (PS), polyether ether. A resin such as ketone (PEEK), polyarylate, etc. alone or in combination of some of them may be used.

(Ninth embodiment)
FIG. 13 is a perspective view for explaining an electronic apparatus according to a ninth embodiment of the present invention.

  In the present embodiment, the liquid crystal device 100 of the present invention is mounted on the electronic device 22 as a display device. In this embodiment, the electronic device 22 is a mobile phone, and its function is required to be small, light, and thin, and the display screen must be enlarged to make it easier to see a lot of information. is there. Since the liquid crystal device 100 according to the present invention has a small and compact area for mounting the driving IC 1, the screen can be enlarged without increasing the size of the liquid crystal device 100. Since the part to be mounted can be reduced, other electronic components can be mounted efficiently, and the degree of freedom in product design is increased, resulting in a small product with a large display screen and high product value.

  According to the present invention, even when the driving element is COG-mounted on one substrate of a compact liquid crystal panel with a small frame area in which the distance between the driving element and the first substrate is narrowed, The connecting tool that presses the button does not hit the other counter substrate of the liquid crystal panel. Therefore, face-down bonding can be performed using a large connection tool. As a result, it is easy to keep the connecting tool parallel, and face-down bonding can be performed at a more uniform temperature by applying a more uniform load. Therefore, there is provided a highly reliable liquid crystal device that is small in size and sufficiently secures the bonding between the driving element and the panel wiring.

  When the liquid crystal device is mounted on an electronic device, a small, light, thin, and highly reliable electronic device can be obtained.

It is a schematic perspective view for demonstrating the liquid crystal device of the 1st thru | or 8th embodiment of this invention. It is sectional drawing for demonstrating the liquid crystal device of the 1st and 8th embodiment of this invention. It is sectional drawing for demonstrating the liquid crystal device of the 1st and 8th embodiment of this invention. It is sectional drawing for demonstrating the liquid crystal device of the 2nd Embodiment of this invention. It is sectional drawing for demonstrating the liquid crystal device of the 2nd Embodiment of this invention. It is sectional drawing for demonstrating the liquid crystal device of the 3rd Embodiment of this invention. It is sectional drawing for demonstrating the liquid crystal device of the 4th Embodiment of this invention. It is sectional drawing for demonstrating the liquid crystal device of the 4th Embodiment of this invention. It is sectional drawing for demonstrating the liquid crystal device of the 5th Embodiment of this invention. It is sectional drawing for demonstrating the liquid crystal device of the 5th Embodiment of this invention. It is sectional drawing for demonstrating the liquid crystal device of the 6th Embodiment of this invention. It is sectional drawing for demonstrating the liquid crystal device of the 7th Embodiment of this invention. It is a perspective view for demonstrating the electronic device of the 9th Embodiment of this invention. It is sectional drawing for demonstrating the conventional liquid crystal device.

Explanation of symbols

1 ... Drive IC
DESCRIPTION OF SYMBOLS 2 ... Board | substrate 3 ... Opposite board | substrate 4 ... Connection tool 5 ... Receptacle 6 ... Pressurization, heating 7 ... Adhesive 8 ... Silver paste 9 ... Conductive particle 10 ... Anisotropic conductive film 11 ... Polarizing plate 12 ... Polarizing plate ( Polarizing plate and reflector)
DESCRIPTION OF SYMBOLS 13 ... Light 21 ... Bump 22 ... Electronic device 41 ... Connection wiring with the output terminal of driving IC1 42 ... Connection wiring with the input terminal of driving IC1 50 ... Liquid crystal panel 51 ... Seal 52 ... Liquid crystal substance 61, 62, 63 , 64 ... upper surface 100 ... liquid crystal device T ... thickness of driving IC 1 t ... thickness of counter substrate 3 t '... thickness obtained by combining the thickness of counter substrate 3 and the thickness of polarizing plate 11

Claims (7)

A first substrate having a first main surface and a second main surface facing each other, a polarizing plate provided on the first main surface, and a third main surface and a fourth main surface facing each other And the third main surface has a first region and a second region, and the first region is disposed to face the second main surface of the first substrate. A second substrate, wiring provided on the third main surface, and the second main surface of the first substrate and the first region of the second substrate. A step of preparing a liquid crystal panel comprising: a liquid crystal material provided;
The sixth main surface of the driving element having a fifth main surface and a sixth main surface facing each other, and a bump provided on the sixth main surface is formed on the second substrate. A state in which the second region of the third main surface faces the second region, and a fixing member is interposed between the sixth main surface of the driving element and the third main surface of the second substrate. Then, the driving element is pressed from the fifth main surface side by a connecting tool to connect the bump and the wiring, and the driving element is fixed to the second substrate by the fixing member. Process,
With
The driving element has a height from the third main surface of the fifth main surface when the driving element is mounted on the third main surface by connecting the bump and the wiring. The method of manufacturing a liquid crystal device, wherein the height of the polarizing plate is greater than the height of the side surface opposite to the surface on the first substrate side from the third main surface.   The driving element is pressed by the connecting tool from the fifth main surface side so that the connecting tool overlaps a part of the polarizing plate and the driving element. Liquid crystal device manufacturing method.   When the driving element connects the bump and the wiring and mounts the driving element on the third main surface, the height of the fifth main surface from the third main surface 3. The driving element according to claim 1, wherein the driving element is 0.08 mm or more larger than a height from the third main surface on the side surface opposite to the first substrate side surface of the polarizing plate. A manufacturing method of the liquid crystal device according to the description.   When the driving element connects the bump and the wiring and mounts the driving element on the third main surface, the height of the fifth main surface from the third main surface is high. 3. The driving element having a height of 1.17 times or more the height from the third main surface of the polarizing plate opposite to the surface on the first substrate side. 4. A manufacturing method of the liquid crystal device according to the description.   When the driving element connects the bump and the wiring and mounts the driving element on the third main surface, the height of the fifth main surface from the third main surface is high. 5. The driving element having a height less than 4.7 times the height from the third main surface of the polarizing plate on the side opposite to the surface on the first substrate side. A method for producing a liquid crystal device according to any one of the above.   6. The driving element is fixed to the second substrate by setting a distance between an edge of the first substrate and the driving element to 2 mm or less. Liquid crystal device manufacturing method. A first substrate having a first main surface and a second main surface facing each other;
A polarizing plate provided on the first main surface;
A second substrate having a third main surface and a fourth main surface facing each other, the third substrate being disposed so as to oppose the second main surface;
A driving element having a fifth main surface and a sixth main surface facing each other;
A method of manufacturing a liquid crystal device comprising:
After the polarizing plate is provided on the first main surface, the sixth main surface of the driving element is made to face the third main surface of the first substrate, and the first main surface is contacted by a connection tool. Pressing the driving element from the main surface side of 5, and fixing the sixth main surface and the third main surface to each other;
With
In the driving element, when the sixth main surface and the third main surface are fixed to each other, the height of the fifth main surface from the third main surface is the height of the polarizing plate. A method for manufacturing a liquid crystal device, wherein the height of the side surface opposite to the surface on the first substrate side is greater than the height from the third main surface.

Images