JPH0535572B2 - - Google Patents
Info
- Publication number
- JPH0535572B2 JPH0535572B2 JP61182820A JP18282086A JPH0535572B2 JP H0535572 B2 JPH0535572 B2 JP H0535572B2 JP 61182820 A JP61182820 A JP 61182820A JP 18282086 A JP18282086 A JP 18282086A JP H0535572 B2 JPH0535572 B2 JP H0535572B2
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- printed circuit
- bonding
- outer lead
- positional deviation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000004065 semiconductor Substances 0.000 claims description 44
- 238000005520 cutting process Methods 0.000 claims description 17
- 239000000758 substrate Substances 0.000 claims description 5
- 238000001514 detection method Methods 0.000 claims description 3
- 230000007246 mechanism Effects 0.000 description 8
- 238000003860 storage Methods 0.000 description 4
- 230000009471 action Effects 0.000 description 2
- 239000011295 pitch Substances 0.000 description 2
- 230000006872 improvement Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 1
- 238000003909 pattern recognition Methods 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000010008 shearing Methods 0.000 description 1
- 238000005549 size reduction Methods 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61182820A JPS6340328A (ja) | 1986-08-05 | 1986-08-05 | アウタ−リ−ドボンデイング装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61182820A JPS6340328A (ja) | 1986-08-05 | 1986-08-05 | アウタ−リ−ドボンデイング装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6340328A JPS6340328A (ja) | 1988-02-20 |
| JPH0535572B2 true JPH0535572B2 (cs) | 1993-05-26 |
Family
ID=16125028
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61182820A Granted JPS6340328A (ja) | 1986-08-05 | 1986-08-05 | アウタ−リ−ドボンデイング装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6340328A (cs) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3151695B2 (ja) * | 1993-08-28 | 2001-04-03 | 株式会社新川 | 外部リードボンデイング方法及び装置 |
-
1986
- 1986-08-05 JP JP61182820A patent/JPS6340328A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6340328A (ja) | 1988-02-20 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |