JPH0534839B2 - - Google Patents

Info

Publication number
JPH0534839B2
JPH0534839B2 JP58229205A JP22920583A JPH0534839B2 JP H0534839 B2 JPH0534839 B2 JP H0534839B2 JP 58229205 A JP58229205 A JP 58229205A JP 22920583 A JP22920583 A JP 22920583A JP H0534839 B2 JPH0534839 B2 JP H0534839B2
Authority
JP
Japan
Prior art keywords
insulating layer
layer
wiring layer
conductive wiring
etching
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP58229205A
Other languages
English (en)
Japanese (ja)
Other versions
JPS60121795A (ja
Inventor
Muneo Nakayama
Akira Hashimoto
Toshihiro Nishimura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Ohka Kogyo Co Ltd
Original Assignee
Tokyo Ohka Kogyo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Ohka Kogyo Co Ltd filed Critical Tokyo Ohka Kogyo Co Ltd
Priority to JP22920583A priority Critical patent/JPS60121795A/ja
Publication of JPS60121795A publication Critical patent/JPS60121795A/ja
Publication of JPH0534839B2 publication Critical patent/JPH0534839B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Production Of Multi-Layered Print Wiring Board (AREA)
JP22920583A 1983-12-06 1983-12-06 多層配線板の製造方法 Granted JPS60121795A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP22920583A JPS60121795A (ja) 1983-12-06 1983-12-06 多層配線板の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP22920583A JPS60121795A (ja) 1983-12-06 1983-12-06 多層配線板の製造方法

Publications (2)

Publication Number Publication Date
JPS60121795A JPS60121795A (ja) 1985-06-29
JPH0534839B2 true JPH0534839B2 (enrdf_load_stackoverflow) 1993-05-25

Family

ID=16888461

Family Applications (1)

Application Number Title Priority Date Filing Date
JP22920583A Granted JPS60121795A (ja) 1983-12-06 1983-12-06 多層配線板の製造方法

Country Status (1)

Country Link
JP (1) JPS60121795A (enrdf_load_stackoverflow)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0682657B2 (ja) * 1986-04-23 1994-10-19 日本電気株式会社 半導体装置の製造方法
CN111093335B (zh) * 2019-12-20 2022-03-01 京东方科技集团股份有限公司 电子设备、电路板及其制备方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5133575A (en) * 1974-09-17 1976-03-22 Nippon Telegraph & Telephone Tasohaisenkozo
JPS5892239A (ja) * 1981-11-27 1983-06-01 Mitsubishi Electric Corp 半導体装置の製造方法
JPS5893328A (ja) * 1981-11-30 1983-06-03 Toshiba Corp 絶縁層の平担化方法
JPS5895839A (ja) * 1981-12-01 1983-06-07 Nec Corp 半導体装置の製造方法

Also Published As

Publication number Publication date
JPS60121795A (ja) 1985-06-29

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