JPH0533915B2 - - Google Patents

Info

Publication number
JPH0533915B2
JPH0533915B2 JP62016512A JP1651287A JPH0533915B2 JP H0533915 B2 JPH0533915 B2 JP H0533915B2 JP 62016512 A JP62016512 A JP 62016512A JP 1651287 A JP1651287 A JP 1651287A JP H0533915 B2 JPH0533915 B2 JP H0533915B2
Authority
JP
Japan
Prior art keywords
marking
semiconductor substrate
dust
film
photoresist
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP62016512A
Other languages
English (en)
Japanese (ja)
Other versions
JPS63183885A (ja
Inventor
Koichi Togashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Priority to JP62016512A priority Critical patent/JPS63183885A/ja
Publication of JPS63183885A publication Critical patent/JPS63183885A/ja
Publication of JPH0533915B2 publication Critical patent/JPH0533915B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M5/00—Duplicating or marking methods; Sheet materials for use therein
    • B41M5/24—Ablative recording, e.g. by burning marks; Spark recording

Landscapes

  • Thermal Transfer Or Thermal Recording In General (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Duplication Or Marking (AREA)
JP62016512A 1987-01-26 1987-01-26 半導体基板へのマ−キング方法 Granted JPS63183885A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62016512A JPS63183885A (ja) 1987-01-26 1987-01-26 半導体基板へのマ−キング方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62016512A JPS63183885A (ja) 1987-01-26 1987-01-26 半導体基板へのマ−キング方法

Publications (2)

Publication Number Publication Date
JPS63183885A JPS63183885A (ja) 1988-07-29
JPH0533915B2 true JPH0533915B2 (cs) 1993-05-20

Family

ID=11918324

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62016512A Granted JPS63183885A (ja) 1987-01-26 1987-01-26 半導体基板へのマ−キング方法

Country Status (1)

Country Link
JP (1) JPS63183885A (cs)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5151389A (en) * 1990-09-10 1992-09-29 Rockwell International Corporation Method for dicing semiconductor substrates using an excimer laser beam
JPH1158043A (ja) * 1997-07-31 1999-03-02 Lsi Logic Corp レーザ・マーキング方法及び装置
US6413839B1 (en) 1998-10-23 2002-07-02 Emcore Corporation Semiconductor device separation using a patterned laser projection
TWI248244B (en) 2003-02-19 2006-01-21 J P Sercel Associates Inc System and method for cutting using a variable astigmatic focal beam spot
JP4565994B2 (ja) * 2004-12-28 2010-10-20 信越半導体株式会社 レーザーマーク付き半導体ウェーハの製造方法、及びその半導体ウェーハ
JP2008084918A (ja) * 2006-09-26 2008-04-10 Casio Comput Co Ltd 半導体装置のマーク形成方法
CN116871711A (zh) * 2023-07-26 2023-10-13 武汉华工激光工程有限责任公司 砷化镓晶圆的激光打标方法及系统

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6195990A (ja) * 1984-10-18 1986-05-14 Fujitsu Ltd マ−キング方法

Also Published As

Publication number Publication date
JPS63183885A (ja) 1988-07-29

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