JPH053156B2 - - Google Patents

Info

Publication number
JPH053156B2
JPH053156B2 JP57063443A JP6344382A JPH053156B2 JP H053156 B2 JPH053156 B2 JP H053156B2 JP 57063443 A JP57063443 A JP 57063443A JP 6344382 A JP6344382 A JP 6344382A JP H053156 B2 JPH053156 B2 JP H053156B2
Authority
JP
Japan
Prior art keywords
conductive foil
insulating resin
base plate
resin layer
plating layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP57063443A
Other languages
English (en)
Japanese (ja)
Other versions
JPS58180084A (ja
Inventor
Hiroshi Ogawa
Tooru Higuchi
Takeshi Kano
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Priority to JP6344382A priority Critical patent/JPS58180084A/ja
Publication of JPS58180084A publication Critical patent/JPS58180084A/ja
Publication of JPH053156B2 publication Critical patent/JPH053156B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Insulated Metal Substrates For Printed Circuits (AREA)
JP6344382A 1982-04-15 1982-04-15 導電箔張り積層板の製造方法 Granted JPS58180084A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6344382A JPS58180084A (ja) 1982-04-15 1982-04-15 導電箔張り積層板の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6344382A JPS58180084A (ja) 1982-04-15 1982-04-15 導電箔張り積層板の製造方法

Publications (2)

Publication Number Publication Date
JPS58180084A JPS58180084A (ja) 1983-10-21
JPH053156B2 true JPH053156B2 (bg) 1993-01-14

Family

ID=13229396

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6344382A Granted JPS58180084A (ja) 1982-04-15 1982-04-15 導電箔張り積層板の製造方法

Country Status (1)

Country Link
JP (1) JPS58180084A (bg)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60176567U (ja) * 1984-04-30 1985-11-22 日本電気ホームエレクトロニクス株式会社 プリント配線基板
JPH04166917A (ja) * 1990-10-31 1992-06-12 Nippon Mektron Ltd 電気泳動表示素子

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4844609A (bg) * 1971-10-07 1973-06-27
JPS4999581A (bg) * 1973-01-24 1974-09-20
EP0048406A2 (de) * 1980-09-22 1982-03-31 Siemens Aktiengesellschaft Wärmeableitende Leiterplatten

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4844609A (bg) * 1971-10-07 1973-06-27
JPS4999581A (bg) * 1973-01-24 1974-09-20
EP0048406A2 (de) * 1980-09-22 1982-03-31 Siemens Aktiengesellschaft Wärmeableitende Leiterplatten

Also Published As

Publication number Publication date
JPS58180084A (ja) 1983-10-21

Similar Documents

Publication Publication Date Title
US4357395A (en) Transfer lamination of vapor deposited foils, method and product
US5504992A (en) Fabrication process of wiring board
US4421608A (en) Method for stripping peel apart conductive structures
JPH053156B2 (bg)
JPH08281866A (ja) フレキシブル金属箔積層板の製造方法
JP2002124762A (ja) 多層プリント配線板の製造方法
JP3543348B2 (ja) 多層配線板の製造法
JPS6032393A (ja) 多層回路板の製造方法
JP3093505B2 (ja) 積層セラミックコンデンサの製造方法
JPH03223486A (ja) 銅張積層板の摺動部材の表面処理方法
JPS6169409A (ja) プリプレグの製法
JPH10200259A (ja) 多層プリント配線板の製造方法
JPS61193843A (ja) 珪素鋼板ベ−ス銅張積層板の製造方法
JPH0587386B2 (bg)
JPS5916930B2 (ja) 積層板の製造方法
JPS63154203A (ja) プリント回路基盤用圧延銅箔
JPS6157337A (ja) 金属ベ−ス印刷回路用積層板
JPS6027758B2 (ja) ニツケルメツキ処理銅箔の製造法
JPH05229061A (ja) 金属コア積層板の製造方法
JPH05283821A (ja) 金属ベース配線基板
JPS59148390A (ja) 珪素鋼板ベ−ス銅張積層板の製造方法
JPS63111699A (ja) 金属箔張積層板の製造法
JPS61241329A (ja) 銅と樹脂との接着方法
JP2005153298A (ja) 両面銅張積層板及びその製造方法並びに多層積層板
JPS6169449A (ja) 金属ベ−ス印刷回路用積層板