JPH0530360Y2 - - Google Patents

Info

Publication number
JPH0530360Y2
JPH0530360Y2 JP1988014996U JP1499688U JPH0530360Y2 JP H0530360 Y2 JPH0530360 Y2 JP H0530360Y2 JP 1988014996 U JP1988014996 U JP 1988014996U JP 1499688 U JP1499688 U JP 1499688U JP H0530360 Y2 JPH0530360 Y2 JP H0530360Y2
Authority
JP
Japan
Prior art keywords
photoelectric conversion
wiring board
conversion element
output terminals
photoelectric
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1988014996U
Other languages
English (en)
Japanese (ja)
Other versions
JPH01120335U (cs
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988014996U priority Critical patent/JPH0530360Y2/ja
Publication of JPH01120335U publication Critical patent/JPH01120335U/ja
Application granted granted Critical
Publication of JPH0530360Y2 publication Critical patent/JPH0530360Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy

Landscapes

  • Wire Bonding (AREA)
JP1988014996U 1988-02-05 1988-02-05 Expired - Lifetime JPH0530360Y2 (cs)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988014996U JPH0530360Y2 (cs) 1988-02-05 1988-02-05

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988014996U JPH0530360Y2 (cs) 1988-02-05 1988-02-05

Publications (2)

Publication Number Publication Date
JPH01120335U JPH01120335U (cs) 1989-08-15
JPH0530360Y2 true JPH0530360Y2 (cs) 1993-08-03

Family

ID=31226664

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988014996U Expired - Lifetime JPH0530360Y2 (cs) 1988-02-05 1988-02-05

Country Status (1)

Country Link
JP (1) JPH0530360Y2 (cs)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4802907B2 (ja) * 2006-07-25 2011-10-26 パナソニック株式会社 半導体実装構造
JP5252472B2 (ja) * 2007-09-28 2013-07-31 シャープ株式会社 太陽電池、太陽電池の製造方法、太陽電池モジュールの製造方法および太陽電池モジュール
JP5154516B2 (ja) * 2009-05-22 2013-02-27 シャープ株式会社 太陽電池モジュール及び太陽電池モジュールの製造方法
JP5576957B2 (ja) * 2013-04-01 2014-08-20 シャープ株式会社 太陽電池モジュール
JP2014160865A (ja) * 2014-05-09 2014-09-04 Sharp Corp 太陽電池モジュール

Also Published As

Publication number Publication date
JPH01120335U (cs) 1989-08-15

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