JPH0528492B2 - - Google Patents

Info

Publication number
JPH0528492B2
JPH0528492B2 JP60105187A JP10518785A JPH0528492B2 JP H0528492 B2 JPH0528492 B2 JP H0528492B2 JP 60105187 A JP60105187 A JP 60105187A JP 10518785 A JP10518785 A JP 10518785A JP H0528492 B2 JPH0528492 B2 JP H0528492B2
Authority
JP
Japan
Prior art keywords
semiconductor wafer
etching
mesa
wafer
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP60105187A
Other languages
English (en)
Japanese (ja)
Other versions
JPS61263227A (ja
Inventor
Hideo Myagi
Hisatomo Kanazawa
Isamu Kawashima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electronics Corp filed Critical Matsushita Electronics Corp
Priority to JP60105187A priority Critical patent/JPS61263227A/ja
Publication of JPS61263227A publication Critical patent/JPS61263227A/ja
Publication of JPH0528492B2 publication Critical patent/JPH0528492B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10P50/00—

Landscapes

  • Weting (AREA)
  • Dicing (AREA)
JP60105187A 1985-05-17 1985-05-17 半導体装置の製造方法 Granted JPS61263227A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60105187A JPS61263227A (ja) 1985-05-17 1985-05-17 半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60105187A JPS61263227A (ja) 1985-05-17 1985-05-17 半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JPS61263227A JPS61263227A (ja) 1986-11-21
JPH0528492B2 true JPH0528492B2 (enExample) 1993-04-26

Family

ID=14400673

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60105187A Granted JPS61263227A (ja) 1985-05-17 1985-05-17 半導体装置の製造方法

Country Status (1)

Country Link
JP (1) JPS61263227A (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5387316A (en) * 1992-12-09 1995-02-07 Motorola, Inc. Wafer etch protection method
US20040229002A1 (en) * 2003-05-15 2004-11-18 3D Systems, Inc. Stereolithographic seal and support structure for semiconductor wafer
CN103688346B (zh) 2011-07-15 2016-12-28 富士电机株式会社 用于制造半导体器件的方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5016479A (enExample) * 1973-06-11 1975-02-21
JPS5713745A (en) * 1980-06-30 1982-01-23 Fujitsu Ltd Detecting method for ion etching finishing point
JPS5769751A (en) * 1980-10-17 1982-04-28 Nec Home Electronics Ltd Manufacture of semiconductor device
JPS57100719A (en) * 1980-12-15 1982-06-23 Nec Home Electronics Ltd Manufacture of semiconductor device
JPS57173940A (en) * 1981-04-17 1982-10-26 Omron Tateisi Electronics Co Mask for photoetching
JPS5832421A (ja) * 1981-08-20 1983-02-25 Nec Corp 半導体装置の製造方法
JPS5980940A (ja) * 1982-11-01 1984-05-10 Oki Electric Ind Co Ltd 絶縁物分離基板の製造方法
JPS59100563A (ja) * 1982-11-30 1984-06-09 Sharp Corp メサ型半導体装置の製造方法

Also Published As

Publication number Publication date
JPS61263227A (ja) 1986-11-21

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