JPH05259238A - Testing device for ic package - Google Patents

Abstract

PURPOSE:To inspect the disconnection and short circuit of a wiring pattern in an IC package quickly and simply regarding a testing device inspecting the IC package of a semiconductor. CONSTITUTION:A contactor 1 for electrically connecting the IC leads 3 of an IC package 4, a short-circuiting block 11 for short-circuiting all bonding pads 6 of the IC package 4, and an insulating block 14 for isolating all bonding pads 6 of the IC package 4 are mounted. The title testing device is constituted so as to have a function conducting the two inspection of an open test, in which the IC package 4 is connected to the contactor 1 from the short-circuiting block 11 and the disconnection of internal patterns 5 in the IC package 4 is checked, and a short-circuit test, in which the IC package 4 is connected to the contactor 1 from the insulating block 14 and the short circuit of the internal patterns 5 in the IC package 4 is checked.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a testing device for inspecting a semiconductor IC package. In recent years, semiconductors have been required to be smaller and have more functions, and IC packages have been made smaller and have more pins. As a result, it becomes difficult to manufacture an IC package, and a wiring pattern inspection such as a short circuit or disconnection of the IC package has not been performed until now, but it is necessary to perform an inspection in order to increase the yield of the IC.

[0002]

2. Description of the Related Art In the conventional way of thinking, there was no idea of inspecting an IC package. Conventionally, when an IC package is manufactured, the disconnection of a wiring pattern is judged by whether or not plating is formed.

However, if it is necessary to inspect a large number of pins as in the current situation, it is conceivable to contact all IC leads and bonding pads pin by pin and inspect all patterns one by one.

In this method, it is actually difficult to make contact with the bonding pad pin by pin.

[0005]

That is, a multi-pin I
In the C package, for example, the bonding pad is 30μ
It is necessary to make contact with pads with a width of 10 μm at m pitch, but if the method is to be performed in accordance with the probe test contact of the IC chip, it is possible to perform highly accurate positioning with respect to the contact with the bonding pad of the probe. A device is required and the cost is high. Also,
Inspecting by taking contacts for each pin means inspecting all combinations of patterns, and in a 500-pin IC package, a test count of 500 times cubed is required, which requires a very long test time. These become more difficult technologies due to the increased number of pins in the IC package.

Accordingly, the present invention is provided for the purpose of developing an apparatus for inspecting a wiring pattern in an IC package for disconnection / short circuit in a quick and easy manner.

[0007]

FIG. 1 illustrates the principle of the present invention. In the figure, 1 is a contactor, 2 is a contact probe, 3 is an IC lead, 4 is an IC package,
5 is an internal pattern, 6 is a bonding pad, 7 is a contact sheet, 8 is a gold foil, 9 is a mesh sheet, 10 is an anisotropic conductive rubber, 11 is a short block, 12 is a wiring a, 13
The wirings b and 14 are insulating blocks.

In order to solve the problems of the prior art, in the present invention, as shown in FIG. 1A, the contactor 1 for electrically connecting the IC leads 3 of the IC package 4 is connected.
And a short block 11 for short-circuiting all the bonding pads 6 of the IC package 4, and as shown in FIG. 1B, the bonding pad 6 of the IC package 4.
1 has an insulating block 14 for opening all
As shown in detail in (c), the short block 11 connects the IC package 4 to the contactor 1 and an open test for checking the disconnection of the internal pattern 5 in the IC package 4, and FIG. As shown in b), the insulation block 14 connects the IC package 4 to the contactor 1 and has a function of performing two tests, that is, a short test for checking a short circuit of the internal pattern 5 in the IC package 4. By having also,
As shown in (c), the open test function is
Since the bonding pad 6 of the C package 4 has a function of short-circuiting all by the short block 11 via the contact sheet 7, the contact sheet 7 further has a gold foil 8 and a mesh sheet 9 as shown in FIG. , Consisting of three layers of anisotropic conductive rubber 10,
This is achieved by having a function that enables the short block 11 to conduct to the contactor 1 for all the bonding pads 6 corresponding to the step of the bonding pads 6.

[0009]

In the present invention, the disconnection / short circuit test of the internal wiring of the IC package can be easily and quickly performed by using the two steps of the short test and the open test.

Further, by using the contact sheet together with the short block, the positioning accuracy of the IC package can be made rougher than before.

[0011]

FIG. 2 is a test circuit diagram of the present invention, FIG. 3 is an internal view of a relay unit, and FIG. 4 is an explanatory view of an embodiment of the present invention.

In the figure, 4 is an IC package, 5 is an internal pattern, 6 is a bonding pad, 7 is a contact sheet, 8 is a gold foil, 9 is a mesh sheet, 10 is anisotropic conductive rubber, 11 is a short block, and 14 is Insulation block, 15
Is a relay unit and 16 is a measuring unit. As shown in FIG. 2 (a), the short block 11 which short-circuits all the bonding pads 6 of the IC package 4 is used as the power source pin of the measuring unit 16.

The contact probe 2 which is in contact with the IC lead 3 of the IC package 4 is connected to the relay unit 15 by wiring, and this relay has a measuring unit 16
Power supply sense pin.

For the measurement, each pin 1P to 6P is relayed one pin at a time.
And the short block 11 and IC in the measuring unit 16
The resistance between the leads 3 is measured and inspected. Next, FIG.
In (b), only the IC lead 3 of the IC package 4 is contacted.

Therefore, switching is performed by the relay unit 15 so that 5P and 6P shown in the figure are connected to the measuring section, respectively. Then, by measuring the resistance between 5P and 6P, the disconnection between the internal patterns 5 in the IC package 4 can be inspected.

Next, as shown in FIG. 2C, only the IC lead 3 of the IC package 4 is contacted. Therefore, connect 5P and 6P in the figure to the power source pin of the measuring unit 16,
It is possible to inspect for short circuits between the pin and other pins.

2 of the open test (contact by the short block 11) described with reference to FIGS. 2A and 2B and the short test (contact by the insulating block 14) shown in FIG. 2C as described above. In one measurement,
It is possible to inspect all the disconnection / short-circuit states of the internal pattern 5 in the IC package 4.

In the actual example, the height of the plating thickness of the multi-pin bonding pad 6 varies, and the thickness is 1 to 3 μm.
A height variation of about m occurs. In addition, in the embodiment,
Since the 500-pin IC package 4 was used, the width of the bonding pad was 10 μm and the pitch was 30 μm, which was very small. Then, an open test was conducted on the contact sheet of the present invention.

As shown in FIG. 4, first, the contact sheet 7 has a fibrous mesh such as gauze between the gold foil 8 and the anisotropic conductive rubber 10 in order to eliminate the step d between the bonding pads 6. The sheet 9 is sandwiched. As a result, the step d of the bonding pad 6 is absorbed, and the anisotropic conductive film rubber 10
The fine gold wires embedded in columns penetrate the mesh sheet 9 and contact all the gold foils 8. The gold foil 8 contacts all the bonding pads 6.

Further, the gold wires of the anisotropic conductive rubber 10 are evenly and vertically distributed on one surface, and since the gold wires in the horizontal direction are insulated from each other, they do not need to be aligned. The gold wire contacts all the bonding pads 6.

In the embodiment, the short-circuit / disconnection test of the 500-pin IC package was carried out in this way, and the number of times of measurement switching between the conventional example and the present invention is compared. In the case of a 500-pin IC package, the number of IC leads 3 and bonding pads 6 is 1,000 with the conventional method, and when all pins are inspected by combining these, 1,000 + 1,000 × 999 ÷
2 = 500,500 ways, which requires switching of this number of relays.

On the other hand, according to the method of the present invention, it is possible to switch the relays 1,000 times, one time for each pin in the open test and 500 times for each pin in the short test. Therefore, switching of relays by 1/500 of the conventional example will suffice.

The present invention can also perform rough alignment with a fine pitch and a fine pad, and can perform a multilayer internal pattern wiring inspection of a printed wiring board having a fine pitch and a fine pad in a similar manner as well as an IC package. Can be inspected.

[0024]

As described above, according to the present invention,
Using a positioning mechanism that is rougher than before, and using a simple method,
All the wiring patterns in the IC package can be inspected for a short circuit / disconnection in a short time, which greatly contributes to shortening the test time of the IC package tester and improving the inspection accuracy.

[Brief description of drawings]

FIG. 1 is an explanatory view of the principle of the present invention.

FIG. 2 is a test circuit diagram of the present invention.

[Figure 3] Internal view of the relay unit

FIG. 4 is an explanatory diagram of an embodiment of the present invention.

[Explanation of symbols]

 1 Contactor 2 Contact probe 3 IC lead 4 IC package 5 Internal pattern 6 Bonding pad 7 Contact sheet 8 Gold foil 9 Mesh sheet 10 Anisotropic conductive rubber 11 Short block 12 Wiring a 13 Wiring b 14 Insulation block 15 Relay unit 16 Measuring section

Claims (3)

[Claims] 1. A contactor (1) for electrically connecting IC leads (3) of an IC package (4), and a short block (11) for short-circuiting all bonding pads (6) of the IC package (4). An insulating block that opens all the bonding pads (6) of the IC package (4)
(14) and connecting the IC package (3) to the contactor (1) from the short block (11),
From the open test to check the disconnection of the internal pattern (5) in the C package (4) and the insulation block (14),
Connect the C package (4) to the contactor (1),
An IC package tester having a function of performing two tests, a short test for checking a short circuit of an internal pattern (5) in the IC package (4). 2. The open test function has a function of short-circuiting all of the bonding pads (6) of the IC package (4) through a contact sheet (7) by a short block (11). Item 1. The IC package test apparatus according to Item 1. 3. The contact sheet (7) comprises a gold foil (8),
It has a three-layer structure consisting of a mesh sheet (9) and an anisotropic conductive rubber (8), and connects the short block (11) to the contactor (1) in correspondence with the step of the bonding pad (6). 3. The IC package testing apparatus according to claim 2, which has a function that enables all bonding pads.