CN113687262A - Method and device for testing open circuit and short circuit of packaging body - Google Patents
Method and device for testing open circuit and short circuit of packaging body Download PDFInfo
- Publication number
- CN113687262A CN113687262A CN202010420949.2A CN202010420949A CN113687262A CN 113687262 A CN113687262 A CN 113687262A CN 202010420949 A CN202010420949 A CN 202010420949A CN 113687262 A CN113687262 A CN 113687262A
- Authority
- CN
- China
- Prior art keywords
- tested
- circuit
- pad group
- short
- test
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000012360 testing method Methods 0.000 title claims abstract description 89
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 45
- 238000000034 method Methods 0.000 title claims abstract description 23
- 238000003466 welding Methods 0.000 claims abstract description 6
- 230000002950 deficient Effects 0.000 claims description 19
- 238000013461 design Methods 0.000 claims description 5
- 238000010998 test method Methods 0.000 claims description 5
- 238000010586 diagram Methods 0.000 description 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/50—Testing of electric apparatus, lines, cables or components for short-circuits, continuity, leakage current or incorrect line connections
- G01R31/52—Testing for short-circuits, leakage current or ground faults
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/50—Testing of electric apparatus, lines, cables or components for short-circuits, continuity, leakage current or incorrect line connections
- G01R31/54—Testing for continuity
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
Abstract
The application discloses a method and a device for testing open circuit and short circuit of a packaging body, wherein the testing method comprises the following steps: obtaining an electrical connection relation of a pad group formed by any two pads in a to-be-tested packaging body, wherein the electrical connection relation comprises an open-circuit connection relation or a short-circuit connection relation; setting an electrical parameter threshold value required to be met by each welding pad group according to the electrical connection relation; and performing open-circuit short-circuit test on all the pad groups in the to-be-tested packaging body according to the electrical connection relation and the electrical parameter threshold. Through the mode, the electric parameter threshold value that each pad group needs to satisfy can be set according to the electric connection relation in this application, and the electric parameter threshold value of avoiding whole pad groups is cut by a knife, and the flexibility is higher.
Description
Technical Field
The application belongs to the technical field of packaging test, and particularly relates to a method and a device for testing open circuit and short circuit of a packaging body.
Background
With the rapid development of packaging technology, the integration rate of the package is higher and higher, and many system level packages have been derived at present. Generally, when electronic components (e.g., chips, etc.) having different functions are integrated together, a bridge (e.g., lead, solder, etc.) is often required for connection. In the process of packaging electronic components, various short-circuit phenomena such as short-circuit of components, short-circuit of parts, short-circuit of tin wires and the like may occur, and open-circuit phenomena such as shortage of parts, disconnection, bad tin absorption and the like may also occur. Therefore, it is necessary to detect an open short of the package at the time of shipment.
Disclosure of Invention
The application provides a method and a device for testing the open circuit and the short circuit of a packaging body, which can set the electrical parameter threshold value required to be met by each welding pad group according to the electrical connection relation, avoid the electrical parameter threshold value of all the welding pad groups from being cut one by one, and have higher flexibility.
In order to solve the technical problem, the application adopts a technical scheme that: a method for testing open circuit and short circuit of a package is provided, which comprises the following steps: obtaining an electrical connection relation of a pad group formed by any two pads in a to-be-tested packaging body, wherein the electrical connection relation comprises an open-circuit connection relation or a short-circuit connection relation; setting an electrical parameter threshold value required to be met by each welding pad group according to the electrical connection relation; and performing open-circuit short-circuit test on all the pad groups in the to-be-tested packaging body according to the electrical connection relation and the electrical parameter threshold.
The obtaining of the electrical connection relationship of the pad group formed by any two pads in the package to be tested includes: and according to a good product or a design drawing which is the same as the packaging structure of the packaging body to be tested, classifying all the bonding pad groups in the packaging body to be tested into the open circuit groups with the open circuit connection relation or the short circuit groups with the short circuit connection relation respectively.
Wherein, the setting of the electrical parameter threshold value required to be met by each pad group according to the electrical connection relationship comprises: and setting the minimum resistance value required to be reached by each pad group in the open circuit group and setting the maximum resistance value capable of being reached by each pad group in the short circuit group.
Wherein, the performing an open-circuit short-circuit test on all the pad groups in the package to be tested according to the electrical connection relationship and the electrical parameter threshold includes: electrically connecting all the bonding pads of the to-be-tested packaging body with a multi-path relay test board; controlling the conduction of a relay in the multi-path relay test board electrically connected with the current pad group to be tested; obtaining the resistance value of the pad group to be tested; judging whether the pad group to be tested meets the electrical connection relation according to the resistance value; judging whether all the pad groups in the to-be-tested packaging body are tested completely; if not, the relay electrically connected with the current pad group to be tested is controlled to be disconnected, the relay electrically connected with the next pad group to be tested is controlled to be connected, and the step of obtaining the resistance value of the pad group to be tested is returned.
Wherein, the judging whether the current pad group to be tested meets the electric connection relation according to the resistance value comprises the following steps: if the bonding pad group to be tested has an open-circuit connection relationship, judging whether the resistance value is greater than or equal to the minimum resistance value corresponding to the bonding pad group to be tested; if so, judging that the open-circuit test of the pad group to be tested passes, otherwise, judging that the open-circuit test of the pad group to be tested does not pass; if the bonding pad group to be tested has a short-circuit connection relation, judging whether the resistance value is less than or equal to the maximum resistance value corresponding to the bonding pad group to be tested; if so, judging that the short-circuit test of the pad group to be tested passes, otherwise, judging that the short-circuit test of the pad group to be tested does not pass.
Wherein, still include: if the open-circuit short-circuit tests of all the bonding pad groups in the to-be-tested packaging body pass, classifying the to-be-tested packaging body into good products, and updating the number of the good products; and if the open-circuit short-circuit test of at least one pad group in the to-be-tested packaging body fails, classifying the to-be-tested packaging body into defective products, and updating the number of the defective products.
Wherein, still include: receiving a request for checking good product information and defective product information; and displaying the good product information and the defective product information.
If the open-circuit short-circuit test of at least one pad group in the to-be-tested packaging body does not pass, an alarm prompt is sent before or after the to-be-tested packaging body is classified as a defective product.
In order to solve the above technical problem, another technical solution adopted by the present application is: provided is a package open-short test device, including: the test device comprises a memory, a processor and a multi-way relay test board, wherein the processor is respectively coupled with the memory and the multi-way relay test board, and the processor, the memory and the multi-way relay test board are mutually matched in operation to realize the test method in any embodiment.
The testing device comprises a single chip microcomputer, and the single chip microcomputer comprises the processor and the memory; and/or, the test device further comprises: the display is coupled with the processor and used for displaying a test result, and the alarm unit is coupled with the processor and used for sending an alarm prompt when the test fails.
The beneficial effect of this application is: before performing open-circuit short-circuit test on all the pad groups in the package to be tested, the electrical parameter thresholds of the pad groups are set according to respective electrical connection relations of each pad group, for example, the open-circuit connection relations or the short-circuit connection relations. The mode can avoid the condition that the electrical parameter threshold of all the welding disc groups is cut by one knife, and the flexibility and the accuracy are higher.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, it is obvious that the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without inventive efforts, wherein:
FIG. 1 is a schematic flow chart illustrating an embodiment of a method for testing an open circuit and a short circuit of a package according to the present disclosure;
FIG. 2 is a flowchart illustrating an embodiment corresponding to step S103 in FIG. 1;
FIG. 3 is a schematic structural diagram of an embodiment corresponding to step S103 in FIG. 1;
fig. 4 is a schematic structural diagram of an embodiment of a package open-short testing apparatus according to the present application.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
Referring to fig. 1, fig. 1 is a schematic flow chart illustrating an embodiment of a method for testing an open circuit and a short circuit of a package according to the present application, the method comprising:
s101: and obtaining the electrical connection relation of a pad group formed by any two pads in the to-be-tested packaging body, wherein the electrical connection relation comprises an open circuit connection relation or a short circuit connection relation.
Specifically, in the present embodiment, the package under test may be in a ball grid array BGA package form, a land grid array LGA package form, a quad flat no-lead QFN package form, or the like. The specific implementation process of the step S101 may be: and classifying all the pad groups in the package to be tested into an open circuit group with an open circuit connection relation or a short circuit group with a short circuit connection relation respectively according to a good product or a design drawing which is the same as the package structure of the package to be tested.
In an application scenario, it is assumed that the package under test may include A, B, C, D four pads, and the four pads may form 6 pad groups, which are AB, AC, AD, BC, BD, and CD respectively. The 6 pad groups can be classified into an open circuit group and a short circuit group respectively by a good product or a design drawing which is the same as the packaging structure of the packaging body to be tested. For example, the open circuit group includes AB, AD, BC, and the short circuit group includes AC, BD, CD.
S102: and setting the electrical parameter threshold value required to be met by each pad group according to the electrical connection relation.
Specifically, in this embodiment, the electrical parameter thresholds corresponding to all the pad groups having the open-circuit connection relationship are not completely the same, and/or the electrical parameter thresholds corresponding to all the pad groups having the short-circuit connection relationship are not completely the same. Of course, in other embodiments, the electrical parameter thresholds corresponding to all the pad groups having the open-circuit connection relationship may also be completely different, and/or the electrical parameter thresholds corresponding to all the pad groups having the short-circuit connection relationship may also be completely different.
The implementation process of the step S102 may be: and setting the minimum resistance value required to be reached by each bonding pad group in the open circuit group and setting the maximum resistance value capable of being reached by each bonding pad group in the short circuit group. For example, the minimum resistance values required for the open circuit groups AB, AD, and BC may be set to 30 ohms, 100 ohms, and the like, respectively. The standard that each pad group in the open circuit group is determined as open circuit can be different, the standard that each pad group in the short circuit group is determined as short circuit can be different, and the adjustment can be carried out according to the reality, so that the flexibility is higher. Of course, in other embodiments, the electrical parameter threshold may be other, such as current, etc., and this is not limited in this application.
S103: and performing open-circuit short-circuit test on all the pad groups in the to-be-tested packaging body according to the electrical connection relation and the electrical parameter threshold.
Specifically, in an embodiment, please refer to fig. 2, and fig. 2 is a flowchart illustrating an embodiment corresponding to step S103 in fig. 1. The step S103 specifically includes:
s201: all the pads of the package 10 to be tested are electrically connected to the multiplex relay test board 12.
Specifically, as shown in fig. 3, fig. 3 is a schematic structural diagram of an embodiment corresponding to step S103 in fig. 1. When the number of the packages 10 to be tested is multiple, the packages 10 to be tested may be disposed on the multi-relay test board 12 at the same time, and the package structures of the packages 10 to be tested may be the same or different, which is not limited in this application. The multiplex relay test board 12 may be provided with a plurality of electrical connection interfaces in advance, each of which is electrically connected to one pad of the package 10 to be tested.
S202: and controlling the conduction of the relay 120 in the multi-path relay test board 12 electrically connected with the current pad group to be tested.
Specifically, referring to fig. 3 again, assuming that the current pad group to be tested is AB, the two relays 120 electrically connected to the current pad group to be tested AB may be turned on.
S203: and obtaining the resistance value of the pad group to be tested.
Specifically, the single chip microcomputer 14 electrically connected to the multi-relay test board 12 can provide a constant voltage to the two ends of the current pad group AB to be tested through the turned-on relay 120, and can obtain the resistance value by detecting the current flowing through the current pad group AB to be tested.
S204: and judging whether the pad group to be tested meets the electrical connection relation according to the resistance value.
Specifically, in this embodiment, if the pad group to be tested has an open-circuit connection relationship, it is determined whether the resistance value is greater than or equal to the minimum resistance value corresponding to the pad group to be tested; if so, judging that the open-circuit test of the pad group to be tested passes, otherwise, judging that the open-circuit test of the pad group to be tested does not pass; if the pad group to be tested has the short-circuit connection relation, judging whether the resistance value is less than or equal to the maximum resistance value corresponding to the pad group to be tested; if so, judging that the short-circuit test of the pad group to be tested passes, otherwise, judging that the short-circuit test of the pad group to be tested does not pass.
For example, assuming that the current pad group AB to be tested has an open-circuit connection relationship, the minimum resistance value set in step S102 is 30 ohms; the resistance value of the current pad group AB to be tested obtained in step S203 is 40 ohms, and since the resistance value obtained by the test is greater than the set minimum resistance value, it can be determined that the open circuit test of the current pad group AB to be tested passes, and the current pad group AB to be tested is a qualified pad group.
For another example, assuming that the current pad group CD to be tested has a short-circuit connection relationship, the maximum resistance value set in step S102 is 30 ohms; the resistance value of the current pad group CD to be tested obtained in step S203 is 40 ohms, and since the resistance value obtained by the test is greater than the set maximum resistance value, it is determined that the short circuit test of the current pad group CD to be tested does not pass, and the current pad group CD to be tested is a non-qualified pad group.
S205: and judging whether all the bonding pad groups in the to-be-tested packaging body are tested.
Specifically, a step of adding a count may be added before the step S205, and each time a group of pads to be tested is determined, the corresponding count is added by 1; if the counting reaches the group number of all the pad groups in the to-be-tested packaging body, the testing of all the pad groups is finished; otherwise, it indicates that there are more padgroups left untested.
S206: if not, the relay electrically connected with the current pad group to be tested is controlled to be disconnected, the relay electrically connected with the next pad group to be tested is controlled to be connected, and the step of obtaining the resistance value of the pad group to be tested is returned.
For example, as shown in fig. 3, if the pad group AB is tested, the relay 120 corresponding to the pad group AB may be turned off, and the relay 120 corresponding to the next pad group BC may be turned on.
In addition, after all the pad groups on the package 10 to be tested are tested, the current testing process can be ended; alternatively, the test process may be performed on the next package 10 to be tested until all the packages 10 to be tested on the multi-relay test board 12 are tested.
In addition, in this embodiment, after all the pad groups on the package to be tested are tested, the method may further include: if the open-circuit short-circuit tests of all the pad groups in the package body to be tested pass, classifying the package body to be tested into good products, and updating the number of the good products; and if the open-circuit short-circuit test of at least one pad group in the to-be-tested packaging body fails, classifying the to-be-tested packaging body into defective products, and updating the number of the defective products. By the method, the yield of the batch of packages to be tested can be automatically counted.
Further, when a request for checking good product information and defective product information is received, the good product information and the defective product information can be directly displayed. The good product information can comprise at least one of the number of good products and the specific number of the packaging body; the defective product information may include at least one of a number of defective products, a specific package number, and a number of a defective pad group. By the method, the user can know the good product information and the defective product information more intuitively and conveniently.
In addition, if the open-circuit short-circuit test of at least one pad group in the to-be-tested package body does not pass, an alarm prompt is sent before or after the to-be-tested package body is classified as a defective product, and the alarm prompt can be in a sound or light flashing mode; wherein the sound may be emitted by a buzzer or the like. The design mode can be more intuitive and convenient, so that a user can know whether the current packaging body to be tested is a good product or not in the test process.
Referring to fig. 4, fig. 4 is a schematic structural diagram of an embodiment of a package open-short testing apparatus according to the present application. The test device includes: a memory 20, a processor 22 and a multi-relay test board 24; the processor 22 is coupled to the memory 20 and the multi-relay test board 24, and the processor 22, the memory 20 and the multi-relay test board 24 cooperate with each other to implement the testing method mentioned in any of the above embodiments.
In one application scenario, the memory 20 and the processor 22 may be integrated into a single chip. The single chip microcomputer can be communicated with an external terminal (such as a computer) through a 232 serial port and the like. The external terminal can be pre-programmed and debugged with the program related to the testing method, and the program is transmitted to the memory 20 in the singlechip through the 232 serial port, so that the subsequent singlechip can be tested off line.
In another application scenario, the testing device may further include a display and an alarm unit; the display is coupled to the processor 22 for displaying the test result, for example, displaying good information and bad information. The alarm unit is coupled with the processor 22 and used for sending out an alarm prompt when the test fails; the alarm unit can be a buzzer alarm, a flashing lamp and the like.
The above description is only an example of the present application and is not intended to limit the scope of the present application, and all modifications of equivalent structures and equivalent processes, which are made by the contents of the specification and the drawings, or which are directly or indirectly applied to other related technical fields, are intended to be included within the scope of the present application.
Claims (10)
1. A method for testing an open circuit and a short circuit of a package body is characterized by comprising the following steps:
obtaining an electrical connection relation of a pad group formed by any two pads in a to-be-tested packaging body, wherein the electrical connection relation comprises an open-circuit connection relation or a short-circuit connection relation;
setting an electrical parameter threshold value required to be met by each welding pad group according to the electrical connection relation;
and performing open-circuit short-circuit test on all the pad groups in the to-be-tested packaging body according to the electrical connection relation and the electrical parameter threshold.
2. The method according to claim 1, wherein the obtaining of the electrical connection relationship between the pad group formed by any two pads in the package to be tested comprises:
and according to a good product or a design drawing which is the same as the packaging structure of the packaging body to be tested, classifying all the bonding pad groups in the packaging body to be tested into the open circuit groups with the open circuit connection relation or the short circuit groups with the short circuit connection relation respectively.
3. The testing method according to claim 2, wherein the setting of the electrical parameter threshold value required to be met by each of the pad groups according to the electrical connection relationship comprises:
and setting the minimum resistance value required to be reached by each pad group in the open circuit group and setting the maximum resistance value capable of being reached by each pad group in the short circuit group.
4. The method according to claim 3, wherein the performing an open-short test on all the pad groups in the package to be tested according to the electrical connection relationship and the electrical parameter threshold comprises:
electrically connecting all the bonding pads of the to-be-tested packaging body with a multi-path relay test board;
controlling the conduction of a relay in the multi-path relay test board electrically connected with the current pad group to be tested;
obtaining the resistance value of the pad group to be tested;
judging whether the pad group to be tested meets the electrical connection relation according to the resistance value;
judging whether all the pad groups in the to-be-tested packaging body are tested completely;
if not, the relay electrically connected with the current pad group to be tested is controlled to be disconnected, the relay electrically connected with the next pad group to be tested is controlled to be connected, and the step of obtaining the resistance value of the pad group to be tested is returned.
5. The method according to claim 4, wherein the determining whether the current pad group to be tested satisfies the electrical connection relationship according to the resistance value comprises:
if the bonding pad group to be tested has an open-circuit connection relationship, judging whether the resistance value is greater than or equal to the minimum resistance value corresponding to the bonding pad group to be tested; if so, judging that the open-circuit test of the pad group to be tested passes, otherwise, judging that the open-circuit test of the pad group to be tested does not pass;
if the bonding pad group to be tested has a short-circuit connection relation, judging whether the resistance value is less than or equal to the maximum resistance value corresponding to the bonding pad group to be tested; if so, judging that the short-circuit test of the pad group to be tested passes, otherwise, judging that the short-circuit test of the pad group to be tested does not pass.
6. The test method of claim 1, further comprising:
if the open-circuit short-circuit tests of all the bonding pad groups in the to-be-tested packaging body pass, classifying the to-be-tested packaging body into good products, and updating the number of the good products;
and if the open-circuit short-circuit test of at least one pad group in the to-be-tested packaging body fails, classifying the to-be-tested packaging body into defective products, and updating the number of the defective products.
7. The test method of claim 6, further comprising:
receiving a request for checking good product information and defective product information;
and displaying the good product information and the defective product information.
8. The test method according to claim 6,
if the open-circuit short-circuit test of at least one pad group in the to-be-tested packaging body does not pass, an alarm prompt is sent before or after the to-be-tested packaging body is classified as a defective product.
9. A package open-circuit short-circuit test device, comprising:
a memory, a processor and a multi-relay test board, wherein the processor is coupled to the memory and the multi-relay test board, respectively, the processor, the memory and the multi-relay test board operatively cooperate to implement the test method of any one of claims 1-8.
10. The test device of claim 9,
the testing device comprises a single chip microcomputer, and the single chip microcomputer comprises the processor and the memory; and/or the presence of a gas in the gas,
the test device further comprises: the display is coupled with the processor and used for displaying the test result; the alarm unit is coupled with the processor and used for sending out an alarm prompt when the test fails.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010420949.2A CN113687262A (en) | 2020-05-18 | 2020-05-18 | Method and device for testing open circuit and short circuit of packaging body |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010420949.2A CN113687262A (en) | 2020-05-18 | 2020-05-18 | Method and device for testing open circuit and short circuit of packaging body |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113687262A true CN113687262A (en) | 2021-11-23 |
Family
ID=78575597
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010420949.2A Pending CN113687262A (en) | 2020-05-18 | 2020-05-18 | Method and device for testing open circuit and short circuit of packaging body |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113687262A (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05259238A (en) * | 1992-03-16 | 1993-10-08 | Fujitsu Ltd | Testing device for ic package |
| CN1566975A (en) * | 2003-06-23 | 2005-01-19 | Oht株式会社 | Examination apparatus and examination method |
| CN101799507A (en) * | 2009-02-10 | 2010-08-11 | 迈克珂来富株式会社 | Printed circuit board testing device and testing method |
| US20110204910A1 (en) * | 2008-11-14 | 2011-08-25 | Teradyne, Inc. | Method and apparatus for testing electrical connections on a printed circuit board |
| CN103954877A (en) * | 2014-04-15 | 2014-07-30 | 京东方科技集团股份有限公司 | Integrated circuit testing method and device |
| KR101662245B1 (en) * | 2016-03-18 | 2016-10-04 | (주) 에이블리 | Device interface apparatus of automatic test equipment and operating method thereof |
-
2020
- 2020-05-18 CN CN202010420949.2A patent/CN113687262A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05259238A (en) * | 1992-03-16 | 1993-10-08 | Fujitsu Ltd | Testing device for ic package |
| CN1566975A (en) * | 2003-06-23 | 2005-01-19 | Oht株式会社 | Examination apparatus and examination method |
| US20110204910A1 (en) * | 2008-11-14 | 2011-08-25 | Teradyne, Inc. | Method and apparatus for testing electrical connections on a printed circuit board |
| CN101799507A (en) * | 2009-02-10 | 2010-08-11 | 迈克珂来富株式会社 | Printed circuit board testing device and testing method |
| CN103954877A (en) * | 2014-04-15 | 2014-07-30 | 京东方科技集团股份有限公司 | Integrated circuit testing method and device |
| KR101662245B1 (en) * | 2016-03-18 | 2016-10-04 | (주) 에이블리 | Device interface apparatus of automatic test equipment and operating method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN100473997C (en) | False pin soldering test device and method | |
| CN103367189B (en) | Test system and test method thereof | |
| US7215132B2 (en) | Integrated circuit and circuit board | |
| US8036848B2 (en) | Semiconductor wafer testing apparatus and method of testing semiconductor wafer | |
| CN113866612A (en) | Aging test board and aging test equipment | |
| CN113687262A (en) | Method and device for testing open circuit and short circuit of packaging body | |
| CN113049946A (en) | Board card test system | |
| CN112630621A (en) | Pin short circuit detection circuit and detection method | |
| CN105575836A (en) | Test device | |
| US9097758B2 (en) | Connection quality verification for integrated circuit test | |
| CN202929164U (en) | Testing arrangement and probe structure thereof | |
| CN211785939U (en) | Chip testing device | |
| CN113945826A (en) | Electronic board card testing method and device and medium | |
| CN102171579A (en) | Integrated circuit device | |
| CN112540251A (en) | Intelligent power module testing device and system | |
| CN216595410U (en) | Testing device for testing two kinds of packaged chips | |
| CN110542825A (en) | testing equipment and testing method for wiring integrity of product | |
| CN113451167B (en) | Packaging test method and device and electronic equipment | |
| CN112106028A (en) | Integrity monitoring peripheral for microcontroller and processor input/output pins | |
| US20230358784A1 (en) | Method and apparatus for testing a semiconductor device | |
| CN220574073U (en) | Chip screening device and chip screening system | |
| CN111370390A (en) | Compatible multi-package chip and test method thereof | |
| CN212723204U (en) | Test circuit board and test system | |
| CN219285339U (en) | Aging testing device | |
| CN114325547B (en) | Detection device and method for ATE (automatic test equipment) test channel |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |