CN1566975A - Examination apparatus and examination method - Google Patents
Examination apparatus and examination method Download PDFInfo
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- CN1566975A CN1566975A CN 03147702 CN03147702A CN1566975A CN 1566975 A CN1566975 A CN 1566975A CN 03147702 CN03147702 CN 03147702 CN 03147702 A CN03147702 A CN 03147702A CN 1566975 A CN1566975 A CN 1566975A
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Abstract
This invention is aimed to provide a reliable inspection apparatus and method for short circuit of conductor pattern of different specification. It is to orderly scan the inspection positions of conductor pattern with needle size less than distance between conductor pattern; the locate the inspection parts of the conductor pattern to the backside of the conductor pattern to be inspected; to put ac inspection signal from ac power 35 to needle 30 and form capacitance coupling from one electrode with one electrode and another electrode with inspection part; to enlarge the inspection signal from inspection part by use of amplifier 25; to examine the inspection signal and to judge whether the conductor pattern of the inspection signal is short circuit according to the voltage level of the inspection is or not different from those in normal status.
Description
Technical field
The present invention relates to the testing fixture and the inspection method of the short circuit of check circuit substrate figure.
Background technology
When making circuit substrate, on circuit substrate, form conductive pattern, be necessary to check in formed conductive pattern, whether to break or short circuit.
In the past, as the inspection method of conductive pattern, the known inspection method that contact is arranged, promptly by making two end in contact of lead-in wire and conductive pattern, from the lead-in wire of an end electric signal is flowed to conductive pattern, and receive this electric signal, thereby carry out the continuity test of conductive pattern from the lead-in wire of the other end.The power supply of electric signal is by metal probe being stood on whole terminals, makes electric current flow through that conductive pattern carries out thus.
Yet in recent years, because the densification of conductive pattern makes the line pitch that connects usefulness very fine and closely woven, this spacing can be lower than 50 microns.The probe card manufacturing cost height that constitutes by a plurality of probes of thin space.
Simultaneously, for each different line pattern (each checks object), must make probe card according to line pattern.Therefore, the cost height, this becomes the big obstacle that reduces the electronic unit cost.
In addition, the probe card fragility of microtexture usually needs to consider damaged danger during actual the use.
Summary of the invention
The present invention is for the problems referred to above that solve prior art propose, and its objective is that provide can be with the meticulous line pattern of simple structure detection, and testing fixture that can be corresponding with the change of line pattern and inspection method.In order to reach this purpose, first feature of testing fixture of the present invention has following array structure.
That is: it is characterized by, have: size is the following inspection signal feeding terminal of disposition interval width of the inspection object conductive pattern of circuit substrate at least; The scanister that makes above-mentioned inspection signal feeding terminal crosscut check the inspection position of object conductive pattern and sequentially scan; Size is the above detector parts of three spacing widths of the disposition interval of above-mentioned inspection object conductive pattern at least; Signal processing apparatus, at the back position of the above-mentioned inspection object conductive pattern that above-mentioned detector parts is configured in the foregoing circuit substrate is under the state at place, the back side, above-mentioned inspection signal feeding terminal position at least, the inspection signal is delivered to the above-mentioned inspection signal feeding terminal that above-mentioned scanister scans, detect the signal that sends by above-mentioned detecting device simultaneously; Whether the signal level with the signal level that detects according to said signal processing device during with normal condition different judges the conductive pattern judgment means of short circuit whether of sending into the inspection signal.
In addition, in second feature of testing fixture of the present invention, be characterized as, above-mentioned detector parts is the electrode with whole surface size of the inspection object's position opposing face of checking the object conductive pattern, with above-mentioned inspection object conductive pattern as counter electrode, and be configured in regularly under the state of capacitive coupling position, detect signal from above-mentioned inspection object conductive pattern.
In the 3rd feature of testing fixture of the present invention, be characterized as, above-mentioned judgment means, the detection signal level of the above-mentioned detector parts with above-mentioned inspection object conductive pattern when single are relatively, when detection signal level is high, judge this inspection object conductive pattern and adjacent line pattern short circuit.
In addition, as the 4th feature of the present invention, be inspection method, a kind of inspection method of testing fixture, this testing fixture has: size is the following inspection signal feeding terminal of disposition interval width of the inspection object conductive pattern of circuit substrate at least; Size is the above detector parts of three spacing widths of disposition interval of the conductive pattern of above-mentioned inspection object at least; It is characterized by, above-mentioned detector parts be configured in the foregoing circuit substrate above-mentioned inspection object conductive pattern back position be the back side, the position place of above-mentioned inspection signal feeding terminal at least, make above-mentioned inspection signal feeding terminal crosscut check the inspection position of object conductive pattern, scan successively, to check that signal delivers to above-mentioned inspection signal feeding terminal, detect the signal that above-mentioned detecting device sends, whether the signal level according to detection signal level during with normal condition is different, judges the above-mentioned whether short circuit of conductive pattern of checking signal of sending into.
As the 5th feature of the present invention, it is inspection method, be characterized as, above-mentioned detector parts is the electrode with whole surface size of the inspection object's position opposing face of checking the object conductive pattern, with above-mentioned inspection object conductive pattern as counter electrode, and be configured in regularly under the state of capacitive coupling position, detect signal from above-mentioned inspection object conductive pattern.
In addition, as the 6th feature of the present invention, it is inspection method, be characterized as, above-mentioned send into check signal conductive pattern whether the judgement of short circuit be following judgement: the detection signal level of the above-mentioned detector parts with above-mentioned inspection object conductive pattern when single is relatively, when detection signal level is high, judge this inspection object conductive pattern and adjacent line pattern short circuit.
Description of drawings
Fig. 1 is the figure of the inspection principle of the preferred embodiment of explanation testing fixture of the present invention.
Fig. 2 is the figure of check result example that is used to illustrate the preferred embodiment of testing fixture of the present invention.
Fig. 3 is the equivalent circuit figure of testing fixture of the preferred embodiment of testing fixture of the present invention.
Fig. 4 is the block scheme of the concrete structure of explanation testing fixture of the present invention.
Fig. 5 is the process flow diagram of step of preferred embodiment that is used to illustrate the inspection method of testing fixture of the present invention.
The figure of the inspection example when Fig. 6 has short circuit for splicing ear portion place on the left of representing in the testing fixture of the present invention.
The figure of the inspection example when Fig. 7 has short circuit for the central portion splicing ear portion place that represents testing fixture of the present invention.
Embodiment
Below, with reference to accompanying drawing, describe the structure and the step of the preferred embodiment of testing fixture of the present invention and inspection method in detail.
In addition, the present invention is not limited to relative configuration, numerical value of the structural detail of following explanation etc., particularly, if there is not specific explanation, will not constitute limiting the scope of the invention.
As the preferred embodiment of testing fixture of the present invention, the testing fixture of the short circuit of the line pattern of checking LCD panel is described.
At first, with reference to Fig. 1-Fig. 3, the principle of the inspection method of conductive pattern of the present invention is described.Fig. 1 is the figure of explanation inspection principle, and Fig. 2 is the figure of explanation check result example, and Fig. 3 is the equivalent circuit figure that is used to illustrate the testing fixture principle.
In Fig. 1, object substrate is checked in reference number 10 expressions, in the preferred embodiment, has the LCD panel of roughly the same graphics shape as object with each line pattern.In the following description, the situation of the display board of using with the display of checking mobile phone describes as object lesson.Label 11 expression downside glass substrates, 12 expression upside glass substrates are being formed with line pattern on the composition surface separately.By upside glass substrate 12 and downside glass substrate 11 are fitted, form liquid crystal board 10.
In addition, the bottom of Fig. 1 is illustrated in the liquid crystal board 10 under the state after upside glass substrate 12 and 11 applyings of downside glass substrate.Here, simple in order to illustrate, only represented the line pattern 15 of minority on the liquid crystal board 10 of bottom, in fact disposed tens or splicing ear more than it with fine spacing.
Like this, will check that signal be delivered to from the interchange that exchanges power supply 35 and check signal feeding terminal (probe) 30, by with supply with the conductive pattern 15 of checking signal as an electrode and detector parts 20 as another electrode, form capacitive coupling.Utilize amplifier 25 to amplify the detection signal that sends from detector parts 20 again, signal is checked in investigation.
The test example of the detector parts 20 of checking signal is described referring now to Fig. 2.
In the time will checking that signal is delivered to line pattern, by by one width checking signal supply lines figure, be separated by substrate 10 and the detector parts 20 that is positioned at substrate 10 back sides with the electrostatic capacitance that part constituted of checking that signal supply lines figure 15 is relative, alternating current is delivered to amplifier 25.Therefore, from the output terminal of amplifier 25, export given alternating voltage.This voltage is mainly determined with areas detector parts 20 relative positions by checking that the signal supply lines is figure.
For example, as liquid crystal board etc.,, roughly the same with the formed electrostatic capacitance of part relative of detector parts 20 with checking signal supply lines figure 15 when adjacent line pattern during all with identical spacing configuration.As a result, do not having shown in (A),, each line pattern to be obtained the signal of roughly the same level under the situations such as short circuit as testing result.
On the other hand, as shown in Figure 2, part at line pattern has under the situation of short circuit, becomes following state: exchange the inspection signal and not only deliver to inspection signal feeding terminal (probe) 30 line patterns that contacted of having supplied with interchange inspection signal, and deliver to the line pattern part of short circuit.
Fig. 3 represents the general equivalent circuit of the testing fixture of the preferred embodiment.As shown in Figure 3, be in the state of connection, under the situation that probe 30 moves at the opposite side terminal place of capacitor, be in the line pattern that just probe contacted of status of electrically connecting with amplifier 25 at all ends of the detector parts 20 that forms capacitor department.
Therefore, the line pattern area relative with detector parts 20 is the area of the roughly twice of a line pattern under the normal condition.Like this, compare with the situation that does not have short circuit, the output of amplifier 25 increases significantly, and pick-up unit in this case is shown in figure (B).
Shown in (B), because the level of detection signal significantly increases, therefore, in the output of monitoring amplifier 25, under the situation that detection signal increases significantly, can judge this position short circuit with the normal condition comparison.Like this, utilize simple structure,, also can detect substandard products reliably even without the special location of probe.
As the example of present embodiment, be under the situation of roughly the same figure at each line pattern, because for each figure in the line pattern, the output of amplifier 25 is roughly the same, therefore can set certain threshold value.When surpassing this threshold value, can judge this position short circuit.
In addition, the figure of the junction of line pattern, though between relatively more contiguous figure is uniform, even but under the situation that the graphics shape of each figure is very different, utilize the inspection method of present embodiment, also can judge easily whether figure is good by simple control.
That is: in this case, in this case, on normal inspection substrate, carry out the scanning of probe in advance, will store as the standard check result for the testing result of checking signal; Inspection substrate testing result with actual detection result and this storage compares again, for example when error within the specific limits the time, is judged as good product; And when the check result of checking the object figure surpasses certain limit, be judged as substandard products.
Even in this case, do not need yet and will check that probe is positioned on the fixed position of each figure in each figure, each checks figure only to need crosscut simply, scans, and can obtain reliable short circuit result.
The following configuration example that the concrete testing fixture of realizing above-mentioned inspection method is described with reference to Fig. 4.Fig. 4 illustrates the configuration example of the testing fixture of the inspection method that realizes present embodiment.
Among Fig. 4, the structure identical with Fig. 1 represented with identical label.In Fig. 4, will be placed on as the liquid crystal board 10 of checking object and check on the position, detector parts 20 is placed and is fixed on the back position place of the liquid crystal board 10 corresponding with the splicing ear portion allocation position of the inspection object line pattern of liquid crystal board 10.
The detection signal that will send from detector parts 20 is delivered to analog signal processing circuit 50.To deliver to control part 60 by the simulating signal that analog signal processing circuit 50 has carried out analog signal processing, can judge whether the line pattern that contacts with inspection signal feeding terminal 30 of liquid crystal board 10 is good.Control part 60 also checks that to checking that signal is delivered to signal feeding terminal 30 controls.
Check the mode of signal feeding terminal 30 according to the line pattern feeding terminal portion of crosscut liquid crystal board 10 grades, move on the scan edge limit, to check that successively signal delivers to each line pattern, the parts of (checking the graphic width and the following size of figure spacing of figure) below the figure spacing that its leading section uses is for example that flexual tungalloy is made by having, check the object figure.For example, the diameter of wire of base portion is 150 microns, and the diameter of front end (sweep test) is taken as 15 microns, can be that 30 microns line pattern, figure spacing is that base plate line figure about 20 microns is checked to checking the object graphic width.
Mechanical arm controller 70 utilizes the control of control part 60, control scaler mechanical arm 80.Scaler mechanical arm 80 is when being placed on liquid crystal board 10 the inspection position and clamping, control according to mechanical arm controller 70, the leading section of checking signal feeding terminal 30 is keeping with all the splicing ear state of contact with liquid crystal board 10, and front end scans according to the mode of all splicing ears of crosscut successively.
Analog signal processing circuit 50 has: the amplifier 51 that amplifies the detection signal that sends from detector parts 20, be used for removing the noise composition of the detection signal that amplifies through amplifier 51 and make the bandpass filter 52 of checking that signal passes through, to the rectification circuit 53 that the signal that sends from bandpass filter 52 carries out full-wave rectification, make the level and smooth smoothing circuit 54 of detection signal after rectification circuit 53 full-wave rectifications.
The whole testing fixture of control part 60 control present embodiments, it has: computing machine (CPU) 61, the ROM62 of the controlled step of storage CPU61 etc., the RAM63 of the treated information of temporary transient storage CPU61 etc., the simulating signal of analog signal processing circuit 50 is transformed to the A/D converter 64 of corresponding digital signal, the inspection signal that should send is supplied with the signal supply unit 65 of inspection signal feeding terminal 30 and the display part 66 of demonstration check result or operation indication guide etc.
Signal supply unit 65 for example generate signal level be the sine wave signal of 10Vp-p, 100KHZ as checking signal, and give and check signal feeding terminal 30.In this case, bandpass filter 52 is bandpass filter that the 100KHZ of this inspection signal is passed through.
Following process flow diagram explanation with reference to Fig. 5 has the inspection method of the preferred embodiment of said structure.Fig. 5 represents to be used to illustrate the process flow diagram of the inspection method of preferred embodiment.
At first, in step S1, will be installed on the inspection position of testing fixture as the liquid crystal board 10 of checking object.Then, in step S2, expression is checked that the NG sign that bad position is arranged in the object figure resets, expression is checked the sign n that do not fix a number of object line pattern is changed to " 1 ", thereby whether good judgement is provided with according to carrying out initial line pattern.Like this, check that beginning preliminary work finishes, then in step S3, the input of the sign on of beginning is checked in control part 60 wait expressions.
In step S3, when beginning to indicate, enter step S4, indication mechanical arm controller 70, control scaler mechanical arm 80 makes and checks signal feeding terminal (probe) 30, moves to the inspection starting position (the splicing ear position of an end) of the splicing ear of checking the object line pattern.
Secondly, in step S5, initiating signal supply unit 65 will check that signal exports inspection signal feeding terminal (probe) 30 to.Leading section with check the situation that the object line pattern contact under, keep inspection signal from signal supply unit 65 to this figure transmission, condition of supplying.Simultaneously, starting analog signal processing circuit 50 begins to read in the signal that is sent by detector parts 20.After, until the end of scan, at regular intervals, take out successively and detect data, sequentially be stored among the RAM63 again.
When making when checking that signal feeding terminal (probe) 30 is being checked the end of scan on all line patterns that will check of object substrate, enter step S7, signal supply unit 65 is quit work.In addition, carry out the whether good judgment processing of line pattern till going to from step S8 to step S16.
At first, in step S8, read the detection magnitude of voltage of the detector parts 20 when checking that signal is supplied with n line pattern.If initial, read and to check the detection magnitude of voltage of the detector parts 20 of signal supply under the situation of the line pattern of scanning starting position.
Then, in step S9, the detection voltage (output voltage) of the examination detector parts 20 of reading the whether detection level with normal condition the time is more than the prescribed threshold of benchmark.When being no more than the threshold values of regulation, this line pattern is normal, can enter step S12.
On the other hand, in step S9, when the detected signal value of detector parts 20 when the threshold values of regulation is above, enter step S10, judge n (be somebody's turn to do) line pattern and for example adjacent line pattern short circuit.Then, in step S11, set the NG sign, enter step S16.
In step S12, examination n sign judges that n indicates the last line pattern of whether representing the line pattern that should check.Under the complete inspection object line pattern situation whether good judgement does not have to finish to a liquid crystal board 10, enter step S13, carry out the next whether good judgment mode and the n sign is increased an increment of object line pattern of checking according to making n=n+1, get back to step S8.
On the other hand, in step S12, in the end check under the object line pattern situation whether good judgement finishes, enter step S16.
In step S16, show check result.Examination NG indicates that under the situation that is set with the NG sign, this checks that liquid crystal board 10 is the NG sign that produces the bad plate of short circuit to show expression by display part 66; Under the situation of not setting the NG sign, show that then this liquid crystal board of expression is qualified sign OK.
Secondly, at step S17, from device, take out liquid crystal board.Then, in step S18, whether the inspection of examination liquid crystal board finishes.When liquid crystal board that the next one will be checked, get back to step S1, lay next liquid crystal board.
On the other hand, in step S18, finish then this processing end if check.
In the above description, be that example is illustrated liquid crystal board to be installed among each comfortable step S1 and in step S16, to take out liquid crystal board respectively; But present embodiment is not to only limit to above-mentioned example.For example, can automatically carry out the installation and the taking-up of liquid crystal board,, automatically liquid crystal board is placed on that certified products are accommodated part or substandard products are accommodated in the part according to the judgement whether good to the liquid crystal board that takes out.
In addition, when in the part of production line, comprising this inspection operation, can check the liquid crystal board of sending here with the upstream, only certified products are delivered to the downstream.
As above, when checking liquid crystal board 10, the detection time of the inspection signal when detecting the substandard products liquid crystal board as shown in Figure 6 and Figure 7.Fig. 6 is illustrated in the figure that there is the detection example of short-circuit conditions at splicing ear portion place, left side, and Fig. 7 is illustrated in the figure that there is the detection example of short-circuit conditions at central splicing ear portion place.
In the example of Fig. 6 and Fig. 7, be illustrated in right side and left side disposed the big slightly splicing ear portion of figure spacing, in the check result of the liquid crystal board of the narrow slightly splicing ear portion of central portion configuration figure spacing.
In this preferred embodiment, even the spacing difference of the line pattern that will check like this for example, do not need to control especially yet, only need make simply check probe scanning position reliably crosscut check that the figure of object scans the just short circuit of detection line figure reliably.In addition, because it is very obvious to become the difference of detection signal level just often that detect to judge object and the detection signal level when unusual, therefore can obtain the high check result of reliability.
In Fig. 6 and Fig. 7, (A) waveform shown in is represented the whole time for the inspection signal detecting result of checking object; (B) for amplifying the detection waveform of representing to detect unusual splicing ear group; (C) partly be the waveform example of the detection signal at center for expression with short circuit.
For example, a scale on the transverse axis is 500 milliseconds (ms) in (A), is 100ms in (B), is 10ms in (C).As shown in Figure 6 and Figure 7, since the detection waveform of short circuit part and normal part to detect different wave shape bigger, therefore, value after 1/2nd (1/2) value of the difference of detection signal that can be with the time and the average detected level addition just often just often with short circuit, be set at the threshold values of whether short circuit, can detect short circuit reliably.
In addition, in the above description, be to collect to check the check result of object figures from all of an inspection substrate, judge whether substrate is good; This is because begin to judge operation after all the testing result collection is over, and does not also need the oversize processing time, for example, also may be controlled to each check result from drawing, and judges whether short circuit one by one.In this case, when in checking process, having detected short circuit, can end later scan control, directly travel to following processing, to reduce the supervision time as bad object substrate.
As mentioned above, adopt the structure and the step of this preferred embodiment, do not need to be positioned to check object line pattern splicing ear each and make it to contact with checking lead-in wire, only need checking the enterprising line scanning of object figure simply, short circuit that promptly can the detection line figure, therefore testing fixture is simple, simultaneously, and the reliability height of inspection.
In addition, when checking, owing to only need for example splicing ear portion of scanography object figure sequentially, even for example change to check the figure configuration state of object figure, do not need to check the correct location of lead-in wire etc. yet, only need gated sweep route simply, even complex circuit, check irregular the differing of figure spacing of object figure, also do not need complicated positioning control, can check the short circuit of line pattern.
For example,,, make コ font motion scan, promptly can easily check the short circuit of all figures along splicing ear even when the splicing ear of checking line pattern press the line pattern of substrate of コ font configuration, also only need make inspection signal feeding terminal simply.
The present invention only limits to structure of the foregoing description and step, in the scope that does not depart from spirit of the present invention, can do various changes.
For example, as mentioned above, have the width of the splicing ear portion that can cover all inspection object line patterns of checking object substrate, for example be that the example of rectangular battery lead plate, fixed configurations illustrates with detector parts 20.But the present invention only limits to above-mentioned example, for example, also can be made of the battery lead plate of several spacing sizes of checking the object line pattern, scans with the scan-synchronized ground of checking the signal feeding terminal.In this case, preferably can cover the size of the adjacent at least line pattern of checking the object figure.
Utilize the present invention,, can detect the short circuit of the conductor fig of all size reliably by simple and easy control.
In addition, utilize the present invention, provide and use simple structure, detect meticulous line pattern and testing fixture and inspection method that also can be corresponding with the change of line pattern.
Claims (8)
1. a testing fixture is characterized by, and it has:
Size is the following inspection signal feeding terminal of disposition interval width of the inspection object conductive pattern of circuit substrate at least;
The scanister that makes described inspection signal feeding terminal crosscut check the inspection position of object conductive pattern and sequentially scan;
Size is the above detector parts of three spacing widths of the disposition interval of described inspection object conductive pattern at least;
Signal processing apparatus, the back position of the described inspection object conductive pattern that described detector parts is configured in described circuit substrate be under the state at place, the back side, described inspection signal feeding terminal position at least, will check that signal delivers to the described inspection signal feeding terminal of described scanister scanning; Detect the signal that sends by described detector parts simultaneously; With
Whether the signal level of the signal level that detects according to described signal processing apparatus during with normal condition different judges the conductive pattern judgment means of short circuit whether of sending into the inspection signal
2. testing fixture as claimed in claim 1, it is characterized by, described detector parts is the electrode with whole surface size of the inspection object's position opposing face of checking the object conductive pattern, with described inspection object conductive pattern as counter electrode, and be configured in regularly under the state of capacitive coupling position, detect signal from described inspection object conductive pattern.
3. testing fixture as claimed in claim 1, it is characterized by, described judgment means, the detection signal level of the described detector parts with described inspection object conductive pattern when single are relatively, when detection signal level is high, judge this inspection object conductive pattern and adjacent line pattern short circuit.
4. testing fixture as claimed in claim 2, it is characterized by, described judgment means, the detection signal level of the described detector parts with described inspection object conductive pattern when single are relatively, when detection signal level is high, judge this inspection object conductive pattern and adjacent line pattern short circuit.
5. the inspection method of a testing fixture, this testing fixture has: size is the following inspection signal feeding terminal of disposition interval width of the inspection object conductive pattern of circuit substrate at least; Size is the above detector parts of three spacing widths of disposition interval of the conductive pattern of described inspection object at least; It is characterized by,
Described detector parts be configured in described circuit substrate described inspection object conductive pattern back position be the back side, the position place of described inspection signal feeding terminal at least, make described inspection signal feeding terminal crosscut check the inspection position of object conductive pattern, scan successively, to check that signal delivers to described inspection signal feeding terminal, detect the signal that described detecting device sends, whether the signal level according to detection signal level during with normal condition is different, judges the described whether short circuit of conductive pattern of checking signal of sending into.
6. inspection method as claimed in claim 5, it is characterized by, described detector parts is the electrode with whole surface size of the inspection object's position opposing face of checking the object conductive pattern, with described inspection object conductive pattern as counter electrode, and be configured in regularly under the state of capacitive coupling position, detect signal from described inspection object conductive pattern.
7. inspection method as claimed in claim 5, it is characterized by, described send into check signal conductive pattern whether the judgement of short circuit be, the detection signal level of the described detector parts with described inspection object conductive pattern when single relatively, when detection signal level is high, judge this inspection object conductive pattern and adjacent line pattern short circuit.
8. inspection method as claimed in claim 6, it is characterized by, described send into check signal conductive pattern whether the judgement of short circuit be, the detection signal level of the described detector parts with described inspection object conductive pattern when single relatively, when detection signal level is high, judge this inspection object conductive pattern and adjacent line pattern short circuit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 03147702 CN1566975A (en) | 2003-06-23 | 2003-06-23 | Examination apparatus and examination method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 03147702 CN1566975A (en) | 2003-06-23 | 2003-06-23 | Examination apparatus and examination method |
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| CN1566975A true CN1566975A (en) | 2005-01-19 |
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| CN 03147702 Pending CN1566975A (en) | 2003-06-23 | 2003-06-23 | Examination apparatus and examination method |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103499760A (en) * | 2013-09-24 | 2014-01-08 | 西安电子工程研究所 | Stitch-based line connection relation scanning method |
| CN107064706A (en) * | 2015-12-22 | 2017-08-18 | Oht株式会社 | Conductor patterns check device |
| TWI660181B (en) * | 2014-06-02 | 2019-05-21 | 日商日本電產理德股份有限公司 | Substrate inspecting apparatus and substrate inspecting method |
| CN112689768A (en) * | 2018-09-14 | 2021-04-20 | 泰瑞达公司 | Method and apparatus for wire bonding testing in integrated circuits |
| CN113687262A (en) * | 2020-05-18 | 2021-11-23 | 天芯互联科技有限公司 | Method and device for testing open circuit and short circuit of packaging body |
-
2003
- 2003-06-23 CN CN 03147702 patent/CN1566975A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103499760A (en) * | 2013-09-24 | 2014-01-08 | 西安电子工程研究所 | Stitch-based line connection relation scanning method |
| TWI660181B (en) * | 2014-06-02 | 2019-05-21 | 日商日本電產理德股份有限公司 | Substrate inspecting apparatus and substrate inspecting method |
| CN107064706A (en) * | 2015-12-22 | 2017-08-18 | Oht株式会社 | Conductor patterns check device |
| CN107064706B (en) * | 2015-12-22 | 2019-07-30 | Oht株式会社 | Conductor patterns check device |
| CN112689768A (en) * | 2018-09-14 | 2021-04-20 | 泰瑞达公司 | Method and apparatus for wire bonding testing in integrated circuits |
| CN113687262A (en) * | 2020-05-18 | 2021-11-23 | 天芯互联科技有限公司 | Method and device for testing open circuit and short circuit of packaging body |
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Open date: 20050119 |