JPH0525742U - Semiconductor device - Google Patents

Abstract

(57) [Abstract] [Purpose] The number of parts mounted on the circuit board is reduced, and the density of the mounted circuit board can be increased. Further, the design cost and mounting cost of the mounted circuit board are reduced, and Product reliability is improved and current consumption is reduced. [Structure] An external terminal 14a of a plurality of external terminals 14 is connected to a power supply line 15, and the power supply line 15 is further connected to a voltage application terminal of an integrated circuit 13. In addition, the ground end of the integrated circuit 13 is connected to the external terminal 14 through the ground line 16.
It is connected to b. Power line 15 and ground line 16
The bypass capacitor 11 is connected between the and. Bypass capacitor 11 and integrated circuit 1 connected in this way
3 and 3 are enclosed and arranged in one package 12.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to a semiconductor device which is surface-mounted on a circuit board of an electronic device.

[0002]

[Prior Art]

 FIG. 5 shows a configuration of a mounted circuit board using a conventional semiconductor device.

In FIG. 5, 1 is a plurality of integrated circuits as semiconductor devices, 2 is a circuit board for surface-mounting the plurality of integrated circuits 1, and 3 is connected to respective power supply lines (not shown) of the plurality of integrated circuits 1. And a plurality of bypass capacitors for removing unnecessary signals.

Next, the operation of this configuration will be described. By arranging the bypass capacitors 3 around each integrated circuit 1 and connecting them to the power supply line, unnecessary signals are removed, minute fluctuations in the power supply voltage are prevented, and the integrated circuit 1 operates stably. To do.

[0005]

[Problems to be solved by the device]

 However, in the mounted circuit board of the conventional example, the bypass capacitor 3 is a separate body from the integrated circuit 1, and since the bypass capacitor 3 is arranged in the periphery of each of the integrated circuits 1, its area is required, and the mounting circuit board is made higher in density. Will be a hindrance. Further, the design cost of the mounting circuit board for disposing the bypass capacitor 3 and the mounting cost increase, and the product reliability decreases due to the increase in the number of parts. Further, there is a problem that the current consumption of the entire circuit increases due to the increase in the number of connecting lines between the bypass capacitor 3 and the integrated circuit 1. The present invention solves such conventional problems, enables higher density of the mounting circuit board, reduces the design cost and mounting cost of the mounting circuit board, and reduces the product cost. It is an object of the present invention to provide an excellent semiconductor device with improved reliability and reduced current consumption.

[0006]

[Means for Solving the Problems]

 In order to achieve this object, the semiconductor device of the present invention comprises an integrated circuit, a bypass capacitor connected to the integrated circuit for removing unnecessary signals, and an outer package enclosing the integrated circuit and the bypass capacitor. And with.

[0007]

[Action]

 Therefore, according to the semiconductor device of the present invention, since the bypass capacitor and the integrated circuit are enclosed and arranged in the same package, the number of parts mounted on the circuit board is reduced, and the higher density of the mounted circuit board is achieved. In addition, the design cost and mounting cost of the mounting circuit board can be reduced, the product reliability can be improved, and the current consumption can be reduced.

[0008]

【Example】

 An embodiment of the semiconductor device of the present invention will be described below with reference to the drawings.

FIG. 1 shows the configuration of the embodiment. In FIG. 1, 11 is a bypass capacitor, which is enclosed in a package 12, which is an outer package. Reference numeral 13 denotes an integrated circuit which is arranged in parallel in the package 12 together with the bypass capacitor 11 and sealed, and 14 denotes a plurality of external terminals. The external terminal 14a of the plurality of external terminals 14 is connected to a power supply line 15 composed of a pattern and a bonding wire, and the power supply line 15 is connected to a voltage application terminal of the integrated circuit 13. Further, the ground end of the integrated circuit 13 is connected to the external terminal 14b through a ground line 16 composed of a pattern and a bonding wire. The bypass capacitor 11 is connected between the power supply line 15 and the ground line 16.

Next, the operation of this configuration will be described. The bypass capacitor 11 connected between the power supply line 15 and the ground line 16 removes an unnecessary signal, prevents minute fluctuations in the power supply voltage, and stabilizes the integrated circuit 1.

FIG. 2 shows the configuration of another embodiment. In FIG. 2, reference numeral 21 is a bypass capacitor, which is enclosed in a package 22. Reference numeral 23 denotes an integrated circuit in which the bypass capacitor 21 is arranged and which is enclosed in the package 22, and 24 denotes a plurality of external terminals. The external terminal 24a of the plurality of external terminals 24 is connected to a power supply line 25 composed of a pattern and a bonding wire, and the power supply line 25 is connected to a voltage application terminal of the integrated circuit 23. Furthermore, the ground end of the integrated circuit 23 is connected to the external terminal 24b through a ground line 26 formed of a pattern and a bonding wire. Further, the bypass capacitor 21 is connected between the power supply line 25 and the ground line 26. The operation of this other embodiment is similar to that of the embodiment shown in FIG.

FIG. 3 shows a modification of the other embodiment shown in FIG. 2, in which the bypass capacitor 21 is arranged below the accumulation circuit 23. Other configurations and operations are the same as those of the embodiment shown in FIG. Is the same as.

The cost can be reduced by manufacturing the bypass capacitor 21 arranged above or below the integrated circuit 23 in the same manner as the semiconductor manufacturing process.

FIG. 4 shows a configuration of a mounting circuit board in which the semiconductor device configured as described above is mounted on a circuit board.

In FIG. 4, reference numeral 31 is a plurality of integrated circuits as a semiconductor device, and 32 is a circuit board for surface-mounting the plurality of integrated circuits 31.

As described above, according to the above-described embodiment, since the bypass capacitors 11 and 21 are enclosed and arranged in the packages 12 and 22, the bypass capacitors 11 and 21 are arranged on the circuit board 32 as before. Since it is not necessary to provide a separate bypass capacitor in the vicinity of the integrated circuit 31, it is possible to realize higher density of the mounted circuit board. Furthermore, the design cost and mounting cost of the mounting circuit board for arranging the bypass capacitor are reduced, and the product reliability is improved due to the reduction in the number of parts. In addition, the number of parts to be surface-mounted on the circuit board is reduced and the connecting lines are eliminated, so the current consumption of the entire circuit can be reduced.

[0017]

[Effect of the device]

 As is clear from the above description, in the semiconductor device of the present invention, the bypass capacitor and the integrated circuit are enclosed and arranged in the same package, so the number of mounting parts of the circuit board is reduced and the mounting circuit board is reduced. In addition, higher density can be achieved, and further, the design cost and mounting cost of the mounted circuit board can be reduced, the product reliability can be improved, and the current consumption can be reduced.

[Brief description of drawings]

FIG. 1 is a block diagram showing a configuration of an embodiment of a semiconductor device of the present invention.

FIG. 2 is a block diagram showing the configuration of another embodiment.

FIG. 3 is a block diagram showing a configuration of a modified example of another embodiment.

FIG. 4 is a configuration diagram of a mounting circuit board in which the semiconductor device of the present invention is mounted on the circuit board.

FIG. 5 is a configuration diagram of a mounting circuit board in which a conventional semiconductor device is mounted on the circuit board.

[Explanation of symbols]

 11 Bypass Capacitor 12 Package 13 Integrated Circuit

Claims (1)

[Scope of utility model registration request] 1. A semiconductor device comprising an integrated circuit, a bypass capacitor connected to the integrated circuit for removing an unnecessary signal, and an exterior body enclosing the integrated circuit and the bypass capacitor.