JPH05190674A - Semiconductor integrated circuit device - Google Patents

Abstract

PURPOSE:To effectively use resources by dividing pads on a chip into two groups, one of which are disposed at upper and lower sides and the other of which are disposed at right and left sides, and connecting the pads having a function for receiving the same input/output signals of the respective groups via wirings. CONSTITUTION:Pads 2 having the similar equal functions are disposed at the upper, lower sides and the right, left sides of a chip 1, and the pads 2 having the same function are connected via wirings 3. For example, in the case where a package 4 has leads 5 disposed at right and left sides on the chip 1, the pads 2 disposed at the right and left sides on the chip 1 are connected to the leads 5. In the case where a package 4 has leads 5 extended to upper and lower sides, the pads 2 disposed at the upper and lower sides on the chip 1 are used. Accordingly, even if the type of the package for mounting a semiconductor integrated circuit is altered, the chip can be mounted as it is, and labor of newly designing and manufacturing a semiconductor integrated circuit device can be omitted.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor integrated circuit device, and more particularly to the arrangement of external extraction electrodes (hereinafter referred to as pads) on a chip.

[0002]

2. Description of the Related Art FIG. 3A is a plan view showing a mounting state of a conventional semiconductor integrated circuit device on a package.
In the figure, 1 is a chip of a semiconductor integrated circuit device, 2 is a pad arranged on the chip 1, 4 is a package, and 5 is a lead.

As shown in FIG. 1, when a semiconductor integrated circuit device having pads arranged on two sides of a chip is mounted on a package in which leads are led out from two sides, it is easy to bond the leads. Taking into account
The pads on the chip are arranged so as to face the leads of the package.

[0004]

In the above-described conventional semiconductor integrated circuit device, the pads are arranged so as to be easily mounted in a specific package, and therefore, this package is different from this package as shown in FIG. 3B. It was difficult to mount on a package in which the leads are led out to the side. Therefore, when it becomes necessary to mount this semiconductor integrated circuit device in a package having different lead derivation directions, it is necessary to redesign the chip in which the pad arrangement is moved to the adjacent side. This has been a cause of increasing the manufacturing cost.

[0005]

In a semiconductor integrated circuit device according to the present invention, a first group of pads for external extraction are arranged on two opposite sides of a semiconductor substrate, and the two sides adjacent to the opposite two sides are arranged. A second group of pads, each pairing with the first group of pads, is arranged, and the first group of pads and the second group of pads are electrically connected to each other.

[0006]

Embodiments of the present invention will now be described with reference to the drawings. FIG. 1A is a plan view of the first embodiment of the present invention. In the figure, 1 is a chip of a semiconductor integrated circuit device, 2 is a pad for external extraction connected to an internal element, and 3 is a wiring for connecting pads.

As shown in FIG. 1A, in the present invention, the same number of pads having the same function are arranged on the upper and lower sides and the left and right sides of the chip, and the pads having the same function are connected to each other by wiring 3.
Are connected by.

The semiconductor integrated circuit device shown in FIG. 1 (a) is mounted in a package as shown in FIG. 2 (a) or (b). When the package 4 has the leads 5 arranged on the left and right as shown in FIG. 2A, the pads 2 arranged on the left and right on the chip 1 are connected to the leads 5, and In the case of using a package in which the leads 5 shown in (b) are led out vertically, the pads 2 placed above and below the chip 1 are used.

Therefore, in the semiconductor integrated circuit device of this embodiment, the chip can be mounted as it is even if the type of the package for mounting the same is changed, so that the labor for newly designing and manufacturing the semiconductor integrated circuit device is saved. be able to.

1 (b) to 1 (d) show a second embodiment of the present invention.
It is a top view showing a 4th example. In the embodiment shown in FIG. 1A, the package lead arrangement is shown in FIG.
I had to change between (b) and
In the case of the above embodiment, there is an advantage that the lead arrangement of the package does not have to be changed. In the embodiment of FIG. 1C, it is not necessary to intersect the inter-pad connection wiring, and the length of this wiring can be shortened.

[0011]

As described above, in the semiconductor integrated circuit device of the present invention, the pads on the chip are divided into two groups, one arranged on the upper and lower sides and one arranged on the left and right sides, and each group. According to the present invention, since the pads having the function of receiving the same input / output signal are connected by wiring, the same chip can be used even if the lead lead-out direction of the package for mounting the semiconductor integrated circuit device is changed. Can be implemented as is. Therefore, according to the present invention, it is not necessary to newly design and remanufacture the semiconductor integrated circuit device even if the type of the mounting package is changed, so that the resources can be effectively used and the cost can be reduced.

[Brief description of drawings]

FIG. 1 is a plan view of first to fourth embodiments of the present invention.

FIG. 2 is a plan view showing a mounted state of the embodiment of the invention.

FIG. 3 is a plan view showing a mounting state of a conventional example.

[Explanation of symbols]

 1 Chip of semiconductor integrated circuit device 2 Pad 3 Wiring for pad connection 4 Package 5 Lead

Claims (1)

[Claims] 1. A first group of pads for external extraction are arranged on two opposite sides of a semiconductor substrate, and a second pair of pads for the first group is formed on two sides adjacent to the opposite two sides. A semiconductor integrated circuit device in which pads of a group are arranged, and pads of the first group and pads of the second group are electrically connected to each other by a pair of pads.