JPH0252464A - Semiconductor memory device - Google Patents
Semiconductor memory deviceInfo
- Publication number
- JPH0252464A JPH0252464A JP63203640A JP20364088A JPH0252464A JP H0252464 A JPH0252464 A JP H0252464A JP 63203640 A JP63203640 A JP 63203640A JP 20364088 A JP20364088 A JP 20364088A JP H0252464 A JPH0252464 A JP H0252464A
- Authority
- JP
- Japan
- Prior art keywords
- bypass capacitor
- memory device
- semiconductor memory
- container
- semiconductor chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 19
- 239000003990 capacitor Substances 0.000 claims abstract description 16
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- 239000000725 suspension Substances 0.000 abstract 1
- 230000000694 effects Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Lead Frames For Integrated Circuits (AREA)
- Semiconductor Memories (AREA)
Abstract
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、半導体記憶装置に関する。[Detailed description of the invention] [Industrial application field] The present invention relates to a semiconductor memory device.
従来半導体記憶装置は、バイパスコンデンサを内蔵して
いないので、プリント基板に実装する場合は、1個あた
りに必ず1個の電源ラインのバイパスコンデンサを実装
していた。Conventional semiconductor memory devices do not have built-in bypass capacitors, so when they are mounted on a printed circuit board, one power line bypass capacitor is always mounted on each semiconductor memory device.
このなめメモリパッケージを製造する場合には、必ず一
組の半導体記憶装置とバイパスコンデンサを実装しなけ
ればならないので、実装密度が低くなってしまうという
欠点がある。When manufacturing this diagonal memory package, it is necessary to mount one set of a semiconductor memory device and a bypass capacitor, so there is a drawback that the packaging density becomes low.
本発明の半導体記憶装置は、電源端子と接地端子との間
にバイパスコンデンサが挿入されて半導体チップと同じ
容器に封止されているというものである。In the semiconductor memory device of the present invention, a bypass capacitor is inserted between a power supply terminal and a ground terminal, and the semiconductor memory device is sealed in the same container as a semiconductor chip.
次に本発明について図面を参照して説明する。 Next, the present invention will be explained with reference to the drawings.
第1図は本発明の一実施例を示す平面図である。FIG. 1 is a plan view showing one embodiment of the present invention.
この実施例は、半導体チップ6が搭載されたアイランド
5く接地端子3につながっている)と連結する吊りビン
4とその隣りの内部リード21(電源端子2につながっ
ている)にバイパスコンデンサ1が接続され、容器7に
封止されている。半導体チップに比べて容器の方がかな
り大きいので、小型のコンデンサを取りつける余裕は、
多くの場合、十分にある。In this embodiment, a bypass capacitor 1 is connected to a hanging bottle 4 connected to an island 5 on which a semiconductor chip 6 is mounted (connected to a ground terminal 3), and an internal lead 21 next to it (connected to a power supply terminal 2). connected and sealed in the container 7. The container is much larger than the semiconductor chip, so there is plenty of room to install a small capacitor.
Often there is enough.
以上説明したように本発明は半導体記憶装置の内部にバ
イパスコンデンサを内蔵することにより、バイパスコン
デンサを実装する必要がなくなり、製造コストが下る。As explained above, in the present invention, by incorporating a bypass capacitor inside a semiconductor memory device, there is no need to mount a bypass capacitor, and manufacturing costs are reduced.
また電気的特性もバイパスコンデンサがメモリ素子の近
傍に置れるなめ、性能が向上するという利点もある。In addition, since the bypass capacitor can be placed near the memory element, the electrical characteristics also have the advantage of improved performance.
第1図は本発明の一実施例の平面図である。
1・・・バイパスコンデンサ、2・・・電源端子、2・
・・内部リード、3・・・接地端子、4・・・吊りビン
、・アイランド、6・・・半導体チップ、7・・・容器
。FIG. 1 is a plan view of one embodiment of the present invention. 1... Bypass capacitor, 2... Power supply terminal, 2...
...Internal lead, 3...Grounding terminal, 4...Hanging bottle, -Island, 6...Semiconductor chip, 7...Container.
Claims (1)
されて半導体チップと同じ容器に封止されていることを
特徴とする半導体記憶装置。A semiconductor memory device characterized in that a bypass capacitor is inserted between a power supply terminal and a ground terminal and is sealed in the same container as a semiconductor chip.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP63203640A JPH0252464A (en) | 1988-08-15 | 1988-08-15 | Semiconductor memory device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP63203640A JPH0252464A (en) | 1988-08-15 | 1988-08-15 | Semiconductor memory device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0252464A true JPH0252464A (en) | 1990-02-22 |
Family
ID=16477396
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP63203640A Pending JPH0252464A (en) | 1988-08-15 | 1988-08-15 | Semiconductor memory device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0252464A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5404265A (en) * | 1992-08-28 | 1995-04-04 | Fujitsu Limited | Interconnect capacitors |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62210661A (en) * | 1986-03-12 | 1987-09-16 | Hitachi Micro Comput Eng Ltd | Semiconductor device |
-
1988
- 1988-08-15 JP JP63203640A patent/JPH0252464A/en active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62210661A (en) * | 1986-03-12 | 1987-09-16 | Hitachi Micro Comput Eng Ltd | Semiconductor device |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5404265A (en) * | 1992-08-28 | 1995-04-04 | Fujitsu Limited | Interconnect capacitors |
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