JPS59124744A - Semiconductor device - Google Patents

Abstract

PURPOSE:To improve mounting density largely by forming a substrate shaping multilayer wirings to a vertical form, loading elements on both the surface and the back and setting up a capacitor and an electric terminal for an external lead to upper and lower end surfaces, etc. CONSTITUTION:Only LCCs 4 are loaded on the surfaces or the backs occupying a large portion of areas on the substrate 1, and the electric capacitors 5 indispensable to an electric circuit are loaded by utilizing slight sections such as the end surfaces of the upper surfaces, etc. The LCCs 4 and the capacitors 5 are connected electrically through wiring patterns in the substrates 1', and a plurality of the pins 6 fitted to end surfaces such as the lower end surfaces on the substrates 1' are connected electrically to connecting sections for the terminals of a borad or a printed substrate 8 by inserting the substrates 1 under erected states. Density can be increased in response to a bringing to the end surfaces of the substrates of the capacitors 5, and mounting density is improved remarkably in order to mount the substrates on the boad in a vertical form.

Description

DETAILED DESCRIPTION OF THE INVENTION (1) Technical Field of the Invention The present invention relates to a module in which a chip carrier, a capacitor, etc. are mounted on a substrate, and particularly to a semiconductor device in which a capacitor is mounted on an end surface or a back surface of a substrate.

(2) Technology background In recent years, integrated circuit manufacturing technology has focused on assembly and mounting aspects other than the element chip/nob itself, and there are also increasing cases where IC package cost exceeds IC chip cost. Interest in IC packages is also increasing.

Furthermore, there has recently been a trend towards the use of small parts without leads. This is because not only are chip components susceptible to miniaturization to improve packaging, but they are also suitable for automation for mass production, leading to lower costs.

For example, currently LCC (leadless chip carrier)
A carrier equipped with a leadless chip called LCC has been developed, and there is a demand for the practical implementation of an effective module for mounting this LCC on a printed circuit board to form a card.

(3) Conventional technology and problems Conventional 1c packages include flat packages,
Although various types such as dual in-line packages (hereinafter referred to as DIPs) have been developed, all types have problems with respect to heat dissipation, high-density packaging, and the like.

For example, in a plan view of a DIP with the top cap removed, as shown in FIG.
Since it occupies a much larger specific weight than the size of the C chip 3 itself, it becomes a major bottleneck especially in increasing the packaging density.

For this reason, carriers without leads, ie, LCCs, are currently being developed as described above. This will be explained with reference to FIG.

Figure 2 (al is a side view showing the appearance of a conventional LCC,
Figures (bl is a bottom view showing the external appearance, Figure 2 (C) is Figure 2!
This is a cross-sectional view taken along line A-A in a), and as shown in Figure 2 tc+, a chip 3 is placed on a multilayer ceramic substrate 1 such as a green sheet, and the wiring patterning portion of the ceramic substrate 1 and the chip are The wiring terminals 4a are bonded to the side and bottom of the package, and as shown in Figure 2 fal and (bl), the length L x width W x thickness t is 11.05 L mm x 7.49 w w. X2.16L
Lengthwise terminal pitch p+ = 5.08 m in wm.

The terminal pinch p 2 in the width direction can be extremely small, ie, 1.27 m, making it approximately 1/3 the size of a conventional DTP. When a bypass capacitor or the like is mounted on a printed circuit board or the like for such T, CC, and DIP, there is a drawback that the mounting density cannot be increased because the LCC, DIP capacitor, etc. are arranged side by side on the printed circuit board.

(4) Purpose of the Invention The present invention has been made in view of the above-mentioned drawbacks of the conventional art. The purpose is to improve the packaging density by installing the

(5) Structure of the Invention The object of the present invention is to provide a base body, a leadless chip carrier mounted on at least one main surface of the base body, a plurality of lead pins led out from one side of the base body, and other parts of the base body. This is achieved by providing a semiconductor device characterized in that an electric element is mounted on at least one of the main surface and the other side surface of the base.

(6) Examples of the invention Embodiments of the present invention will be described below with reference to the drawings.

Figures 3(a) and 3(a) show a front view and a side view, respectively, of an embodiment of the present invention.

In Figure 3 (81), a total of 8 LCC4s are mounted and fixed, 4 on each side, by soldering, etc., on the surface of a multilayer board 1' made of ceramic or the like, and the upper surface of the board 1' Electric elements, such as capacitors 5, are similarly provided on three sides to form a module of a semiconductor device.The size of this board corresponds to one DTP, and the LCC 4 and capacitors 5 are arranged on the board 1. Electrical connection is made through the wiring pattern inside the board 1', and a plurality of pins 6 are provided on the lower end surface of the board 1', for example, and the board 1' is connected to the terminal connection part of the board or printed circuit board 8 that has been provided in advance. By inserting the module in an upright position, the semiconductor device module is electrically connected.

In addition, in FIG. 3 (bl), on both sides of a substrate 1' made of ceramic or the like, soldering 7 is made between, for example, the terminal 4a of the LCC and the terminal (not shown) of the substrate 1', and these The electrical connection between them is made by a multilayer pattern on a plurality of multilayered ceramics.

The module of the semiconductor device of the present invention has an L CC4 on the front surface or the back surface occupying most of the area on the substrate 1'.
It is equipped with only. In addition, since the electrical elements essential for the electric circuit, such as the (decoupling) capacitor 5, are mounted on a small portion of the substrate 1' other than the front and back surfaces, such as the top surface, the The number of LCCs that can be mounted can be determined according to the size of the board, and the density can be increased by bringing the capacitors closer to the edge of the board.

Furthermore, since the module of the semiconductor device of the present invention is mounted vertically on the board, the mounting density is significantly improved.

FIG. 4 (al and (hl) respectively show a front view and a side view of another embodiment of the present invention.

In FIG. 4 (al), four CC4's are fixed and mounted on the surface of the substrate 1' surface 6-, made of ceramic or the like, by means of hand-held screws, for example, and the substrate 1' is mounted. On the second back side B (decoupling) condensate-1
1□ 5 is soldered, etc., and three openings are formed, for example, to form a semiconductor module. Then, wiring is performed within the multilayer ceramic substrate to secure electrical connections between each element, and furthermore, a plurality of bins 6 are provided in advance on the lower end surface of the substrate 1', for example. By fitting into the connecting portions of the terminals on the board 8, the semiconductor device module is electrically connected to the outside.

In Figure 4 (bl), on the second surface of the substrate 1' made of, for example, ceramic, etc., for example ~
1iL7-Aa and a terminal (not shown) of the board are fixed by a handy attachment 7, and a capacitor 5 is fixed and mounted, for example, by soldering 7 on the back surface B of the substrate 1'. Electrical connection between these surfaces is made via multilayer wiring 9 made up of a plurality of multilayer ceramic substrates.

In the semiconductor device module of the present invention, for example, l-CC and capacitor +5 are mounted on the front surface occupying most of the area on the substrate 1' and on the back surface B, respectively. In this case, the board 1' is inserted vertically into the boat', and the area on both the front and back sides of the board can be occupied, so the number of I... CCs that can be mounted on one board is greatly increased. are doing. Furthermore, since the substrate is mounted vertically on the board, the mounting density on the board is also increasing dramatically.

In this embodiment, a capacitor is shown as an example of an electric element mounted on the substrate, but other elements such as an inductance can also be mounted.

(7) Effects of the Invention As described above, by modularizing the semiconductor device of the present invention, in other words, by making the board with multilayer wiring vertical, elements can be mounted on both the front and back surfaces, and capacitors can be mounted on the upper and lower end surfaces. By providing electrical terminals for the external leads and external leads, it is possible to create a conductor device module with greatly increased packaging density compared to the prior art.

Furthermore, regarding the mounting density when mounting each module of the semiconductor device on a board, it is possible to achieve high-density mounting because the board is vertically shaped as described in item 7.

[Brief explanation of the drawing]

Fig. 1 is a plan view of a conventionally used dual in-line package (DTP) with the top cap removed, and Fig. 2 (δ) to fnl are a side view, a bottom view, and a bottom view showing the configuration of the LCC. 3 (8) and (b) are respectively a front view and a side view of one embodiment of the present invention, and FIG. 1. They are a front part and a side view of an embodiment of the present invention. 1.1'... Board, 2... Inner lead part, 3...
・IC chip, 4...Leadless chip carrier, 5...Decaso spring capacitor, 6
...Bin, 8...Board. −〇− ”t. Figure 2 (0) Figure 4 U

Claims (1)

[Claims] A base, a leadless chip carrier mounted on at least one main surface of the base, a plurality of lead pins led out from one side of the base, the other main surface of the base, and the other side of the base, A semiconductor device characterized by having an electric element mounted on at least one surface.