JPH0525238Y2 - - Google Patents
Info
- Publication number
- JPH0525238Y2 JPH0525238Y2 JP1987000107U JP10787U JPH0525238Y2 JP H0525238 Y2 JPH0525238 Y2 JP H0525238Y2 JP 1987000107 U JP1987000107 U JP 1987000107U JP 10787 U JP10787 U JP 10787U JP H0525238 Y2 JPH0525238 Y2 JP H0525238Y2
- Authority
- JP
- Japan
- Prior art keywords
- bonding
- substrate
- moving
- arm
- distance
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987000107U JPH0525238Y2 (en, 2012) | 1987-01-06 | 1987-01-06 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987000107U JPH0525238Y2 (en, 2012) | 1987-01-06 | 1987-01-06 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63108632U JPS63108632U (en, 2012) | 1988-07-13 |
| JPH0525238Y2 true JPH0525238Y2 (en, 2012) | 1993-06-25 |
Family
ID=30776792
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987000107U Expired - Lifetime JPH0525238Y2 (en, 2012) | 1987-01-06 | 1987-01-06 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0525238Y2 (en, 2012) |
-
1987
- 1987-01-06 JP JP1987000107U patent/JPH0525238Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63108632U (en, 2012) | 1988-07-13 |
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