JPH05235557A - 位置ずれ量測定システム - Google Patents

位置ずれ量測定システム

Info

Publication number
JPH05235557A
JPH05235557A JP4035201A JP3520192A JPH05235557A JP H05235557 A JPH05235557 A JP H05235557A JP 4035201 A JP4035201 A JP 4035201A JP 3520192 A JP3520192 A JP 3520192A JP H05235557 A JPH05235557 A JP H05235557A
Authority
JP
Japan
Prior art keywords
trace
conductor
conductive
inner layer
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4035201A
Other languages
English (en)
Japanese (ja)
Inventor
Soichiro Kitaoka
壮一郎 北岡
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
N P S KK
Original Assignee
N P S KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by N P S KK filed Critical N P S KK
Priority to JP4035201A priority Critical patent/JPH05235557A/ja
Priority to TW81103592A priority patent/TW198170B/zh
Priority to EP93301267A priority patent/EP0557136A2/en
Publication of JPH05235557A publication Critical patent/JPH05235557A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4638—Aligning and fixing the circuit boards before lamination; Detecting or measuring the misalignment after lamination; Aligning external circuit patterns or via connections relative to internal circuits
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B7/00—Measuring arrangements characterised by the use of electric or magnetic techniques
    • G01B7/30—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring angles or tapers; for testing the alignment of axes
    • G01B7/31—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring angles or tapers; for testing the alignment of axes for testing the alignment of axes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/2805—Bare printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0268—Marks, test patterns or identification means for electrical inspection or testing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0008—Apparatus or processes for manufacturing printed circuits for aligning or positioning of tools relative to the circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • General Engineering & Computer Science (AREA)
  • Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
  • Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
JP4035201A 1992-02-21 1992-02-21 位置ずれ量測定システム Pending JPH05235557A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP4035201A JPH05235557A (ja) 1992-02-21 1992-02-21 位置ずれ量測定システム
TW81103592A TW198170B (enExample) 1992-02-21 1992-05-08
EP93301267A EP0557136A2 (en) 1992-02-21 1993-02-22 System for measuring misregistration

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4035201A JPH05235557A (ja) 1992-02-21 1992-02-21 位置ずれ量測定システム

Publications (1)

Publication Number Publication Date
JPH05235557A true JPH05235557A (ja) 1993-09-10

Family

ID=12435247

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4035201A Pending JPH05235557A (ja) 1992-02-21 1992-02-21 位置ずれ量測定システム

Country Status (3)

Country Link
EP (1) EP0557136A2 (enExample)
JP (1) JPH05235557A (enExample)
TW (1) TW198170B (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010052783A1 (ja) * 2008-11-06 2010-05-14 富士機工電子株式会社 多層プリント配線板、多層プリント配線板の検査方法、および多層プリント配線板の検査システム、多層プリント配線板の製造方法
JP2010267985A (ja) * 2010-07-09 2010-11-25 Fuji Kiko Denshi Kk 多層プリント配線板、多層プリント配線板の検査方法、および多層プリント配線板の検査システム、多層プリント配線板の製造方法

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7034544B2 (en) * 2003-06-30 2006-04-25 Intel Corporation Methods for minimizing the impedance discontinuity between a conductive trace and a component and structures formed thereby
US20120212252A1 (en) * 2011-02-17 2012-08-23 Aronson Scott H Printed Circuit Board Registration Testing
CN110049638B (zh) * 2019-04-24 2020-06-19 深圳市景旺电子股份有限公司 高密度互连板制造方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3045433A1 (de) * 1980-12-02 1982-07-01 Siemens AG, 1000 Berlin und 8000 München Mehrlagen-leiterplatte und verfahren zur ermittlung der ist-position innenliegender anschlussflaechen
US4510446A (en) * 1982-11-03 1985-04-09 Burroughs Corporation Test coupons for determining the registration of subsurface layers in a multilayer printed circuit board
US4894606A (en) * 1988-07-07 1990-01-16 Paur Tom R System for measuring misregistration of printed circuit board layers
FR2641932B1 (fr) * 1989-01-13 1996-04-26 Thomson Csf Dispositif d'evaluation du glissement entre l'impression conductrice et les trous d'un circuit imprime multicouches

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010052783A1 (ja) * 2008-11-06 2010-05-14 富士機工電子株式会社 多層プリント配線板、多層プリント配線板の検査方法、および多層プリント配線板の検査システム、多層プリント配線板の製造方法
JP4602479B2 (ja) * 2008-11-06 2010-12-22 富士機工電子株式会社 多層プリント配線板、多層プリント配線板の検査方法、および多層プリント配線板の検査システム、多層プリント配線板の製造方法
JPWO2010052783A1 (ja) * 2008-11-06 2012-03-29 富士機工電子株式会社 多層プリント配線板、多層プリント配線板の検査方法、および多層プリント配線板の検査システム、多層プリント配線板の製造方法
JP2010267985A (ja) * 2010-07-09 2010-11-25 Fuji Kiko Denshi Kk 多層プリント配線板、多層プリント配線板の検査方法、および多層プリント配線板の検査システム、多層プリント配線板の製造方法

Also Published As

Publication number Publication date
EP0557136A3 (enExample) 1994-02-16
EP0557136A2 (en) 1993-08-25
TW198170B (enExample) 1993-01-11

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