JPH0521386Y2 - - Google Patents
Info
- Publication number
- JPH0521386Y2 JPH0521386Y2 JP1622588U JP1622588U JPH0521386Y2 JP H0521386 Y2 JPH0521386 Y2 JP H0521386Y2 JP 1622588 U JP1622588 U JP 1622588U JP 1622588 U JP1622588 U JP 1622588U JP H0521386 Y2 JPH0521386 Y2 JP H0521386Y2
- Authority
- JP
- Japan
- Prior art keywords
- mold
- resin
- cull
- pot
- resin molding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000011347 resin Substances 0.000 claims description 35
- 229920005989 resin Polymers 0.000 claims description 35
- 238000000465 moulding Methods 0.000 claims description 16
- 239000004065 semiconductor Substances 0.000 description 2
- 230000004308 accommodation Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
Landscapes
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1622588U JPH0521386Y2 (US20020095090A1-20020718-M00002.png) | 1988-02-08 | 1988-02-08 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1622588U JPH0521386Y2 (US20020095090A1-20020718-M00002.png) | 1988-02-08 | 1988-02-08 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01119321U JPH01119321U (US20020095090A1-20020718-M00002.png) | 1989-08-11 |
| JPH0521386Y2 true JPH0521386Y2 (US20020095090A1-20020718-M00002.png) | 1993-06-01 |
Family
ID=31228967
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1622588U Expired - Lifetime JPH0521386Y2 (US20020095090A1-20020718-M00002.png) | 1988-02-08 | 1988-02-08 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0521386Y2 (US20020095090A1-20020718-M00002.png) |
-
1988
- 1988-02-08 JP JP1622588U patent/JPH0521386Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH01119321U (US20020095090A1-20020718-M00002.png) | 1989-08-11 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2968896B2 (ja) | 表皮一体積層体の製造法およびこれに用いる金型装置 | |
| JP2001047458A (ja) | 樹脂封止装置 | |
| JPH0521386Y2 (US20020095090A1-20020718-M00002.png) | ||
| KR102393495B1 (ko) | 수지 성형품의 제조 방법 및 수지 성형 장치 | |
| JP3321023B2 (ja) | 液体樹脂を用いる樹脂モールド方法及び樹脂モールド装置 | |
| JP2004522624A5 (US20020095090A1-20020718-M00002.png) | ||
| JP2626971B2 (ja) | 電子部品の樹脂封止成形方法及び金型 | |
| JPH05243301A (ja) | 半導体装置製造方法 | |
| JP2000280295A (ja) | 成形同時加飾用金型と成形同時加飾品の製造方法 | |
| JP3214789B2 (ja) | 樹脂モールド装置及び樹脂モールド方法 | |
| JP3811422B2 (ja) | フィルム付成形品の製造方法 | |
| JP2666630B2 (ja) | 半導体装置の製造方法 | |
| JP3751227B2 (ja) | 金型装置 | |
| JP2858942B2 (ja) | 樹脂封止方法及び樹脂封止装置 | |
| JPH06177191A (ja) | 樹脂モールド装置 | |
| JP2942277B2 (ja) | 樹脂モールド方法 | |
| JP3543742B2 (ja) | 樹脂封止成形装置 | |
| JP3590133B2 (ja) | 樹脂モールド方法及び樹脂モールド装置 | |
| JPH0761663B2 (ja) | 合成樹脂成形品の成形法 | |
| JPH043770Y2 (US20020095090A1-20020718-M00002.png) | ||
| JPH04146111A (ja) | プラスチック成形機 | |
| JPH0238447Y2 (US20020095090A1-20020718-M00002.png) | ||
| JP2669886B2 (ja) | 樹脂モールド装置 | |
| JP2680381B2 (ja) | 加飾成形品の製造方法 | |
| JPH0314332Y2 (US20020095090A1-20020718-M00002.png) |
