JPH0521133B2 - - Google Patents

Info

Publication number
JPH0521133B2
JPH0521133B2 JP60020103A JP2010385A JPH0521133B2 JP H0521133 B2 JPH0521133 B2 JP H0521133B2 JP 60020103 A JP60020103 A JP 60020103A JP 2010385 A JP2010385 A JP 2010385A JP H0521133 B2 JPH0521133 B2 JP H0521133B2
Authority
JP
Japan
Prior art keywords
parts
resin
bifunctional
epoxy resin
epoxy
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP60020103A
Other languages
English (en)
Japanese (ja)
Other versions
JPS61181820A (ja
Inventor
Keiichiro Ishii
Kenichi Suzuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Bakelite Co Ltd
Original Assignee
Sumitomo Bakelite Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Bakelite Co Ltd filed Critical Sumitomo Bakelite Co Ltd
Priority to JP2010385A priority Critical patent/JPS61181820A/ja
Publication of JPS61181820A publication Critical patent/JPS61181820A/ja
Publication of JPH0521133B2 publication Critical patent/JPH0521133B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
JP2010385A 1985-02-06 1985-02-06 熱硬化性樹脂組成物 Granted JPS61181820A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2010385A JPS61181820A (ja) 1985-02-06 1985-02-06 熱硬化性樹脂組成物

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010385A JPS61181820A (ja) 1985-02-06 1985-02-06 熱硬化性樹脂組成物

Publications (2)

Publication Number Publication Date
JPS61181820A JPS61181820A (ja) 1986-08-14
JPH0521133B2 true JPH0521133B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1993-03-23

Family

ID=12017775

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010385A Granted JPS61181820A (ja) 1985-02-06 1985-02-06 熱硬化性樹脂組成物

Country Status (1)

Country Link
JP (1) JPS61181820A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4223632A1 (de) 1992-07-17 1994-01-20 Siemens Ag Verfahren zur Herstellung einer flammwidrig eingestellten Epoxidharzformmasse
JPH09278867A (ja) * 1996-04-10 1997-10-28 Toto Kasei Co Ltd エポキシ樹脂組成物
JP4674988B2 (ja) * 2001-04-13 2011-04-20 旭化成エポキシ株式会社 オキサゾリドン環含有エポキシ樹脂
JP2002322241A (ja) * 2001-04-26 2002-11-08 Dainippon Ink & Chem Inc 難燃性エポキシ樹脂組成物
JP2002332326A (ja) * 2001-05-09 2002-11-22 Asahi Kasei Epoxy Kk 変性エポキシ樹脂およびその製造方法
WO2009058715A2 (en) * 2007-10-31 2009-05-07 Dow Global Technology Inc. Non-sintering isocyanate modified epoxy resin for fusion bonded epoxy applications
CN111205424B (zh) 2013-07-08 2022-04-08 旭化成株式会社 改性的树脂和树脂组合物

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5315757B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * 1973-08-31 1978-05-26
JPS5626926A (en) * 1979-08-10 1981-03-16 Toshiba Corp Epoxy resin molding material for sealing electronic part

Also Published As

Publication number Publication date
JPS61181820A (ja) 1986-08-14

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