JPH0520898B2 - - Google Patents

Info

Publication number
JPH0520898B2
JPH0520898B2 JP59190817A JP19081784A JPH0520898B2 JP H0520898 B2 JPH0520898 B2 JP H0520898B2 JP 59190817 A JP59190817 A JP 59190817A JP 19081784 A JP19081784 A JP 19081784A JP H0520898 B2 JPH0520898 B2 JP H0520898B2
Authority
JP
Japan
Prior art keywords
upper electrode
wafer
etching
stage
plasma
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP59190817A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6167922A (ja
Inventor
Kenji Koyama
Kanetake Takasaki
Atsuhiro Tsukune
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP59190817A priority Critical patent/JPS6167922A/ja
Publication of JPS6167922A publication Critical patent/JPS6167922A/ja
Publication of JPH0520898B2 publication Critical patent/JPH0520898B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials

Landscapes

  • Drying Of Semiconductors (AREA)
JP59190817A 1984-09-12 1984-09-12 プラズマ処理装置 Granted JPS6167922A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59190817A JPS6167922A (ja) 1984-09-12 1984-09-12 プラズマ処理装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59190817A JPS6167922A (ja) 1984-09-12 1984-09-12 プラズマ処理装置

Publications (2)

Publication Number Publication Date
JPS6167922A JPS6167922A (ja) 1986-04-08
JPH0520898B2 true JPH0520898B2 (enExample) 1993-03-22

Family

ID=16264244

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59190817A Granted JPS6167922A (ja) 1984-09-12 1984-09-12 プラズマ処理装置

Country Status (1)

Country Link
JP (1) JPS6167922A (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01279784A (ja) * 1988-05-02 1989-11-10 Tokyo Electron Ltd エッチング装置
JPH0713217Y2 (ja) * 1988-09-24 1995-03-29 株式会社リコー 半導体製造装置の下部電極
DE3835153A1 (de) * 1988-10-15 1990-04-26 Leybold Ag Vorrichtung zum aetzen von substraten durch eine glimmentladung
JP3252330B2 (ja) * 1991-09-20 2002-02-04 東芝セラミックス株式会社 プラズマエッチング用電極板
US5643394A (en) * 1994-09-16 1997-07-01 Applied Materials, Inc. Gas injection slit nozzle for a plasma process reactor
KR100469047B1 (ko) 1997-04-11 2005-01-31 동경 엘렉트론 주식회사 처리장치, 상부전극유니트와 그 사용방법 및 전극유니트와 그 제조방법
GB0326500D0 (en) 2003-11-13 2003-12-17 Oxford Instr Plasma Technology Gas port assembly
JP5854225B2 (ja) * 2012-05-31 2016-02-09 株式会社島津製作所 プラズマｃｖｄ成膜装置

Also Published As

Publication number Publication date
JPS6167922A (ja) 1986-04-08

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