JPH0519957Y2 - - Google Patents

Info

Publication number
JPH0519957Y2
JPH0519957Y2 JP1986156002U JP15600286U JPH0519957Y2 JP H0519957 Y2 JPH0519957 Y2 JP H0519957Y2 JP 1986156002 U JP1986156002 U JP 1986156002U JP 15600286 U JP15600286 U JP 15600286U JP H0519957 Y2 JPH0519957 Y2 JP H0519957Y2
Authority
JP
Japan
Prior art keywords
resin body
hard resin
electrode
bowl
header
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1986156002U
Other languages
English (en)
Japanese (ja)
Other versions
JPS6364049U (pm
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986156002U priority Critical patent/JPH0519957Y2/ja
Publication of JPS6364049U publication Critical patent/JPS6364049U/ja
Application granted granted Critical
Publication of JPH0519957Y2 publication Critical patent/JPH0519957Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP1986156002U 1986-10-14 1986-10-14 Expired - Lifetime JPH0519957Y2 (pm)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1986156002U JPH0519957Y2 (pm) 1986-10-14 1986-10-14

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986156002U JPH0519957Y2 (pm) 1986-10-14 1986-10-14

Publications (2)

Publication Number Publication Date
JPS6364049U JPS6364049U (pm) 1988-04-27
JPH0519957Y2 true JPH0519957Y2 (pm) 1993-05-25

Family

ID=31077212

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986156002U Expired - Lifetime JPH0519957Y2 (pm) 1986-10-14 1986-10-14

Country Status (1)

Country Link
JP (1) JPH0519957Y2 (pm)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2726515B2 (ja) * 1989-09-22 1998-03-11 電気化学工業株式会社 半導体塔載用回路基板及びその製造方法
JP2008235674A (ja) * 2007-03-22 2008-10-02 Toyota Motor Corp パワーモジュール及び車両用インバータ
JP2009277876A (ja) * 2008-05-14 2009-11-26 Sanken Electric Co Ltd 半導体装置
JP5822656B2 (ja) * 2011-10-31 2015-11-24 株式会社 日立パワーデバイス 半導体装置及びその製造方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS615812U (ja) * 1984-05-31 1986-01-14 日本メクトロン株式会社 搬送用ベルト

Also Published As

Publication number Publication date
JPS6364049U (pm) 1988-04-27

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