JPH0452999Y2 - - Google Patents

Info

Publication number
JPH0452999Y2
JPH0452999Y2 JP1986174049U JP17404986U JPH0452999Y2 JP H0452999 Y2 JPH0452999 Y2 JP H0452999Y2 JP 1986174049 U JP1986174049 U JP 1986174049U JP 17404986 U JP17404986 U JP 17404986U JP H0452999 Y2 JPH0452999 Y2 JP H0452999Y2
Authority
JP
Japan
Prior art keywords
fiber layer
electrode
soft resin
semiconductor device
resin body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1986174049U
Other languages
English (en)
Japanese (ja)
Other versions
JPS6380851U (pm
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986174049U priority Critical patent/JPH0452999Y2/ja
Publication of JPS6380851U publication Critical patent/JPS6380851U/ja
Application granted granted Critical
Publication of JPH0452999Y2 publication Critical patent/JPH0452999Y2/ja
Expired legal-status Critical Current

Links

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP1986174049U 1986-11-14 1986-11-14 Expired JPH0452999Y2 (pm)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1986174049U JPH0452999Y2 (pm) 1986-11-14 1986-11-14

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986174049U JPH0452999Y2 (pm) 1986-11-14 1986-11-14

Publications (2)

Publication Number Publication Date
JPS6380851U JPS6380851U (pm) 1988-05-27
JPH0452999Y2 true JPH0452999Y2 (pm) 1992-12-14

Family

ID=31112083

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986174049U Expired JPH0452999Y2 (pm) 1986-11-14 1986-11-14

Country Status (1)

Country Link
JP (1) JPH0452999Y2 (pm)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0610691Y2 (ja) * 1987-08-17 1994-03-16 日本電気株式会社 プラスチック封止電子部品

Also Published As

Publication number Publication date
JPS6380851U (pm) 1988-05-27

Similar Documents

Publication Publication Date Title
EP1188182B1 (en) A method of assembling a semiconductor device package
US4572924A (en) Electronic enclosures having metal parts
JPH0239865B2 (pm)
JP4362163B2 (ja) 半導体装置の製造方法
EP0645812A1 (en) Resin-sealed semiconductor device
JPH0452999Y2 (pm)
US5099397A (en) Fuzed solid electrolyte capacitor
JPH0519957Y2 (pm)
JP2000228455A (ja) Ｂｇａ型ｉｃパッケージ
JP2919178B2 (ja) モールドチップ型固体電解コンデンサ
JP3572764B2 (ja) ベアチップ封止方法およびベアチップ封止基板
JPS5916357A (ja) 半導体装置
JPS633154Y2 (pm)
JP3012575B2 (ja) Ｌｏｃ型半導体装置の製造方法
JP2727692B2 (ja) サーミスタ素子
JPH08111493A (ja) 半導体装置
JP2506429B2 (ja) 樹脂封止型半導体装置
JPS6224654A (ja) 半導体パツケ−ジ
JP2639091B2 (ja) 小型サーミスタ素子の製造法
JPS62263665A (ja) リ−ドフレ−ムおよびそれを用いた半導体装置
JPS61241949A (ja) 半導体装置
JPH0494563A (ja) 表面実装型半導体装置およびその製造方法
JPH10189792A (ja) 半導体パッケージ
JP3076337B1 (ja) Ｂｇａ型ｉｃパッケージ
JPH04123401A (ja) 薄膜抵抗体