JPH051980B2 - - Google Patents

Info

Publication number
JPH051980B2
JPH051980B2 JP61132711A JP13271186A JPH051980B2 JP H051980 B2 JPH051980 B2 JP H051980B2 JP 61132711 A JP61132711 A JP 61132711A JP 13271186 A JP13271186 A JP 13271186A JP H051980 B2 JPH051980 B2 JP H051980B2
Authority
JP
Japan
Prior art keywords
lead frame
support plate
bonding
lead
heating element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP61132711A
Other languages
English (en)
Japanese (ja)
Other versions
JPS62291039A (ja
Inventor
Hiroshi Ushiki
Kenji Kitakubo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinkawa Ltd
Original Assignee
Shinkawa Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Ltd filed Critical Shinkawa Ltd
Priority to JP61132711A priority Critical patent/JPS62291039A/ja
Publication of JPS62291039A publication Critical patent/JPS62291039A/ja
Publication of JPH051980B2 publication Critical patent/JPH051980B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Wire Bonding (AREA)
  • Die Bonding (AREA)
JP61132711A 1986-06-10 1986-06-10 ボンデイング装置 Granted JPS62291039A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP61132711A JPS62291039A (ja) 1986-06-10 1986-06-10 ボンデイング装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61132711A JPS62291039A (ja) 1986-06-10 1986-06-10 ボンデイング装置

Publications (2)

Publication Number Publication Date
JPS62291039A JPS62291039A (ja) 1987-12-17
JPH051980B2 true JPH051980B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1993-01-11

Family

ID=15087782

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61132711A Granted JPS62291039A (ja) 1986-06-10 1986-06-10 ボンデイング装置

Country Status (1)

Country Link
JP (1) JPS62291039A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0244520Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * 1986-08-07 1990-11-27

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5355966A (en) * 1976-10-30 1978-05-20 Shinkawa Seisakusho Kk Mechanism for catching lead frames

Also Published As

Publication number Publication date
JPS62291039A (ja) 1987-12-17

Similar Documents

Publication Publication Date Title
GB1439958A (en) Apparatus for transporting an object along a predetermined path
US5197652A (en) Wire bonding method and apparatus with lead pressing means
US5249726A (en) Tape clamping mechanism
JPH051980B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JPS618935A (ja) ボンデイング装置用加熱装置
JPH0254664B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JP3653500B2 (ja) 工作機械の主軸頭周辺クーラント液及び切粉飛散防止装置
JP3167742B2 (ja) 溶接機のワーククランプ装置
KR930010588B1 (ko) 반송가공물의 클램프장치
US4975050A (en) Workpiece heating and feeding device
JPH03264117A (ja) 折曲げ機
JPH0319223Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JPS58168440A (ja) 板曲機におけるブランクホルダ装置
JPH0748228Y2 (ja) 縫着片折り曲げ装置
JP4088217B2 (ja) インナーリードボンディング装置
JPS5925232A (ja) ワイヤボンディング装置
JPH029557Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JPS5856052Y2 (ja) 半田供給装置
JPS6016380A (ja) ロボツト
JPH0871671A (ja) パンチングプレス機のワーククランプ装置
JP2732424B2 (ja) レーザ加工機のワーク押え装置
JPH0788268A (ja) 自動縫製装置における被縫物保持具の切削加工装置
JPS5932618Y2 (ja) 糸案内装置
JPH0338949B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JPH02303138A (ja) ワイヤボンディング装置及び方法

Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees