JPH051980B2 - - Google Patents
Info
- Publication number
- JPH051980B2 JPH051980B2 JP13271186A JP13271186A JPH051980B2 JP H051980 B2 JPH051980 B2 JP H051980B2 JP 13271186 A JP13271186 A JP 13271186A JP 13271186 A JP13271186 A JP 13271186A JP H051980 B2 JPH051980 B2 JP H051980B2
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- support plate
- bonding
- lead
- heating element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000010438 heat treatment Methods 0.000 claims description 22
- 230000000630 rising effect Effects 0.000 claims description 7
- 239000007789 gas Substances 0.000 description 17
- 239000011261 inert gas Substances 0.000 description 6
- 239000008188 pellet Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Wire Bonding (AREA)
- Die Bonding (AREA)
Description
【発明の詳細な説明】
［産業上の利用分野］
本発明はアイランドダウン部を有するリードフ
レームにワイヤボンデイングを行うボンデイング
装置に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a bonding apparatus that performs wire bonding to a lead frame having an island down portion.
［従来の技術］
従来、アイランドダウン部を有するリードフレ
ームを対象としたボンデイング装置として、例え
ば特開昭61−8935号公報に示すものが知られてい
る。[Prior Art] Conventionally, as a bonding device for a lead frame having an island down portion, there is known a bonding device disclosed in, for example, Japanese Patent Application Laid-open No. 8935/1989.
この構造は、加熱体のリードフレーム当接面に
リードフレームの送り方向に沿つて少なくとも２
個のリードフレーム押上げ部材用溝を形成し、こ
のリードフレーム押上げ部材用溝に加熱体に対し
て相対的に上下動可能にリードフレーム押上げ部
材を配設してなり、リードフレーム押上げ部材で
リードフレームを持ち上げて送るようになつてい
る。 In this structure, at least two
A lead frame push-up member groove is formed, and a lead frame push-up member is disposed in the lead frame push-up member groove so as to be movable up and down relative to the heating body. The lead frame is lifted and fed using a member.
［発明が解決しようとする問題点］
上記従来例では、細長いリードフレーム押上げ
部材をローダ側からアンローダ側に亘つて配設さ
れている。このため、リードフレーム押上げ部材
は非常に長くなり、剛性の点で問題がある。そこ
で、実用化するには数本のリードフレーム押上げ
部材を直列に配設し、これらのリードフレーム押
上げ部材が連動して上下動するようにする必要が
あり、リードフレーム押上げ部材の上下動機構及
び連動機構が非常に複雑となり、実用化の点で問
題があつた。[Problems to be Solved by the Invention] In the conventional example described above, the elongated lead frame push-up member is disposed from the loader side to the unloader side. Therefore, the lead frame push-up member becomes very long, which poses a problem in terms of rigidity. Therefore, in order to put it into practical use, it is necessary to arrange several lead frame push-up members in series so that these lead frame push-up members move up and down in conjunction with each other. The motion mechanism and interlocking mechanism became very complicated, which caused problems in terms of practical application.
本発明の目的は、構造が簡単でアイランドダウ
ン部を有するリードフレームにワイヤボンデイン
グを施すことができるボンデイング装置を提供す
ることにある。 SUMMARY OF THE INVENTION An object of the present invention is to provide a bonding device that has a simple structure and can perform wire bonding on a lead frame having an island down section.
［問題点を解決するための手段］
上記従来技術の問題点は、リードフレームの送
り方向に直角な水平方向に移動可能で、前記リー
ドフレームのリード部を支える支え部を有する支
え板を設けることにより解決される。[Means for Solving the Problems] The problem with the above-mentioned prior art is that a support plate is provided that is movable in the horizontal direction perpendicular to the feed direction of the lead frame and has a support part that supports the lead part of the lead frame. It is solved by
［作用］
ボンデイング時には支え板の支え部でリードフ
レームのリード部は支えられるので、良好なボン
デイングが行える。またリードフレームを送る時
は、支え板がアイランドダウン部から離れる方向
に移動し、リードフレームの立上り部の送り方向
には立上り部の移動をさまたげるものがないの
で、リードフレームを持ち上げることなく送るこ
とができる。[Function] During bonding, the lead portion of the lead frame is supported by the support portion of the support plate, so that good bonding can be performed. Also, when feeding the lead frame, the support plate moves in the direction away from the island down section, and there is nothing to obstruct the movement of the rising section of the lead frame in the feeding direction, so it is possible to feed the lead frame without lifting it. I can do it.
［実施例］
以下、本発明の一実施例を第１図乃至第３図に
より説明する。本実施例は、特開昭61−8935号公
報に示す構造に適用し、しかも第４図に示すよう
に、アイランドダウン部１ａの立上り部１ｂの側
方にリード部１ｃが設けられ、かつこのリード部
１ｃが立上り部１ｂよりアイランドダウン部１ａ
側に突出したリードフレーム１を用いた場合を示
す。なお、２はリードフレーム１のアイランドダ
ウン部１ａに固着されたペレツトを示す。[Example] An example of the present invention will be described below with reference to FIGS. 1 to 3. This embodiment is applied to the structure shown in Japanese Unexamined Patent Publication No. 61-8935, and as shown in FIG. The lead portion 1c is closer to the island down portion 1a than the rising portion 1b.
A case is shown in which a lead frame 1 protruding to the side is used. Note that 2 indicates a pellet fixed to the island down portion 1a of the lead frame 1.
まず特開昭61−8935号と共通する構造の概略を
説明する。カートリツジヒータ１０を内臓する加
熱体１１の上面にはリードフレーム１をガイドす
るガイド溝１１ａが形成されている。また加熱体
１１にはガス孔１１ｂが形成され、このガス孔１
１ｂより加熱体１１の上面に向つて多数個の細い
ガス孔１１ｃが形成されている。そして、ガス孔
１１ｂには図示しないガス供給源より不活性ガス
がガス供給パイプ１２を通して供給されるように
なつている。また加熱体１１の上面には加熱体カ
バー１３が固定されており、加熱体カバー１３に
は該加熱体カバー１３の上方に配設された押え板
１４の押え部１４ａが入り込む開口部１３ａが形
成されている。前記押え板１４にはボンデイング
作業に必要なボンデイング作業窓１４ｂが形成さ
れており、この押え板１４は図示しない上下駆動
機構によつて上下動する押え板ホルダー１５に固
定されている。前記押え板１４の上面にはガスカ
バー１６が固定されており、ガスカバー１６には
前記ボンデイング作業窓１４ｂに対応した部分に
前記ボンデイング作業窓１４ｂと同様にボンデイ
ング作業窓１６ａが形成されている。 First, an outline of the structure common to that of JP-A-61-8935 will be explained. A guide groove 11a for guiding the lead frame 1 is formed on the upper surface of the heating body 11 containing the cartridge heater 10. Further, a gas hole 11b is formed in the heating body 11, and this gas hole 1
A large number of thin gas holes 11c are formed from 1b toward the upper surface of the heating body 11. Inert gas is supplied to the gas hole 11b from a gas supply source (not shown) through the gas supply pipe 12. Further, a heating element cover 13 is fixed to the upper surface of the heating element 11, and an opening 13a is formed in the heating element cover 13 into which a pressing part 14a of a pressing plate 14 disposed above the heating element cover 13 enters. has been done. A bonding work window 14b necessary for bonding work is formed in the presser plate 14, and the presser plate 14 is fixed to a presser plate holder 15 that moves up and down by a vertical drive mechanism (not shown). A gas cover 16 is fixed to the upper surface of the presser plate 14, and a bonding work window 16a is formed in a portion of the gas cover 16 corresponding to the bonding work window 14b in the same way as the bonding work window 14b.
またリードフレーム１を位置決めする位置決め
ピン２０が図示しない上下駆動機構で上下動する
ように設けられており、前記加熱体１１、加熱体
カバー１３及び押え板ホルダー１５には前記位置
決めピン２０用の逃げ穴１１ｄ，１３ｂ，１５ａ
がそれぞれ形成されている。 Further, a positioning pin 20 for positioning the lead frame 1 is provided to move up and down by a vertical drive mechanism (not shown), and a relief for the positioning pin 20 is provided in the heating element 11, heating element cover 13, and presser plate holder 15. Holes 11d, 13b, 15a
are formed respectively.
また図示しないが、前記押え板ホルダー１５の
側方にはXY方向に駆動される周知のボンデイン
グヘツドが配設されており、このボンデイングヘ
ツドには上下動可能にボンデイングアームが取付
けられている。このボンデイングアームの一端に
は前記ボンデイング作業窓１４ｂを通してワイヤ
ボンデイングするボンデイングツール２１が固定
されている。 Although not shown, a well-known bonding head that is driven in the X and Y directions is disposed on the side of the presser plate holder 15, and a bonding arm is attached to this bonding head so as to be movable up and down. A bonding tool 21 for performing wire bonding through the bonding work window 14b is fixed to one end of this bonding arm.
次に前記した特開昭61−8935号と異なる部分の
構造について説明する前記加熱体１１のガイド溝
１１ａはリードフレーム１のアイランドダウン部
１ａに対応した部分も加熱体１１の全長に亘つて
リードフレーム１の送り方向に連続して形成され
ている。前記加熱体１１のリードフレーム１のリ
ード部１ｃに対応した側における上面には、第３
図に示すように溝１１ｅが形成され、この溝１１
ｅには上面にリードフレーム１の一端側をガイド
するガイド溝３０ａと下方に溝３０ｂが形成され
た支え板ガイド板３０が固定されている。前記加
熱体１１の溝１１ｅの底面と前記支え板ガイド板
３０の溝３０ｂとで断面が四角状の支え板ガイド
溝３１を形成しており、この支え板ガイド溝３１
には、下方から順次支え板支持板３２と、ボール
３３を有するリテーナー３４と、支え板３５と、
ボール３６を有するリテーナー３７とが配設され
ている。前記支え板支持板３２の下面に対応した
加熱体１１の部分には、ねじ穴１１ｆが設けられ
ており、このねじ穴１１ｆにはねじ３８が螺合さ
れている。支え板支持板３２とねじ３８間にはス
プリング３９が配設され、支え板支持板３２はス
プリング３９で上方に付勢されている。そこで、
支え板３５はリテーナー３４，３７にガイドされ
て第１図において左右方向に摺動することができ
る。 Next, we will explain the structure of the part that is different from the above-mentioned Japanese Patent Application Laid-open No. 61-8935.The guide groove 11a of the heating element 11 has a lead over the entire length of the heating element 11 also in the part corresponding to the island down part 1a of the lead frame 1. It is formed continuously in the feeding direction of the frame 1. On the upper surface of the heating body 11 on the side corresponding to the lead part 1c of the lead frame 1, a third
As shown in the figure, a groove 11e is formed, and this groove 11
A supporting plate guide plate 30 having a guide groove 30a for guiding one end of the lead frame 1 on the upper surface and a groove 30b on the lower side is fixed to e. The bottom surface of the groove 11e of the heating body 11 and the groove 30b of the support plate guide plate 30 form a support plate guide groove 31 having a square cross section.
, a support plate support plate 32, a retainer 34 having balls 33, a support plate 35 in order from below,
A retainer 37 having balls 36 is provided. A screw hole 11f is provided in a portion of the heating body 11 corresponding to the lower surface of the support plate support plate 32, and a screw 38 is screwed into the screw hole 11f. A spring 39 is disposed between the support plate support plate 32 and the screw 38, and the support plate support plate 32 is urged upward by the spring 39. Therefore,
The support plate 35 is guided by the retainers 34 and 37 and can slide in the left and right directions in FIG.
前記支え板支持板３２、リテーナー３４、支え
板３５、リテーナー３７には前記位置決めピン２
０用の逃げ穴３２ａ，３４ａ，３５ａ，３７ａ，
３０ｃがそれぞれ形成されている。前記逃げ穴３
２ａの下面には位置決めピン２０に摺動自在に嵌
挿された逃げ穴カバー４０が配設され、この逃げ
穴カバー４０はスプリング４１で支え板支持板３
２に押付けられている。前記支え板３５には該支
え板３５の逃げ穴３５ａに連通するようにガス孔
３５ｂが形成され、このガス孔３５ｂには図示し
ないガス供給源より不活性ガスがガス供給パイプ
４２を通して供給されるようになつている。 The support plate support plate 32, the retainer 34, the support plate 35, and the retainer 37 are provided with the positioning pin 2.
0 escape holes 32a, 34a, 35a, 37a,
30c are formed respectively. Said escape hole 3
An escape hole cover 40 that is slidably inserted into the positioning pin 20 is disposed on the lower surface of 2a, and this escape hole cover 40 is attached to the support plate support plate 3 by a spring 41.
It is pressed to 2. A gas hole 35b is formed in the support plate 35 so as to communicate with the escape hole 35a of the support plate 35, and an inert gas is supplied to the gas hole 35b from a gas supply source (not shown) through a gas supply pipe 42. It's becoming like that.
前記支え板３５は、第１図及び第２図において
左端が上方に立上つた立上り部３５ｃが形成され
ており、この立上り部３５ｃからリードフレーム
１のリード部１ｃを支える支え部３５ｄが左側に
突出している。支え板３５の右端には縦溝３５ｅ
が形成され、この縦溝３５ｅの部分には横ピン４
５が固定されている。この横ピン４５には揺動レ
バー４６の上端に形成した縦溝４６ａが係合して
おり、前記揺動レバー４６の下端側は図示しない
揺動駆動機構で揺動させられる揺動軸４７に固定
されている。 The support plate 35 has a rising portion 35c whose left end rises upward in FIGS. 1 and 2, and a support portion 35d supporting the lead portion 1c of the lead frame 1 extends from the rising portion 35c to the left side. It stands out. A vertical groove 35e is provided at the right end of the support plate 35.
A horizontal pin 4 is formed in the vertical groove 35e.
5 is fixed. A vertical groove 46a formed at the upper end of a swing lever 46 is engaged with this horizontal pin 45, and the lower end side of the swing lever 46 is connected to a swing shaft 47 that is swung by a swing drive mechanism (not shown). Fixed.
次に作用について説明する。図示のように、リ
ードフレーム１のボンデイング部がボンデイング
作業窓１４ｂ，１６ａの真下に位置すると、位置
決めピン２０が上昇してリードフレーム１の位置
決め穴に挿入される。また揺動レバー４６が反時
計方向に回動させられて図示の状態となり、横ピ
ン４５を介して支え板３５が左方向に移動し、支
え部３５ｄがリードフレーム１のリード部１ｃの
下面に位置する。次に押え板ホルダー１５と共に
押え板１４が下降して押え部１４ａによつてリー
ドフレーム１をクランプし、この状態でボンデイ
ングツール２１によつてペレツト２とリード部１
ｃとにワイヤが接続される。この場合、リード部
１ｃは押え板１４の押え部１４ａで支え板３５の
支え部３５ｄに押付けられているので、リード部
１ｃの浮き上りがなく、リード部１ｃには信頼性
に優れたボンデイングが行える。 Next, the effect will be explained. As shown in the figure, when the bonding portion of the lead frame 1 is positioned directly below the bonding work windows 14b and 16a, the positioning pin 20 is raised and inserted into the positioning hole of the lead frame 1. Further, the swing lever 46 is rotated counterclockwise to the state shown in the figure, and the support plate 35 is moved to the left via the horizontal pin 45, so that the support portion 35d is attached to the lower surface of the lead portion 1c of the lead frame 1. To position. Next, the presser plate 14 is lowered together with the presser plate holder 15, and the lead frame 1 is clamped by the presser part 14a, and in this state, the pellet 2 and the lead part 1 are separated by the bonding tool 21.
A wire is connected to c. In this case, since the lead portion 1c is pressed against the support portion 35d of the support plate 35 by the holding portion 14a of the holding plate 14, there is no lifting of the lead portion 1c, and highly reliable bonding is performed on the lead portion 1c. I can do it.
またガス供給パイプ４２からガス孔３５ｂに供
給された不活性ガスは、支え板３５と支え板支持
板３２との隙間からボンデイング作業窓１４ｂの
部分に流れ込むと共に、逃げ穴３０ｃ、ガイド溝
３０ａ、逃げ穴１３ｂを通つて加熱体カバー１３
と押え板１４との隙間より外部に、また逃げ穴３
２ａ、位置決めピン２０と逃げ穴カバー４０との
隙間、逃げ穴１１ｄを通つて外部に流れているの
で、外部からボンデイング作業窓１４ｂの部分に
外気が侵入するのが防止される。 Further, the inert gas supplied from the gas supply pipe 42 to the gas hole 35b flows into the bonding work window 14b through the gap between the support plate 35 and the support plate support plate 32, and also flows into the bonding work window 14b through the escape hole 30c, the guide groove 30a, and the escape hole 30c. Heating element cover 13 through hole 13b
Externally through the gap between the presser plate 14 and the escape hole 3
2a, the air flows to the outside through the gap between the positioning pin 20 and the escape hole cover 40 and through the escape hole 11d, so that outside air is prevented from entering the bonding work window 14b from the outside.
前記のようにペレツト２のパツドとリードフレ
ーム１のリード部１ｃとにワイヤボンデイングが
終了した後、押え板ホルダー１５と共に押え板１
４が上昇し、また位置決めピン２０が下降する。
また同時に揺動レバー４６が時計方向に回動し、
横ピン４５を介して支え板３５が右方向に移動
し、支え部３５ｄがリードフレーム１の立上り部
１ｂより外側に位置する。次に図示しない送り機
構によりリードフレーム１は次のボンデイング部
がボンデイング作業窓１４ｂ，１６ａの真下に位
置するように送られる。以後前記した一連の動作
を経て順次ボンデイングされる。 After completing the wire bonding to the pad of the pellet 2 and the lead portion 1c of the lead frame 1 as described above, the presser plate 1 is attached together with the presser plate holder 15.
4 is raised, and the positioning pin 20 is lowered.
At the same time, the swing lever 46 rotates clockwise,
The support plate 35 moves to the right via the horizontal pin 45, and the support portion 35d is located outside the rising portion 1b of the lead frame 1. Next, the lead frame 1 is fed by a feeding mechanism (not shown) so that the next bonding section is positioned directly below the bonding work windows 14b and 16a. Thereafter, bonding is performed sequentially through the series of operations described above.
なお、上記実施例においては、ガスカバー１６
を有する場合について説明したが、ガスカバー１
６を有しない実開昭59−23734号公報に示す構造
にも適用できることはいうまでもない。また本実
施例においては、ボンデイング作業窓１４ｂの部
分にガス供給パイプ１２，４２によつて不活性ガ
スを供給する場合について説明したが、ボンデイ
ング部分を不活性ガス雰囲気にする必要がないも
のにも適用できる。また上記実施例においては押
え板１４を上下動させたが、押え板１４は固定で
加熱体１１を上下動させてもよい。 In addition, in the above embodiment, the gas cover 16
Although we have explained the case where the gas cover 1
Needless to say, the present invention can also be applied to the structure shown in Japanese Utility Model Application Laid-Open No. 59-23734, which does not have the structure shown in FIG. Furthermore, in this embodiment, a case has been described in which an inert gas is supplied to the bonding work window 14b using the gas supply pipes 12, 42, but it is also possible to supply an inert gas to the bonding work window 14b, but it is also possible to supply an inert gas to the bonding work window 14b. Applicable. Further, in the above embodiment, the presser plate 14 is moved up and down, but the presser plate 14 may be fixed and the heating body 11 is moved up and down.
［発明の効果］
以上の説明から明らかなように、本発明になる
ボンデイング装置よれば、構造が簡単でアイラン
ドダウン部を有するリードフレームにワイヤボン
デイングを施すことができる。また支え板は水平
移動して支え部がリード部の下方に挿入されるの
で、リード部と支え部との隙間を著しく少なくす
ることができ、ボンデイング時にリード部が下方
にたわむこと及び上方にあおられることが防止さ
れる。[Effects of the Invention] As is clear from the above description, the bonding apparatus according to the present invention has a simple structure and can perform wire bonding on a lead frame having an island down portion. In addition, since the support plate moves horizontally and the support part is inserted below the lead part, the gap between the lead part and the support part can be significantly reduced. This will prevent the
第１図は本発明の一実施例を示す断面図、第２
図は第１図の平面図、第３図は第１図の３−３線
断面図、第４図はリードフレームを示し、ａは平
面図、ｂは底面図である。
１……リードフレーム、１ａ……アイランドダ
ウン部、１ｂ……立上り部、１ｃ……リード部、
１１……加熱体、１１ａ……ガイド溝、１４……
押え板、３５……支え板、３５ａ……支え部。
FIG. 1 is a cross-sectional view showing one embodiment of the present invention, and FIG.
The figures are a plan view of FIG. 1, FIG. 3 is a cross-sectional view taken along the line 3--3 in FIG. 1, and FIG. 4 shows a lead frame, in which a is a plan view and b is a bottom view. 1...Lead frame, 1a...Island down part, 1b...Rising part, 1c...Lead part,
11... Heating body, 11a... Guide groove, 14...
Presser plate, 35... Support plate, 35a... Support portion.
Claims (1)
一方の側方側にリード部を有するリードフレーム
をガイドするガイド溝が上面に形成された加熱体
と、この加熱体に対して相対的に上下動可能に加
熱体の上方に配設され前記リードフレームを前記
加熱体に押付ける押え板とを備えたボンデイング
装置において、前記リードフレームの送り方向に
直角な水平方向に移動可能で、前記リードフレー
ムのリード部を支える支え部を有する支え板を設
けたことを特徴とするボンデイング装置。1. A heating element having a guide groove formed on its upper surface to guide a lead frame having a lead part on at least one side of the rising part of the island down part, and a heating element capable of moving up and down relative to the heating element. A bonding device is provided with a presser plate disposed above the body for pressing the lead frame against the heating body, the bonding device being movable in a horizontal direction perpendicular to the feed direction of the lead frame, and capable of moving the lead portion of the lead frame. A bonding device characterized by having a support plate having a support portion for supporting the device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61132711A JPS62291039A (en) | 1986-06-10 | 1986-06-10 | Bonding device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61132711A JPS62291039A (en) | 1986-06-10 | 1986-06-10 | Bonding device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62291039A JPS62291039A (en) | 1987-12-17 |
| JPH051980B2 true JPH051980B2 (en) | 1993-01-11 |
Family
ID=15087782
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61132711A Granted JPS62291039A (en) | 1986-06-10 | 1986-06-10 | Bonding device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62291039A (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0244520Y2 (en) * | 1986-08-07 | 1990-11-27 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5355966A (en) * | 1976-10-30 | 1978-05-20 | Shinkawa Seisakusho Kk | Mechanism for catching lead frames |
-
1986
- 1986-06-10 JP JP61132711A patent/JPS62291039A/en active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5355966A (en) * | 1976-10-30 | 1978-05-20 | Shinkawa Seisakusho Kk | Mechanism for catching lead frames |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62291039A (en) | 1987-12-17 |
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| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |