JPH0338949B2 - - Google Patents
Info
- Publication number
- JPH0338949B2 JPH0338949B2 JP60232108A JP23210885A JPH0338949B2 JP H0338949 B2 JPH0338949 B2 JP H0338949B2 JP 60232108 A JP60232108 A JP 60232108A JP 23210885 A JP23210885 A JP 23210885A JP H0338949 B2 JPH0338949 B2 JP H0338949B2
- Authority
- JP
- Japan
- Prior art keywords
- tool
- solder ribbon
- ribbon
- solder
- clamper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23210885A JPS6293070A (ja) | 1985-10-17 | 1985-10-17 | 半田リボン圧着方法及びその装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23210885A JPS6293070A (ja) | 1985-10-17 | 1985-10-17 | 半田リボン圧着方法及びその装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6293070A JPS6293070A (ja) | 1987-04-28 |
| JPH0338949B2 true JPH0338949B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1991-06-12 |
Family
ID=16934130
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP23210885A Granted JPS6293070A (ja) | 1985-10-17 | 1985-10-17 | 半田リボン圧着方法及びその装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6293070A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6681063B2 (ja) * | 2015-09-11 | 2020-04-15 | 株式会社アンド | 半田付け装置 |
| US20180361518A1 (en) * | 2017-06-16 | 2018-12-20 | Indium Corporation | Solder ribbon with embedded mesh for improved reliability of semiconductor die to substrate attachment |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5912130Y2 (ja) * | 1979-08-08 | 1984-04-12 | サンリツ工業株式会社 | ハンダ付け装置 |
| JPS595496U (ja) * | 1982-07-02 | 1984-01-13 | 三菱重工業株式会社 | 二重反転プロペラ装置 |
| JPS60166190A (ja) * | 1984-02-07 | 1985-08-29 | Chobe Taguchi | 熱歪変形の防止法 |
-
1985
- 1985-10-17 JP JP23210885A patent/JPS6293070A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6293070A (ja) | 1987-04-28 |