JPH0517899Y2 - - Google Patents
Info
- Publication number
- JPH0517899Y2 JPH0517899Y2 JP19029887U JP19029887U JPH0517899Y2 JP H0517899 Y2 JPH0517899 Y2 JP H0517899Y2 JP 19029887 U JP19029887 U JP 19029887U JP 19029887 U JP19029887 U JP 19029887U JP H0517899 Y2 JPH0517899 Y2 JP H0517899Y2
- Authority
- JP
- Japan
- Prior art keywords
- hic
- terminal
- fpc
- boards
- thick film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000758 substrate Substances 0.000 claims description 5
- 238000005476 soldering Methods 0.000 description 7
- 238000000034 method Methods 0.000 description 6
- 230000000694 effects Effects 0.000 description 3
- 230000003014 reinforcing effect Effects 0.000 description 3
- 239000004020 conductor Substances 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Combinations Of Printed Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title | 
|---|---|---|---|
| JP19029887U JPH0517899Y2 (en:Method) | 1987-12-15 | 1987-12-15 | 
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title | 
|---|---|---|---|
| JP19029887U JPH0517899Y2 (en:Method) | 1987-12-15 | 1987-12-15 | 
Publications (2)
| Publication Number | Publication Date | 
|---|---|
| JPH0193761U JPH0193761U (en:Method) | 1989-06-20 | 
| JPH0517899Y2 true JPH0517899Y2 (en:Method) | 1993-05-13 | 
Family
ID=31481283
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date | 
|---|---|---|---|
| JP19029887U Expired - Lifetime JPH0517899Y2 (en:Method) | 1987-12-15 | 1987-12-15 | 
Country Status (1)
| Country | Link | 
|---|---|
| JP (1) | JPH0517899Y2 (en:Method) | 
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title | 
|---|---|---|---|---|
| JP2006173394A (ja) * | 2004-12-16 | 2006-06-29 | Fujikura Ltd | プリント基板同士の接続方法 | 
- 
        1987
        - 1987-12-15 JP JP19029887U patent/JPH0517899Y2/ja not_active Expired - Lifetime
 
Also Published As
| Publication number | Publication date | 
|---|---|
| JPH0193761U (en:Method) | 1989-06-20 | 
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