JPH0517894Y2 - - Google Patents

Info

Publication number
JPH0517894Y2
JPH0517894Y2 JP1985191047U JP19104785U JPH0517894Y2 JP H0517894 Y2 JPH0517894 Y2 JP H0517894Y2 JP 1985191047 U JP1985191047 U JP 1985191047U JP 19104785 U JP19104785 U JP 19104785U JP H0517894 Y2 JPH0517894 Y2 JP H0517894Y2
Authority
JP
Japan
Prior art keywords
light emitting
substrate
light
emitting diode
wiring pattern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1985191047U
Other languages
English (en)
Japanese (ja)
Other versions
JPS62101250U (enExample
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1985191047U priority Critical patent/JPH0517894Y2/ja
Publication of JPS62101250U publication Critical patent/JPS62101250U/ja
Application granted granted Critical
Publication of JPH0517894Y2 publication Critical patent/JPH0517894Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Surface Treatment Of Optical Elements (AREA)
JP1985191047U 1985-12-13 1985-12-13 Expired - Lifetime JPH0517894Y2 (enExample)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1985191047U JPH0517894Y2 (enExample) 1985-12-13 1985-12-13

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1985191047U JPH0517894Y2 (enExample) 1985-12-13 1985-12-13

Publications (2)

Publication Number Publication Date
JPS62101250U JPS62101250U (enExample) 1987-06-27
JPH0517894Y2 true JPH0517894Y2 (enExample) 1993-05-13

Family

ID=31144827

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1985191047U Expired - Lifetime JPH0517894Y2 (enExample) 1985-12-13 1985-12-13

Country Status (1)

Country Link
JP (1) JPH0517894Y2 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7003410B2 (en) 1996-07-29 2006-02-21 Midtronics, Inc. Electronic battery tester with relative test output

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4412787B2 (ja) * 1999-06-09 2010-02-10 三洋電機株式会社 金属基板を採用した照射装置および照射モジュール
JP3939891B2 (ja) * 2000-02-21 2007-07-04 宏 二宮 面発光体の製造方法
JP4983347B2 (ja) * 2007-04-03 2012-07-25 ソニー株式会社 発光装置及び光源装置
JP5140413B2 (ja) * 2007-12-28 2013-02-06 株式会社日立製作所 実装基板、及びこの実装基板を備えるｌｅｄ光源装置
JP2010103294A (ja) * 2008-10-23 2010-05-06 Citizen Electronics Co Ltd 発光ダイオード
TW201115779A (en) * 2009-10-26 2011-05-01 Gio Optoelectronics Corp Light emitting apparatus
JP6565211B2 (ja) * 2015-02-24 2019-08-28 東洋紡株式会社 発光ダイオード素子の実装基板用白色反射フィルム、その発光ダイオード素子の実装基板用白色反射フィルム用いてなる発光ダイオード素子の実装基板並びにその発光ダイオード素子の実装基板を用いてなる照明器具

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57103482U (enExample) * 1980-12-17 1982-06-25
JPS5877071U (ja) * 1981-11-17 1983-05-24 三洋電機株式会社 発光ダイオ−ド表示器

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7003410B2 (en) 1996-07-29 2006-02-21 Midtronics, Inc. Electronic battery tester with relative test output

Also Published As

Publication number Publication date
JPS62101250U (enExample) 1987-06-27

Similar Documents

Publication Publication Date Title
EP0921568B1 (en) LED Luminaire
US7960748B2 (en) Semiconductor light emitting device and method for manufacturing the same
JPH1098215A (ja) 発光ダイオード装置
JP2013004815A (ja) 光源回路ユニットおよび照明装置、並びに表示装置
JPH05304318A (ja) 発光素子アレイ基板
KR20080083017A (ko) 도광 부재, 면광원 장치 및 표시 장치
JP2004266168A (ja) 発光体を備えた電子機器及びその製造方法
TWI607475B (zh) 背光模組及應用其之發光鍵盤
JPH0517894Y2 (enExample)
TW202014775A (zh) 光源模組及顯示裝置
CN217238564U (zh) Led基板、直下式背光模组及显示装置
US20210391515A1 (en) Light - emitter - mounted substrate and backlight
CN116895485A (zh) 发光键盘、背光模组及发光灯板
JP2001036151A (ja) 面発光装置
KR102873277B1 (ko) 발광 장치
JP4292641B2 (ja) 面発光装置
KR101198762B1 (ko) 발광 다이오드 패키지 및 그 제조방법
JPS603587Y2 (ja) 発光ダイオ−ド基板
JP6756346B2 (ja) 発光モジュールの製造方法
CN216353096U (zh) 光源模组、照明装置和显示装置
JP7057526B2 (ja) 発光モジュール
JP2558443Y2 (ja) 面照明装置
CN216852484U (zh) 一种印刷电路板的固晶层、印刷电路板以及玻璃基板
JPH0429579Y2 (enExample)
JP2002261332A (ja) 発光ダイオード