JPH0514506Y2 - - Google Patents
Info
- Publication number
- JPH0514506Y2 JPH0514506Y2 JP1001585U JP1001585U JPH0514506Y2 JP H0514506 Y2 JPH0514506 Y2 JP H0514506Y2 JP 1001585 U JP1001585 U JP 1001585U JP 1001585 U JP1001585 U JP 1001585U JP H0514506 Y2 JPH0514506 Y2 JP H0514506Y2
- Authority
- JP
- Japan
- Prior art keywords
- core tube
- furnace core
- fluid
- heat treatment
- discharge pipe
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004065 semiconductor Substances 0.000 claims description 23
- 238000010438 heat treatment Methods 0.000 claims description 20
- 239000012530 fluid Substances 0.000 claims description 19
- 238000004140 cleaning Methods 0.000 claims description 17
- 239000000126 substance Substances 0.000 claims description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 6
- 239000007789 gas Substances 0.000 description 15
- 235000012431 wafers Nutrition 0.000 description 14
- 238000000034 method Methods 0.000 description 10
- 238000001035 drying Methods 0.000 description 9
- 239000000428 dust Substances 0.000 description 8
- 230000006866 deterioration Effects 0.000 description 3
- 230000003647 oxidation Effects 0.000 description 3
- 238000007254 oxidation reaction Methods 0.000 description 3
- 238000003756 stirring Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005275 alloying Methods 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 239000012634 fragment Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000009423 ventilation Methods 0.000 description 1
Landscapes
- Cleaning In General (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1001585U JPH0514506Y2 (enExample) | 1985-01-29 | 1985-01-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1001585U JPH0514506Y2 (enExample) | 1985-01-29 | 1985-01-29 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61127630U JPS61127630U (enExample) | 1986-08-11 |
| JPH0514506Y2 true JPH0514506Y2 (enExample) | 1993-04-19 |
Family
ID=30490807
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1001585U Expired - Lifetime JPH0514506Y2 (enExample) | 1985-01-29 | 1985-01-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0514506Y2 (enExample) |
-
1985
- 1985-01-29 JP JP1001585U patent/JPH0514506Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61127630U (enExample) | 1986-08-11 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US6394110B2 (en) | Substrate processing apparatus and substrate processing method | |
| US4816081A (en) | Apparatus and process for static drying of substrates | |
| JPH05275412A (ja) | 基板の洗浄・乾燥処理方法並びにその処理装置 | |
| US6427705B1 (en) | Simplified method for cleaning silicon wafers after application of laser marks | |
| JPH0514506Y2 (enExample) | ||
| JPS62245624A (ja) | 縦型処理装置 | |
| JP3892102B2 (ja) | 基板処理方法及び同装置 | |
| JP3039494B2 (ja) | Ｗｅｔ処理槽及びその給液方法 | |
| KR100789886B1 (ko) | 기판 세정 장치 및 방법 | |
| JP2000012505A (ja) | 基板処理方法及びその装置 | |
| JPH04354128A (ja) | 基板の薬液処理方法及びその装置並びに基板の薬液処理、洗浄及び乾燥方法及びその装置 | |
| KR970023790A (ko) | 반도체 제조 장비용 석영 튜브의 세정방법 및 그 장치 | |
| JPH06333854A (ja) | 成膜装置 | |
| JPH11340176A (ja) | 浸漬型基板処理装置 | |
| JP3120782B2 (ja) | 基板処理装置 | |
| JP3017132B2 (ja) | 処理装置及び処理方法 | |
| JPH10163158A (ja) | 板状体洗浄装置 | |
| JPH1050670A (ja) | 有機物除去方法 | |
| KR0175280B1 (ko) | 수중이동식 반도체 웨이퍼의 세정장치 | |
| JPS61176113A (ja) | 半導体処理装置 | |
| JPS5892225A (ja) | ウエハ洗浄装置 | |
| KR20050063388A (ko) | 습식 스테이션의 배기장치 | |
| JPS60192327A (ja) | 半導体製造装置の洗浄方法 | |
| JPS62188324A (ja) | 水洗装置 | |
| KR200183770Y1 (ko) | 건식각장비의 질소퍼지장치 |