JPH0514422B2 - - Google Patents
Info
- Publication number
- JPH0514422B2 JPH0514422B2 JP63109876A JP10987688A JPH0514422B2 JP H0514422 B2 JPH0514422 B2 JP H0514422B2 JP 63109876 A JP63109876 A JP 63109876A JP 10987688 A JP10987688 A JP 10987688A JP H0514422 B2 JPH0514422 B2 JP H0514422B2
- Authority
- JP
- Japan
- Prior art keywords
- resin
- support plate
- slide mold
- sealing resin
- region
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000011347 resin Substances 0.000 claims description 111
- 229920005989 resin Polymers 0.000 claims description 111
- 238000007789 sealing Methods 0.000 claims description 90
- 238000000465 moulding Methods 0.000 claims description 52
- 238000004519 manufacturing process Methods 0.000 claims description 15
- 238000002347 injection Methods 0.000 claims description 14
- 239000007924 injection Substances 0.000 claims description 14
- 238000000034 method Methods 0.000 claims description 14
- 239000000565 sealant Substances 0.000 claims description 2
- 239000004065 semiconductor Substances 0.000 description 14
- 239000011800 void material Substances 0.000 description 7
- 238000001721 transfer moulding Methods 0.000 description 5
- 230000017525 heat dissipation Effects 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 239000008393 encapsulating agent Substances 0.000 description 2
- 238000005580 one pot reaction Methods 0.000 description 2
- 230000015556 catabolic process Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000003111 delayed effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63109876A JPH01281740A (ja) | 1988-05-07 | 1988-05-07 | 樹脂封止型電子部品の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63109876A JPH01281740A (ja) | 1988-05-07 | 1988-05-07 | 樹脂封止型電子部品の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01281740A JPH01281740A (ja) | 1989-11-13 |
| JPH0514422B2 true JPH0514422B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1993-02-25 |
Family
ID=14521416
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63109876A Granted JPH01281740A (ja) | 1988-05-07 | 1988-05-07 | 樹脂封止型電子部品の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01281740A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5720514B2 (ja) * | 2011-09-27 | 2015-05-20 | 三菱電機株式会社 | 半導体装置の製造方法 |
-
1988
- 1988-05-07 JP JP63109876A patent/JPH01281740A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPH01281740A (ja) | 1989-11-13 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |