JPH0110182Y2 - - Google Patents

Info

Publication number
JPH0110182Y2
JPH0110182Y2 JP2107582U JP2107582U JPH0110182Y2 JP H0110182 Y2 JPH0110182 Y2 JP H0110182Y2 JP 2107582 U JP2107582 U JP 2107582U JP 2107582 U JP2107582 U JP 2107582U JP H0110182 Y2 JPH0110182 Y2 JP H0110182Y2
Authority
JP
Japan
Prior art keywords
gate
runner
cavity
resin
group
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP2107582U
Other languages
English (en)
Japanese (ja)
Other versions
JPS58123027U (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP2107582U priority Critical patent/JPS58123027U/ja
Publication of JPS58123027U publication Critical patent/JPS58123027U/ja
Application granted granted Critical
Publication of JPH0110182Y2 publication Critical patent/JPH0110182Y2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Injection Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
JP2107582U 1982-02-16 1982-02-16 樹脂モ−ルド装置 Granted JPS58123027U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2107582U JPS58123027U (ja) 1982-02-16 1982-02-16 樹脂モ−ルド装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2107582U JPS58123027U (ja) 1982-02-16 1982-02-16 樹脂モ−ルド装置

Publications (2)

Publication Number Publication Date
JPS58123027U JPS58123027U (ja) 1983-08-22
JPH0110182Y2 true JPH0110182Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1989-03-23

Family

ID=30033209

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2107582U Granted JPS58123027U (ja) 1982-02-16 1982-02-16 樹脂モ−ルド装置

Country Status (1)

Country Link
JP (1) JPS58123027U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Also Published As

Publication number Publication date
JPS58123027U (ja) 1983-08-22

Similar Documents

Publication Publication Date Title
JPH04147814A (ja) 樹脂封入成形用金型
JP2778608B2 (ja) 樹脂モールド型半導体装置の製造方法
JP3411448B2 (ja) 半導体素子の樹脂封止金型及び半導体装置の製造方法
JP3727446B2 (ja) 半導体装置の樹脂封止成形金型
JPH0110182Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
KR100224649B1 (ko) 방사형 런너를 갖는 반도체 성형 금형
JP2598988B2 (ja) 電子部品の樹脂封止成形方法
JP2834257B2 (ja) 半導体装置の製造方法およびモールド装置
JP2609894B2 (ja) 被封止部品のトランスファ樹脂封止成形方法とこれに用いられる樹脂封止成形用金型装置及びフィルムキャリア
JPS6063122A (ja) 半導体素子の樹脂封入成形方法及びその金型装置
JP3795684B2 (ja) 電子部品の樹脂封止成形方法
JPH02114553A (ja) リードフレームおよびそれを用いた半導体装置の製造方法
JP3077632B2 (ja) 樹脂封止金型とその金型によるマトリクス型リードフレームの樹脂封止方法
JP2812327B1 (ja) 光半導体装置樹脂封止金型
JPH04196330A (ja) 半導体樹脂封止装置
JPH0221214Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JPH0521877Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JP3112227B2 (ja) 半導体装置の製造方法
JPS612348A (ja) 樹脂封止形半導体装置の製造方法
JPS5951133B2 (ja) パツケ−ジング方法
JP2654878B2 (ja) 極薄型半導体装置の製造方法
JP2575718B2 (ja) 半導体素子の樹脂封止成形方法とその成形用金型装置及びその方法に用いられるリ−ドフレ−ム
JP2966033B2 (ja) 成形装置
JP2003203935A (ja) 半導体装置の封止方法およびそれに用いる封止装置
JPS63137440A (ja) 半導体装置およびその製造方法