JPH0513385B2 - - Google Patents

Info

Publication number
JPH0513385B2
JPH0513385B2 JP60026964A JP2696485A JPH0513385B2 JP H0513385 B2 JPH0513385 B2 JP H0513385B2 JP 60026964 A JP60026964 A JP 60026964A JP 2696485 A JP2696485 A JP 2696485A JP H0513385 B2 JPH0513385 B2 JP H0513385B2
Authority
JP
Japan
Prior art keywords
groove
substrate
capacitor
insulating film
element isolation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP60026964A
Other languages
English (en)
Japanese (ja)
Other versions
JPS61187263A (ja
Inventor
Seiji Ueda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electronics Corp filed Critical Matsushita Electronics Corp
Priority to JP60026964A priority Critical patent/JPS61187263A/ja
Publication of JPS61187263A publication Critical patent/JPS61187263A/ja
Publication of JPH0513385B2 publication Critical patent/JPH0513385B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10BELECTRONIC MEMORY DEVICES
    • H10B12/00Dynamic random access memory [DRAM] devices
    • H10B12/01Manufacture or treatment
    • H10B12/02Manufacture or treatment for one transistor one-capacitor [1T-1C] memory cells
    • H10B12/03Making the capacitor or connections thereto
    • H10B12/038Making the capacitor or connections thereto the capacitor being in a trench in the substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Element Separation (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Semiconductor Memories (AREA)
JP60026964A 1985-02-14 1985-02-14 半導体装置の製造方法 Granted JPS61187263A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60026964A JPS61187263A (ja) 1985-02-14 1985-02-14 半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60026964A JPS61187263A (ja) 1985-02-14 1985-02-14 半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JPS61187263A JPS61187263A (ja) 1986-08-20
JPH0513385B2 true JPH0513385B2 (https=) 1993-02-22

Family

ID=12207838

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60026964A Granted JPS61187263A (ja) 1985-02-14 1985-02-14 半導体装置の製造方法

Country Status (1)

Country Link
JP (1) JPS61187263A (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2608054B2 (ja) * 1986-10-20 1997-05-07 三菱電機株式会社 半導体記憶装置の製造方法
US4870029A (en) * 1987-10-09 1989-09-26 American Telephone And Telegraph Company, At&T-Technologies, Inc. Method of forming complementary device structures in partially processed dielectrically isolated wafers

Also Published As

Publication number Publication date
JPS61187263A (ja) 1986-08-20

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