JPH0513100B2 - - Google Patents
Info
- Publication number
- JPH0513100B2 JPH0513100B2 JP60107447A JP10744785A JPH0513100B2 JP H0513100 B2 JPH0513100 B2 JP H0513100B2 JP 60107447 A JP60107447 A JP 60107447A JP 10744785 A JP10744785 A JP 10744785A JP H0513100 B2 JPH0513100 B2 JP H0513100B2
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- multilayer
- conductor
- green sheet
- composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000203 mixture Substances 0.000 claims description 25
- 229910018072 Al 2 O 3 Inorganic materials 0.000 claims description 7
- 229910018068 Li 2 O Inorganic materials 0.000 claims description 5
- 229910004298 SiO 2 Inorganic materials 0.000 claims description 5
- 229910006404 SnO 2 Inorganic materials 0.000 claims description 3
- 239000000758 substrate Substances 0.000 description 32
- 239000004020 conductor Substances 0.000 description 29
- 238000000034 method Methods 0.000 description 20
- 238000004519 manufacturing process Methods 0.000 description 14
- 239000000463 material Substances 0.000 description 14
- 238000007639 printing Methods 0.000 description 14
- 229910052709 silver Inorganic materials 0.000 description 12
- 239000000919 ceramic Substances 0.000 description 10
- 238000005245 sintering Methods 0.000 description 10
- 238000010304 firing Methods 0.000 description 9
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 9
- 238000005452 bending Methods 0.000 description 7
- 239000011521 glass Substances 0.000 description 7
- 238000002844 melting Methods 0.000 description 7
- 230000008018 melting Effects 0.000 description 7
- 238000010521 absorption reaction Methods 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- 229910052802 copper Inorganic materials 0.000 description 5
- 229910052737 gold Inorganic materials 0.000 description 5
- 238000003475 lamination Methods 0.000 description 5
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 4
- 150000002739 metals Chemical class 0.000 description 4
- 229910052750 molybdenum Inorganic materials 0.000 description 4
- 229910052721 tungsten Inorganic materials 0.000 description 4
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 3
- 238000001035 drying Methods 0.000 description 3
- 229910052763 palladium Inorganic materials 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 229910004116 SrO 2 Inorganic materials 0.000 description 2
- 230000002745 absorbent Effects 0.000 description 2
- 239000002250 absorbent Substances 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000002425 crystallisation Methods 0.000 description 2
- 230000008025 crystallization Effects 0.000 description 2
- DOIRQSBPFJWKBE-UHFFFAOYSA-N dibutyl phthalate Chemical compound CCCCOC(=O)C1=CC=CC=C1C(=O)OCCCC DOIRQSBPFJWKBE-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 239000002002 slurry Substances 0.000 description 2
- UOCLXMDMGBRAIB-UHFFFAOYSA-N 1,1,1-trichloroethane Chemical compound CC(Cl)(Cl)Cl UOCLXMDMGBRAIB-UHFFFAOYSA-N 0.000 description 1
- 239000000263 2,3-dihydroxypropyl (Z)-octadec-9-enoate Substances 0.000 description 1
- RZRNAYUHWVFMIP-GDCKJWNLSA-N 3-oleoyl-sn-glycerol Chemical compound CCCCCCCC\C=C/CCCCCCCC(=O)OC[C@H](O)CO RZRNAYUHWVFMIP-GDCKJWNLSA-N 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 150000004649 carbonic acid derivatives Chemical class 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000004031 devitrification Methods 0.000 description 1
- 238000004455 differential thermal analysis Methods 0.000 description 1
- 238000007606 doctor blade method Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 150000004679 hydroxides Chemical class 0.000 description 1
- 229910052500 inorganic mineral Inorganic materials 0.000 description 1
- 239000011707 mineral Substances 0.000 description 1
- RZRNAYUHWVFMIP-UHFFFAOYSA-N monoelaidin Natural products CCCCCCCCC=CCCCCCCCC(=O)OCC(O)CO RZRNAYUHWVFMIP-UHFFFAOYSA-N 0.000 description 1
- 239000005416 organic matter Substances 0.000 description 1
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 238000007372 rollout process Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
Landscapes
- Compositions Of Oxide Ceramics (AREA)
- Inorganic Insulating Materials (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60107447A JPS61266348A (ja) | 1985-05-20 | 1985-05-20 | 誘電体組成物 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60107447A JPS61266348A (ja) | 1985-05-20 | 1985-05-20 | 誘電体組成物 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61266348A JPS61266348A (ja) | 1986-11-26 |
| JPH0513100B2 true JPH0513100B2 (enrdf_load_stackoverflow) | 1993-02-19 |
Family
ID=14459381
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60107447A Granted JPS61266348A (ja) | 1985-05-20 | 1985-05-20 | 誘電体組成物 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61266348A (enrdf_load_stackoverflow) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01251688A (ja) * | 1988-03-31 | 1989-10-06 | Ngk Insulators Ltd | 配線基板 |
| JP4248165B2 (ja) * | 2001-06-27 | 2009-04-02 | 日本碍子株式会社 | 低温焼成磁器および電子部品 |
-
1985
- 1985-05-20 JP JP60107447A patent/JPS61266348A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61266348A (ja) | 1986-11-26 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH0343786B2 (enrdf_load_stackoverflow) | ||
| JPH0361359B2 (enrdf_load_stackoverflow) | ||
| JPH0992983A (ja) | セラミック多層基板の製造方法 | |
| JPH0523519B2 (enrdf_load_stackoverflow) | ||
| JPH0971472A (ja) | ガラスセラミック基板の製造方法 | |
| JPH0513100B2 (enrdf_load_stackoverflow) | ||
| JP2004256346A (ja) | ガラスセラミック組成物、ガラスセラミック焼結体とその製造方法、並びにそれを用いた配線基板とその実装構造 | |
| JPH0369196B2 (enrdf_load_stackoverflow) | ||
| JP2004256347A (ja) | ガラスセラミック組成物、ガラスセラミック焼結体とその製造方法、並びにそれを用いた配線基板とその実装構造 | |
| JPH0369197B2 (enrdf_load_stackoverflow) | ||
| JPH0226798B2 (enrdf_load_stackoverflow) | ||
| JPH068189B2 (ja) | 酸化物誘電体材料 | |
| JP3229021B2 (ja) | 回路基板 | |
| JPS61266349A (ja) | 誘電体組成物 | |
| JPS61264603A (ja) | 誘電体組成物 | |
| JPS6231904A (ja) | 誘電体組成物 | |
| JPH0426799B2 (enrdf_load_stackoverflow) | ||
| JPH07277791A (ja) | 絶縁基板用セラミック組成物およびセラミック多層配線回路板 | |
| JPH0260236B2 (enrdf_load_stackoverflow) | ||
| JPH0686327B2 (ja) | セラミツク基板用組成物 | |
| JP4166731B2 (ja) | 低温焼成基板材料及びそれを用いた多層配線基板 | |
| JPH08148783A (ja) | 銅ペーストおよび多層配線基板の製造方法 | |
| JP2005243931A (ja) | ガラスセラミック多層基板、その配線基板及びそれ等の製造方法 | |
| JPS58108792A (ja) | 多層回路板とその製造方法 | |
| JPH0428121B2 (enrdf_load_stackoverflow) |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |