JPH0512779Y2 - - Google Patents
Info
- Publication number
- JPH0512779Y2 JPH0512779Y2 JP1148687U JP1148687U JPH0512779Y2 JP H0512779 Y2 JPH0512779 Y2 JP H0512779Y2 JP 1148687 U JP1148687 U JP 1148687U JP 1148687 U JP1148687 U JP 1148687U JP H0512779 Y2 JPH0512779 Y2 JP H0512779Y2
- Authority
- JP
- Japan
- Prior art keywords
- shoot
- roof
- lead
- measurement
- push
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000005259 measurement Methods 0.000 claims description 39
- 230000006835 compression Effects 0.000 claims description 2
- 238000007906 compression Methods 0.000 claims description 2
- 230000032258 transport Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
Landscapes
- Testing Of Individual Semiconductor Devices (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1148687U JPH0512779Y2 (zh) | 1987-01-30 | 1987-01-30 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1148687U JPH0512779Y2 (zh) | 1987-01-30 | 1987-01-30 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS63120179U JPS63120179U (zh) | 1988-08-03 |
JPH0512779Y2 true JPH0512779Y2 (zh) | 1993-04-02 |
Family
ID=30798746
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1148687U Expired - Lifetime JPH0512779Y2 (zh) | 1987-01-30 | 1987-01-30 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0512779Y2 (zh) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2600392B2 (ja) * | 1989-09-22 | 1997-04-16 | 日立電子エンジニアリング株式会社 | Icデバイスのコンタクト機構 |
JP2535051Y2 (ja) * | 1990-07-11 | 1997-05-07 | 株式会社アドバンテスト | Ic搬送装置におけるic素子のicソケット接触機構 |
-
1987
- 1987-01-30 JP JP1148687U patent/JPH0512779Y2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPS63120179U (zh) | 1988-08-03 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPH01133668A (ja) | プリント基板の保持搬送方法およびその装置 | |
KR102218871B1 (ko) | 제품 테스트 소켓 | |
US4782589A (en) | Process of connecting lead frame to a semi-conductor device and a device to effect same | |
JPH0512779Y2 (zh) | ||
JP4536250B2 (ja) | 通電用クリップを用いた給放電試験装置 | |
KR100539350B1 (ko) | Ic 시험 소켓 | |
US6296504B1 (en) | Socket for electrical parts | |
JP3488700B2 (ja) | コンタクト端子の駆動方法、および、それが用いられる半導体装置用ソケット | |
JP3158418B2 (ja) | チップ型電子部品の挟持装置 | |
US5757200A (en) | Lead press mechanism for IC test handler | |
JP3469357B2 (ja) | 電子部品におけるリード端子の曲げ加工装置 | |
JPS5844797A (ja) | コンタクトを支持基板に挿入するための挿入装置 | |
JPS59632Y2 (ja) | 回路素子挾持装置 | |
JPH0843282A (ja) | 板材の折り曲げ応力測定装置 | |
JPH10239389A (ja) | 半導体装置の測定用ソケットおよび半導体装置の 測定方法 | |
JP3772526B2 (ja) | 電極挿入装置 | |
JPH0158632B2 (zh) | ||
JPS6324454Y2 (zh) | ||
JPH034939Y2 (zh) | ||
JPH06281698A (ja) | Icオートハンドラ方法 | |
JPH1151994A (ja) | 電気接続補助装置 | |
JPS60187100A (ja) | 選別装置 | |
JPS6167299A (ja) | 電子部品の打抜き収納装置 | |
JPS5896748A (ja) | 半導体装置の測定装置 | |
JPH02310477A (ja) | 部品の搬送機構 |