JPH0512779Y2 - - Google Patents

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a press mechanism for press-conducting IC leads to an IC measurement socket provided in an IC handler.

[Conventional technology] An IC handler sequentially transports a large number of ICs.
It was attached to a measurement socket for testing electrical performance, and then removed from the measurement socket.
This is an automatic device that classifies ICs according to their inspection results and transports them.

Figure 2 shows the SOP type IC using the shoot rail 1.
FIG. 2 is a partially cutaway perspective view of a state in which 2 is being transported.
_2a is the IC package, and _2b is the lead.

A shoot roof 3 is provided opposite to the top surface of the package _2a with a minute clearance therebetween.

FIG. 3 shows a cross section of the state shown in FIG. 2.

FIG. 4 shows that the SOP type IC 2 is guided in the vertical direction by the shoot rail 1 and the shoot roof 3.
FIG. 2 is a cross-sectional view schematically depicting a state in which the vehicle is slid down by its own weight.

FIG. 5 is a schematic cross-sectional view of the vicinity of the measurement socket 4. The portion of the shoot rail 1 facing the measurement socket 4 is divided from the fixed portion _1a to constitute the shoot rail movable portion _1b , and is moved in the left-right direction in the figure (that is, with respect to the measurement socket 4) by guide means (not shown). (in the direction of approaching and moving away from each other) and is elastically maintained at the position shown by a spring (not shown).

The part of the shoot roof 3 facing the measurement socket 4 is divided from the fixed part _3a to form a movable shoot roof part, which is guided in the left-right direction in the figure and elastically moved to the position shown in the figure by a spring (not shown). Retained.

A cross section along the - plane shown in FIG. 5 is shown in FIG.

The shoot rail movable portion _1b is supported in the illustrated position by a spring _1c .

The measurement socket 4 is provided with a measurement terminal _4a facing the lead _2b .

A lead pusher 5 is disposed at a position directly facing the measurement terminal _4a via the lead _2b , and is fixed to the shoot roof movable portion _3b .

When the shoot roof movable part _3b is pressed as shown by arrow P, the shoot roof movable part causes the SOP type IC to approach the measurement socket 4 while compressing the spring _1c . Then, the lead pusher 5 presses the lead 2 _b to bring it close to the measurement terminal 4 _a and bring it into electrical continuity.

The SOP type IC 2 is carried in the direction perpendicular to the plane of the paper in Fig. 6, is attached to the measurement socket 4 as described above (the lead 2 _b is electrically connected to the measurement terminal 4 _a ), and after the measurement is performed, it is carried in the direction perpendicular to the plane of the paper. It is carried out in the direction.

[Problems to be Solved by the Invention] When the lead 2 _b ′ of the SOP type IC 2 is deformed as shown in FIG. 7, the deformed lead 2 _b ′ interferes with the lead pusher 5 and is prevented from being carried.

Since the IC handler is an automatic device that operates at high speed, if one IC jams, the entire device will automatically stop.

An object of the present invention is to provide a press mechanism for an IC measurement unit that allows the lead to be carried in without any problem even if the lead is slightly deformed.

[Means for solving the problem] As can be understood from FIG. 7, which shows the problem situation in the conventional example, the deformed lead 2 _b ′
The mechanism of the present invention automatically protrudes and retracts the lead pusher 5 so as not to obstruct the loading of the IC.

As a specific configuration for applying the above-mentioned principle in practical terms, the press mechanism of the IC measurement unit according to the present invention is as follows:
A shoot rail and a shoot roof that guide an IC, and a measurement terminal that faces the leads of the IC guided by the shoot rail, and a portion of the shoot rail and shoot roof that faces the measurement terminal are connected to the measurement terminal. The invention is applied to a press mechanism of an IC measurement unit, in which the above-mentioned shoot roof is provided with a lead pusher that contacts the leads of the IC and presses them toward the measurement terminal. A plurality of through holes perpendicular to the shoot surface are provided at a portion of the measurement socket facing the measurement terminal, (b) a plurality of push rods are configured to slidably fit into the through holes, and ( c) the plurality of push rods are each fixed to a push plate to form a lead pusher having a U-shaped cross section; and (d) a compression spring is interposed between the push plate and the push roof. do.

[Function] In the above configuration, when the shoot roof movable part is pushed through the push plate, the push rod protrudes from the guide surface side of the shoot roof toward the IC lead and presses the lead against the measurement terminal. . Until the above-mentioned pushing operation is started, the tip of the push rod is retracted from the guide surface of the shoot roof, so that it does not interfere with the loading of the IC.

[Example] Next, an example of the present invention will be described with reference to FIG.

This embodiment is an improvement by applying the present invention to the conventional example shown in FIG. It is a part.

Next, the differences from the conventional example will be explained.

A through hole 3 _{b -1} is provided in the shoot roof movable part 3 b ′ at a location directly facing the measurement terminal 4 _a .

Generally, the number of leads is plural and the number of measurement terminals is also plural (more than ten to several tens), so the number of through holes 3 _b-1 is also plural.

The plurality of through holes 3 _b-1 are provided perpendicularly to the guide surface of the shoot roof, and the through holes 3 _b-1
A plurality of push rods 6 are slidably engaged with the
will be established.

The base sides of the plurality of push rods 6 are fixed to a push plate 7 and are integrally connected.
In this way, the push plate 7 and the push rod 6 form an integral member having a U-shaped cross section.

When carrying out the present invention, the push plate 7 does not necessarily have to be plate-shaped, but may just be a member that is mechanically equivalent to a plate-shaped member.

The U-shaped cross section means that the pair of push rods 6 facing each other in the width direction of the shoot roof are connected at their proximal ends so as to remain parallel to each other.

A spring 8 is compressed and interposed between the shoot roof movable part _3b ' and the push plate 7.

When the pressing force arrow P is not applied to the push plate 7, the push plate 7 is urged by the spring 8 and separated from the push roof movable part _3b ',
Along with this, the push rod 6 is retracted and retracted from the push roof guide surface as shown by the solid line. Therefore, even if the lead is distorted as shown by the imaginary line _2b ', the loading and unloading operations in the direction perpendicular to the plane of the paper are not hindered.

When the push plate 7 is pressed in the direction of arrow P, the spring 8 is deflected and the push plate 7 comes into contact with the shoot roof movable portion _3b '.

With the above operation, the push rod 6 protrudes onto the push roof guide surface (downward in the figure).
(protrudes as shown by the imaginary line) and comes into contact with lead 2 _b .

When the push plate 7 is further pressed in the direction of arrow P, the push roof movable part _3b ' bends the spring _1c and pushes the SOP type IC2 into the measurement socket 4.
As a result, the push rod 6 presses the lead _2b against the measurement terminal 4a to establish contact continuity.

When the pressing force arrow P disappears, the spring 1 _c
Then, due to the biasing force of the spring 8, it is restored to the state shown by the solid line in FIG. This allows the SOP
The IC2 can now be carried out (perpendicular to the page).

[Effects of the invention] As detailed above, when this invention is applied,
Even if the IC lead is slightly deformed, it can be carried into the IC measurement section without any problem, and can be measured and carried out.

[Brief explanation of the drawing]

FIG. 1 is a sectional view showing one embodiment of the present invention. Figure 2 is a perspective view showing how ICs are transported by the shoot roof, Figure 3 is a cross-sectional view, and Figure 4 is a cross-sectional view.
This figure is also a longitudinal sectional view, and FIG. 5 is a longitudinal sectional view of the vicinity of the measurement socket. Figure 6 is the − of Figure 5.
FIG. FIG. 7 is an explanatory diagram of a problem in the conventional example. 1... Shoot rail, 1 _a ... Same fixed part, 1 _b
...Same moving part, 2...SOP type IC, 2 _a ...Package, 2 _b ...Lead, 3...Shoot roof,
3 _a ... fixed part, 3 _b ... movable part, 4 ... measurement socket, 4 _a ... measurement terminal, 5 ... conventional lead pusher, 6 ... push rod constructed by applying the present invention, 7...Putshu plate.

Claims (1)

[Claims for Utility Model Registration] A shoot rail and a shoot roof for guiding an IC, and a measurement terminal facing the IC lead guided by the shoot rail,
and supporting a portion of the shoot rail and shoot roof that faces the measurement terminal so as to be able to approach and separate from the measurement terminal;
In the press mechanism of the IC measurement section, the above-mentioned shoot roof is provided with a lead pusher that contacts the IC lead and presses it toward the measurement terminal. a plurality of through holes are provided perpendicular to the surface; (b) a plurality of push rods are configured to slidably fit into the through holes; and (c) each of the plurality of push rods is fixed to a push plate. A press mechanism for an IC measurement unit, comprising a lead pusher having a U-shaped cross section, and (d) a compression spring interposed between the push plate and the push roof.