JPH0511664B2 - - Google Patents

Info

Publication number
JPH0511664B2
JPH0511664B2 JP62027659A JP2765987A JPH0511664B2 JP H0511664 B2 JPH0511664 B2 JP H0511664B2 JP 62027659 A JP62027659 A JP 62027659A JP 2765987 A JP2765987 A JP 2765987A JP H0511664 B2 JPH0511664 B2 JP H0511664B2
Authority
JP
Japan
Prior art keywords
bonding
ultrasonic waves
contact
wire
wire bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP62027659A
Other languages
English (en)
Japanese (ja)
Other versions
JPS63194343A (ja
Inventor
Hiroaki Kobayashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Shibaura Electric Co Ltd filed Critical Tokyo Shibaura Electric Co Ltd
Priority to JP62027659A priority Critical patent/JPS63194343A/ja
Priority to US07/150,310 priority patent/US4789095A/en
Publication of JPS63194343A publication Critical patent/JPS63194343A/ja
Publication of JPH0511664B2 publication Critical patent/JPH0511664B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004—Wire welding
    • B23K20/005—Capillary welding
    • B23K20/007—Ball bonding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/10—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating making use of vibrations, e.g. ultrasonic welding

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Wire Bonding (AREA)
JP62027659A 1987-02-09 1987-02-09 ワイヤボンディング装置の制御方法 Granted JPS63194343A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP62027659A JPS63194343A (ja) 1987-02-09 1987-02-09 ワイヤボンディング装置の制御方法
US07/150,310 US4789095A (en) 1987-02-09 1988-01-29 Method of controlling a wire bonding apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62027659A JPS63194343A (ja) 1987-02-09 1987-02-09 ワイヤボンディング装置の制御方法

Publications (2)

Publication Number Publication Date
JPS63194343A JPS63194343A (ja) 1988-08-11
JPH0511664B2 true JPH0511664B2 (enExample) 1993-02-16

Family

ID=12227059

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62027659A Granted JPS63194343A (ja) 1987-02-09 1987-02-09 ワイヤボンディング装置の制御方法

Country Status (2)

Country Link
US (1) US4789095A (enExample)
JP (1) JPS63194343A (enExample)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2506958B2 (ja) * 1988-07-22 1996-06-12 松下電器産業株式会社 ワイヤボンディング装置
GB8826488D0 (en) * 1988-11-11 1988-12-14 Emhart Deutschland Quality control for wire bonding
JP2736914B2 (ja) * 1989-03-06 1998-04-08 株式会社新川 ワイヤボンデイング方法
JPH039540A (ja) * 1989-06-07 1991-01-17 Shinkawa Ltd ワイヤボンデイング方法
US4976392A (en) * 1989-08-11 1990-12-11 Orthodyne Electronics Corporation Ultrasonic wire bonder wire formation and cutter system
JPH088285B2 (ja) * 1990-02-23 1996-01-29 株式会社東芝 ワイヤボンディング方法
JPH04247631A (ja) * 1991-02-01 1992-09-03 Mitsubishi Electric Corp ワイヤボンディング装置
JP3094374B2 (ja) * 1991-02-15 2000-10-03 株式会社新川 ワイヤボンダ用フレーム固定装置
US5225647A (en) * 1991-11-04 1993-07-06 Unitek Equipment Inc. Motorized weld head
US5386092A (en) * 1991-11-04 1995-01-31 Unitek Equipment Inc. Fast response weld head
US5230458A (en) * 1992-06-23 1993-07-27 National Semiconductor Corp. Interconnect formation utilizing real-time feedback
JP3017895B2 (ja) * 1992-12-01 2000-03-13 株式会社東芝 チップ部品マウント装置
JPH06349876A (ja) * 1993-06-11 1994-12-22 Shinkawa Ltd ワイヤボンデイング方法及び装置
US5586713A (en) * 1993-08-31 1996-12-24 Matsushita Electric Industrial Co., Ltd. Method for wire bonding
US5443200A (en) * 1993-10-13 1995-08-22 Matsushita Electric Industrial Co., Ltd. Bonding apparatus and bonding method
US5868300A (en) * 1995-06-29 1999-02-09 Orthodyne Electronics Corporation Articulated wire bonder
JP3504448B2 (ja) * 1996-10-17 2004-03-08 株式会社ルネサステクノロジ 半導体装置
US5775055A (en) * 1997-02-21 1998-07-07 Tetra Laval Holdings & Finance, S. A. Ultrasonic sealing anvil
TW486399B (en) * 2000-05-11 2002-05-11 Koninkl Philips Electronics Nv Method of operating a welding machine and a welding machine
US6299052B1 (en) * 2000-06-28 2001-10-09 American Technology, Inc. Anti-slide splice welder
DE102005044048B4 (de) * 2004-09-30 2007-05-03 Unaxis International Trading Ltd. Wire Bonder
JP5275917B2 (ja) * 2009-06-23 2013-08-28 東芝三菱電機産業システム株式会社 加圧式超音波振動接合方法および加圧式超音波振動接合装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4444349A (en) * 1981-05-04 1984-04-24 Kulicke & Soffa Industries, Inc. Wire bonding apparatus
JPS5950536A (ja) * 1982-09-16 1984-03-23 Toshiba Corp ワイヤボンデイング装置
US4597519A (en) * 1984-02-27 1986-07-01 Fairchild Camera & Instrument Corporation Lead wire bonding with increased bonding surface area
US4603802A (en) * 1984-02-27 1986-08-05 Fairchild Camera & Instrument Corporation Variation and control of bond force
US4653681A (en) * 1985-05-16 1987-03-31 Kulicke And Soffa Industries, Inc. Voice coil actuated fine wire clamp

Also Published As

Publication number Publication date
JPS63194343A (ja) 1988-08-11
US4789095A (en) 1988-12-06

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term