JPH0510388Y2 - - Google Patents
Info
- Publication number
- JPH0510388Y2 JPH0510388Y2 JP1984177052U JP17705284U JPH0510388Y2 JP H0510388 Y2 JPH0510388 Y2 JP H0510388Y2 JP 1984177052 U JP1984177052 U JP 1984177052U JP 17705284 U JP17705284 U JP 17705284U JP H0510388 Y2 JPH0510388 Y2 JP H0510388Y2
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- board
- circuit board
- wiring connector
- wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000003780 insertion Methods 0.000 claims description 9
- 230000037431 insertion Effects 0.000 claims description 9
- 239000000758 substrate Substances 0.000 description 8
- 230000000694 effects Effects 0.000 description 4
- 238000004806 packaging method and process Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 239000013039 cover film Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000012779 reinforcing material Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Combinations Of Printed Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984177052U JPH0510388Y2 (US20050065096A1-20050324-C00034.png) | 1984-11-21 | 1984-11-21 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984177052U JPH0510388Y2 (US20050065096A1-20050324-C00034.png) | 1984-11-21 | 1984-11-21 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6192089U JPS6192089U (US20050065096A1-20050324-C00034.png) | 1986-06-14 |
| JPH0510388Y2 true JPH0510388Y2 (US20050065096A1-20050324-C00034.png) | 1993-03-15 |
Family
ID=30734626
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1984177052U Expired - Lifetime JPH0510388Y2 (US20050065096A1-20050324-C00034.png) | 1984-11-21 | 1984-11-21 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0510388Y2 (US20050065096A1-20050324-C00034.png) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022138220A1 (ja) * | 2020-12-24 | 2022-06-30 | 株式会社オートネットワーク技術研究所 | 電気接続箱 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5952687B2 (ja) * | 1979-08-24 | 1984-12-21 | 住友金属工業株式会社 | 低温靭性のすぐれた調質型高張力鋼板の製造法 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5843782Y2 (ja) * | 1978-10-12 | 1983-10-04 | 株式会社東芝 | フレキシブルｐｃ板の防振装置 |
| JPS5952687U (ja) * | 1982-09-30 | 1984-04-06 | 東芝ライテック株式会社 | 電子部品の取付構造 |
-
1984
- 1984-11-21 JP JP1984177052U patent/JPH0510388Y2/ja not_active Expired - Lifetime
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5952687B2 (ja) * | 1979-08-24 | 1984-12-21 | 住友金属工業株式会社 | 低温靭性のすぐれた調質型高張力鋼板の製造法 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022138220A1 (ja) * | 2020-12-24 | 2022-06-30 | 株式会社オートネットワーク技術研究所 | 電気接続箱 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6192089U (US20050065096A1-20050324-C00034.png) | 1986-06-14 |
